PUBLISHER: KBV Research | PRODUCT CODE: 1649316
PUBLISHER: KBV Research | PRODUCT CODE: 1649316
Asia Pacific Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2, 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031
The Asia Pacific Advanced Packaging Market would witness market growth of 9.5% CAGR during the forecast period (2024-2031).
The China market dominated the Asia Pacific Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $10,123.3 million by 2031. The Japan market is expected to witness a CAGR of 8.9% during (2024 - 2031). Additionally, The India market would register a CAGR of 10.4% during (2024 - 2031).
Thermal management is of paramount importance in the design of advanced packaging solutions, given that contemporary semiconductors produce substantial heat during their operation. Effective heat dissipation is essential for ensuring the reliability and longevity of devices, particularly in high-performance applications. Advanced materials and innovative packaging designs have been developed to address this challenge, enabling manufacturers to maintain optimal thermal performance while improving overall efficiency. These innovations are particularly important in applications such as data centers, 5G infrastructure, and industrial automation, where semiconductors operate under demanding conditions.
The demand for high-performance computing (HPC) in data centers, supercomputers, and edge computing systems has driven the adoption of advanced packaging technologies. These systems require exceptional processing power and efficient heat management to handle complex workloads such as AI, climate modeling, and financial simulations. Advanced solutions like Through-Silicon Vias and 3D Integrated Circuits stack chips vertically for higher density and faster data transfer, enabling compact and efficient designs. Companies like NVIDIA and AMD leverage these technologies in GPUs and processors to enhance performance and energy efficiency. Additionally, advanced cooling methods, such as liquid cooling embedded in the packaging, ensure optimal thermal management, as seen in high-performance systems like Japan's Fugaku supercomputer.
Southeast Asia, particularly Malaysia, is strengthening its advanced packaging production capacity. While front-end fabrication remains concentrated in South Korea and Taiwan, Malaysia focuses on expanding back-end assembly operations. The country's five-year plan aims to increase the semiconductor industry's contribution to GDP by 8%, promoting investments in high-value goods and innovation in design and development. These initiatives drive demand for advanced packaging, especially in the smartphone and consumer appliance sectors, where multilayer packaging is essential for the high-quality assembly of complex architectures. Malaysia's growing packaging capabilities contribute to the Asia-Pacific region's overall strength in the advanced packaging market. Therefore, as the Asia-Pacific region continues to lead in semiconductor and electronics manufacturing, the demand for advanced packaging solutions is expected to increase significantly.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
List of Key Companies Profiled
- Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Microchip Technology Incorporated
- Infineon Technologies AG
- Samsung Electronics Co., Ltd. (Samsung Group)
- Renesas Electronics Corporation
- VMware, Inc. (Broadcom Inc.)
Asia Pacific Advanced Packaging Market Report Segmentation
By Type
- Flip-Chip Ball Grid Array
- Fan-out WLP
- Flip chip CSP
- Wafer level CSP
- 2.5D/3D
- Other Type
By End User
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Other End User
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Asia Pacific Advanced Packaging Market, by Type
- 1.4.2 Asia Pacific Advanced Packaging Market, by End User
- 1.4.3 Asia Pacific Advanced Packaging Market, by Country
