PUBLISHER: KBV Research | PRODUCT CODE: 1649330
PUBLISHER: KBV Research | PRODUCT CODE: 1649330
LAMEA Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2, 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031
The Latin America, Middle East and Africa Advanced Packaging Market would witness market growth of 10.9% CAGR during the forecast period (2024-2031).
The Brazil market dominated the LAMEA Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $1,390.2 million by 2031. The Argentina market is registering a CAGR of 11.6% during (2024 - 2031). Additionally, The UAE market would witness a CAGR of 9.9% during (2024 - 2031).
Packaging technologies like Fan-Out Wafer Level Packaging and System-in-Package enhance performance by minimizing power loss and integrating multiple components in a single package. These methods are pivotal in edge computing, where compact devices require real-time processing capabilities for autonomous vehicles, smart factories, and healthcare applications. By enabling efficient heat dissipation and improved processing power, advanced packaging addresses the challenges of HPC systems and supports the growing demand for computational technologies in various industries. As the need for high-performance systems rises, these innovations will remain essential for enabling reliable and efficient computing solutions.
The expansion of augmented reality (AR) and virtual reality (VR) applications in gaming, healthcare, education, and industrial training has driven the demand for advanced packaging technologies. AR/VR devices require high-performance semiconductor solutions that are compact, energy-efficient, and capable of processing large amounts of data in real-time. Technologies like System-in-Package and Fan-Out-Wafer Level Packaging enable the integration of processors, GPUs, sensors, and memory into a single package, ensuring seamless performance and immersive user experiences. For example, gaming devices like the Meta Quest and Sony PlayStation VR rely on advanced packaging to deliver high-quality visuals and low-latency gameplay. Similarly, in healthcare, VR systems for surgical simulations and AR glasses for rehabilitation benefit from 3D Integrated Circuits and SiP, allowing for precise motion tracking and real-time feedback.
Saudi Arabia's growing automotive sector and energy transition goals drive demand for advanced packaging solutions. The government's Vision 2030 initiative, which focuses on diversifying the economy with investments in renewable energy and electric vehicles, is increasing the need for advanced packaging in applications like solar power systems and electric vehicle components. As the country transitions to green technologies, the demand for high-performance packaging solutions rises. Additionally, Saudi Arabia's efforts to establish local manufacturing hubs and form partnerships with global technology companies will support the growth of the region's advanced packaging market. This makes the region a promising area for expansion, offering lucrative growth opportunities for advanced packaging suppliers.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
List of Key Companies Profiled
- Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Microchip Technology Incorporated
- Infineon Technologies AG
- Samsung Electronics Co., Ltd. (Samsung Group)
- Renesas Electronics Corporation
- VMware, Inc. (Broadcom Inc.)
LAMEA Advanced Packaging Market Report Segmentation
By Type
- Flip-Chip Ball Grid Array
- Fan-out WLP
- Flip chip CSP
- Wafer level CSP
- 2.5D/3D
- Other Type
By End User
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Other End User
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 LAMEA Advanced Packaging Market, by Type
- 1.4.2 LAMEA Advanced Packaging Market, by End User
- 1.4.3 LAMEA Advanced Packaging Market, by Country
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
- 2.1 Key Highlights
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.1.1 Overview
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
- 4.1 Market Share Analysis, 2023
- 4.2 Strategies Deployed in Advanced Packaging Market
- 4.3 Porter Five Forces Analysis
Chapter 5. LAMEA Advanced Packaging Market by Type
- 5.1 LAMEA Flip-Chip Ball Grid Array Market by Country
- 5.2 LAMEA Fan-out WLP Market by Country
- 5.3 LAMEA Flip chip CSP Market by Country
- 5.4 LAMEA Wafer level CSP Market by Country
- 5.5 LAMEA 2.5D/3D Market by Country
- 5.6 LAMEA Other Type Market by Country
Chapter 6. LAMEA Advanced Packaging Market by End User
- 6.1 LAMEA Consumer Electronics Market by Country
- 6.2 LAMEA Automotive Market by Country
- 6.3 LAMEA Industrial Market by Country
- 6.4 LAMEA Healthcare Market by Country
- 6.5 LAMEA Aerospace & Defense Market by Country
- 6.6 LAMEA Other End User Market by Country
Chapter 7. LAMEA Advanced Packaging Market by Country
- 7.1 Brazil Advanced Packaging Market
- 7.1.1 Brazil Advanced Packaging Market by Type
- 7.1.2 Brazil Advanced Packaging Market by End User
- 7.2 Argentina Advanced Packaging Market
- 7.2.1 Argentina Advanced Packaging Market by Type
- 7.2.2 Argentina Advanced Packaging Market by End User
- 7.3 UAE Advanced Packaging Market
- 7.3.1 UAE Advanced Packaging Market by Type
- 7.3.2 UAE Advanced Packaging Market by End User
- 7.4 Saudi Arabia Advanced Packaging Market
- 7.4.1 Saudi Arabia Advanced Packaging Market by Type
- 7.4.2 Saudi Arabia Advanced Packaging Market by End User
- 7.5 South Africa Advanced Packaging Market
- 7.5.1 South Africa Advanced Packaging Market by Type
- 7.5.2 South Africa Advanced Packaging Market by End User
- 7.6 Nigeria Advanced Packaging Market
- 7.6.1 Nigeria Advanced Packaging Market by Type
- 7.6.2 Nigeria Advanced Packaging Market by End User
- 7.7 Rest of LAMEA Advanced Packaging Market
- 7.7.1 Rest of LAMEA Advanced Packaging Market by Type
- 7.7.2 Rest of LAMEA Advanced Packaging Market by End User
Chapter 8. Company Profiles
- 8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Segmental and Regional Analysis
- 8.1.4 Research & Development Expense
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Product Launches and Product Expansions:
- 8.1.6 SWOT Analysis
- 8.2 Intel Corporation
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Research & Development Expenses
- 8.2.5 Recent strategies and developments:
- 8.2.5.1 Partnerships, Collaborations, and Agreements:
- 8.2.5.2 Acquisition and Mergers:
- 8.2.6 SWOT Analysis
- 8.3 IBM Corporation
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Regional & Segmental Analysis
- 8.3.4 Research & Development Expenses
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Product Launches and Product Expansions:
- 8.3.6 SWOT Analysis
- 8.4 Texas Instruments, Inc.