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
- 2.1 Key Highlights
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.1.1 Overview
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
- 4.1 Market Share Analysis, 2023
- 4.2 Strategies Deployed in Advanced Packaging Market
- 4.3 Porter Five Forces Analysis
Chapter 5. Asia Pacific Advanced Packaging Market by Type
- 5.1 Asia Pacific Flip-Chip Ball Grid Array Market by Country
- 5.2 Asia Pacific Fan-out WLP Market by Country
- 5.3 Asia Pacific Flip chip CSP Market by Country
- 5.4 Asia Pacific Wafer level CSP Market by Country
- 5.5 Asia Pacific 2.5D/3D Market by Country
- 5.6 Asia Pacific Other Type Market by Country
Chapter 6. Asia Pacific Advanced Packaging Market by End User
- 6.1 Asia Pacific Consumer Electronics Market by Country
- 6.2 Asia Pacific Automotive Market by Country
- 6.3 Asia Pacific Industrial Market by Country
- 6.4 Asia Pacific Healthcare Market by Country
- 6.5 Asia Pacific Aerospace & Defense Market by Country
- 6.6 Asia Pacific Other End User Market by Country
Chapter 7. Asia Pacific Advanced Packaging Market by Country
- 7.1 China Advanced Packaging Market
- 7.1.1 China Advanced Packaging Market by Type
- 7.1.2 China Advanced Packaging Market by End User
- 7.2 Japan Advanced Packaging Market
- 7.2.1 Japan Advanced Packaging Market by Type
- 7.2.2 Japan Advanced Packaging Market by End User
- 7.3 India Advanced Packaging Market
- 7.3.1 India Advanced Packaging Market by Type
- 7.3.2 India Advanced Packaging Market by End User
- 7.4 South Korea Advanced Packaging Market
- 7.4.1 South Korea Advanced Packaging Market by Type
- 7.4.2 South Korea Advanced Packaging Market by End User
- 7.5 Singapore Advanced Packaging Market
- 7.5.1 Singapore Advanced Packaging Market by Type
- 7.5.2 Singapore Advanced Packaging Market by End User
- 7.6 Malaysia Advanced Packaging Market
- 7.6.1 Malaysia Advanced Packaging Market by Type
- 7.6.2 Malaysia Advanced Packaging Market by End User
- 7.7 Rest of Asia Pacific Advanced Packaging Market
- 7.7.1 Rest of Asia Pacific Advanced Packaging Market by Type
- 7.7.2 Rest of Asia Pacific Advanced Packaging Market by End User
Chapter 8. Company Profiles
- 8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Segmental and Regional Analysis
- 8.1.4 Research & Development Expense
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Product Launches and Product Expansions:
- 8.1.6 SWOT Analysis
- 8.2 Intel Corporation
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Research & Development Expenses
- 8.2.5 Recent strategies and developments:
- 8.2.5.1 Partnerships, Collaborations, and Agreements:
- 8.2.5.2 Acquisition and Mergers:
- 8.2.6 SWOT Analysis
- 8.3 IBM Corporation
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Regional & Segmental Analysis
- 8.3.4 Research & Development Expenses
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Product Launches and Product Expansions:
- 8.3.6 SWOT Analysis
- 8.4 Texas Instruments, Inc.
- 8.4.1 Company Overview
- 8.4.2 Financial Analysis
- 8.4.3 Segmental and Regional Analysis
- 8.4.4 Research & Development Expense
- 8.4.5 SWOT Analysis
- 8.5 Analog Devices, Inc.
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Regional Analysis
- 8.5.4 Research & Development Expenses
- 8.5.5 SWOT Analysis
- 8.6 Microchip Technology Incorporated
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Segmental and Regional Analysis
- 8.6.4 Research & Development Expenses
- 8.6.5 SWOT Analysis
- 8.7 Infineon Technologies AG
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.7.5 SWOT Analysis
- 8.8 Samsung Electronics Co., Ltd. (Samsung Group)
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expenses
- 8.8.5 SWOT Analysis
- 8.9 Renesas Electronics Corporation
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Segmental and Regional Analysis
- 8.9.4 Research & Development Expense
- 8.9.5 SWOT Analysis
- 8.10. VMware, Inc. (Broadcom Inc.)
- 8.10.1 Company Overview
- 8.10.2 Financial Analysis
- 8.10.3 Segmental and Regional Analysis
- 8.10.4 Research & Development Expense
- 8.10.5 SWOT Analysis
LIST OF TABLES
- TABLE 1 Asia Pacific Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 2 Asia Pacific Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 3 Asia Pacific Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 4 Asia Pacific Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 5 Asia Pacific Flip-Chip Ball Grid Array Market by Country, 2020 - 2023, USD Million
- TABLE 6 Asia Pacific Flip-Chip Ball Grid Array Market by Country, 2024 - 2031, USD Million
- TABLE 7 Asia Pacific Fan-out WLP Market by Country, 2020 - 2023, USD Million
- TABLE 8 Asia Pacific Fan-out WLP Market by Country, 2024 - 2031, USD Million
- TABLE 9 Asia Pacific Flip chip CSP Market by Country, 2020 - 2023, USD Million
- TABLE 10 Asia Pacific Flip chip CSP Market by Country, 2024 - 2031, USD Million
- TABLE 11 Asia Pacific Wafer level CSP Market by Country, 2020 - 2023, USD Million
- TABLE 12 Asia Pacific Wafer level CSP Market by Country, 2024 - 2031, USD Million
- TABLE 13 Asia Pacific 2.5D/3D Market by Country, 2020 - 2023, USD Million
- TABLE 14 Asia Pacific 2.5D/3D Market by Country, 2024 - 2031, USD Million
- TABLE 15 Asia Pacific Other Type Market by Country, 2020 - 2023, USD Million
- TABLE 16 Asia Pacific Other Type Market by Country, 2024 - 2031, USD Million
- TABLE 17 Asia Pacific Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 18 Asia Pacific Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 19 Asia Pacific Consumer Electronics Market by Country, 2020 - 2023, USD Million
- TABLE 20 Asia Pacific Consumer Electronics Market by Country, 2024 - 2031, USD Million
- TABLE 21 Asia Pacific Automotive Market by Country, 2020 - 2023, USD Million
- TABLE 22 Asia Pacific Automotive Market by Country, 2024 - 2031, USD Million
- TABLE 23 Asia Pacific Industrial Market by Country, 2020 - 2023, USD Million
- TABLE 24 Asia Pacific Industrial Market by Country, 2024 - 2031, USD Million
- TABLE 25 Asia Pacific Healthcare Market by Country, 2020 - 2023, USD Million
- TABLE 26 Asia Pacific Healthcare Market by Country, 2024 - 2031, USD Million
- TABLE 27 Asia Pacific Aerospace & Defense Market by Country, 2020 - 2023, USD Million
- TABLE 28 Asia Pacific Aerospace & Defense Market by Country, 2024 - 2031, USD Million
- TABLE 29 Asia Pacific Other End User Market by Country, 2020 - 2023, USD Million
- TABLE 30 Asia Pacific Other End User Market by Country, 2024 - 2031, USD Million
- TABLE 31 Asia Pacific Advanced Packaging Market by Country, 2020 - 2023, USD Million
- TABLE 32 Asia Pacific Advanced Packaging Market by Country, 2024 - 2031, USD Million
- TABLE 33 China Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 34 China Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 35 China Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 36 China Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 37 China Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 38 China Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 39 Japan Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 40 Japan Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 41 Japan Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 42 Japan Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 43 Japan Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 44 Japan Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 45 India Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 46 India Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 47 India Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 48 India Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 49 India Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 50 India Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 51 South Korea Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 52 South Korea Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 53 South Korea Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 54 South Korea Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 55 South Korea Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 56 South Korea Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 57 Singapore Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 58 Singapore Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 59 Singapore Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 60 Singapore Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 61 Singapore Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 62 Singapore Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 63 Malaysia Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 64 Malaysia Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 65 Malaysia Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 66 Malaysia Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 67 Malaysia Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 68 Malaysia Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 69 Rest of Asia Pacific Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 70 Rest of Asia Pacific Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 71 Rest of Asia Pacific Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 72 Rest of Asia Pacific Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 73 Rest of Asia Pacific Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 74 Rest of Asia Pacific Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 75 Key Information - Qualcomm Incorporated
- TABLE 76 Key Information - Intel Corporation
- TABLE 77 Key Information - IBM Corporation
- TABLE 78 Key Information - Texas Instruments, Inc.
- TABLE 79 key information - Analog Devices, Inc.
- TABLE 80 Key Information - Microchip Technology Incorporated
- TABLE 81 Key Information - Infineon Technologies AG
- TABLE 82 Key Information - Samsung Electronics Co., Ltd.
- TABLE 83 Key Information - Renesas Electronics Corporation
- TABLE 84 Key Information - VMware, Inc.