- 8.4.1 Company Overview
- 8.4.2 Financial Analysis
- 8.4.3 Segmental and Regional Analysis
- 8.4.4 Research & Development Expense
- 8.4.5 SWOT Analysis
- 8.5 Analog Devices, Inc.
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Regional Analysis
- 8.5.4 Research & Development Expenses
- 8.5.5 SWOT Analysis
- 8.6 Microchip Technology Incorporated
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Segmental and Regional Analysis
- 8.6.4 Research & Development Expenses
- 8.6.5 SWOT Analysis
- 8.7 Infineon Technologies AG
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.7.5 SWOT Analysis
- 8.8 Samsung Electronics Co., Ltd. (Samsung Group)
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expenses
- 8.8.5 SWOT Analysis
- 8.9 Renesas Electronics Corporation
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Segmental and Regional Analysis
- 8.9.4 Research & Development Expense
- 8.9.5 SWOT Analysis
- 8.10. VMware, Inc. (Broadcom Inc.)
- 8.10.1 Company Overview
- 8.10.2 Financial Analysis
- 8.10.3 Segmental and Regional Analysis
- 8.10.4 Research & Development Expense
- 8.10.5 SWOT Analysis
LIST OF TABLES
- TABLE 1 LAMEA Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 2 LAMEA Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 3 LAMEA Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 4 LAMEA Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 5 LAMEA Flip-Chip Ball Grid Array Market by Country, 2020 - 2023, USD Million
- TABLE 6 LAMEA Flip-Chip Ball Grid Array Market by Country, 2024 - 2031, USD Million
- TABLE 7 LAMEA Fan-out WLP Market by Country, 2020 - 2023, USD Million
- TABLE 8 LAMEA Fan-out WLP Market by Country, 2024 - 2031, USD Million
- TABLE 9 LAMEA Flip chip CSP Market by Country, 2020 - 2023, USD Million
- TABLE 10 LAMEA Flip chip CSP Market by Country, 2024 - 2031, USD Million
- TABLE 11 LAMEA Wafer level CSP Market by Country, 2020 - 2023, USD Million
- TABLE 12 LAMEA Wafer level CSP Market by Country, 2024 - 2031, USD Million
- TABLE 13 LAMEA 2.5D/3D Market by Country, 2020 - 2023, USD Million
- TABLE 14 LAMEA 2.5D/3D Market by Country, 2024 - 2031, USD Million
- TABLE 15 LAMEA Other Type Market by Country, 2020 - 2023, USD Million
- TABLE 16 LAMEA Other Type Market by Country, 2024 - 2031, USD Million
- TABLE 17 LAMEA Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 18 LAMEA Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 19 LAMEA Consumer Electronics Market by Country, 2020 - 2023, USD Million
- TABLE 20 LAMEA Consumer Electronics Market by Country, 2024 - 2031, USD Million
- TABLE 21 LAMEA Automotive Market by Country, 2020 - 2023, USD Million
- TABLE 22 LAMEA Automotive Market by Country, 2024 - 2031, USD Million
- TABLE 23 LAMEA Industrial Market by Country, 2020 - 2023, USD Million
- TABLE 24 LAMEA Industrial Market by Country, 2024 - 2031, USD Million
- TABLE 25 LAMEA Healthcare Market by Country, 2020 - 2023, USD Million
- TABLE 26 LAMEA Healthcare Market by Country, 2024 - 2031, USD Million
- TABLE 27 LAMEA Aerospace & Defense Market by Country, 2020 - 2023, USD Million
- TABLE 28 LAMEA Aerospace & Defense Market by Country, 2024 - 2031, USD Million
- TABLE 29 LAMEA Other End User Market by Country, 2020 - 2023, USD Million
- TABLE 30 LAMEA Other End User Market by Country, 2024 - 2031, USD Million
- TABLE 31 LAMEA Advanced Packaging Market by Country, 2020 - 2023, USD Million
- TABLE 32 LAMEA Advanced Packaging Market by Country, 2024 - 2031, USD Million
- TABLE 33 Brazil Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 34 Brazil Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 35 Brazil Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 36 Brazil Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 37 Brazil Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 38 Brazil Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 39 Argentina Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 40 Argentina Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 41 Argentina Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 42 Argentina Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 43 Argentina Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 44 Argentina Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 45 UAE Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 46 UAE Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 47 UAE Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 48 UAE Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 49 UAE Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 50 UAE Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 51 Saudi Arabia Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 52 Saudi Arabia Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 53 Saudi Arabia Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 54 Saudi Arabia Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 55 Saudi Arabia Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 56 Saudi Arabia Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 57 South Africa Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 58 South Africa Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 59 South Africa Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 60 South Africa Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 61 South Africa Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 62 South Africa Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 63 Nigeria Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 64 Nigeria Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 65 Nigeria Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 66 Nigeria Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 67 Nigeria Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 68 Nigeria Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 69 Rest of LAMEA Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 70 Rest of LAMEA Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 71 Rest of LAMEA Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 72 Rest of LAMEA Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 73 Rest of LAMEA Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 74 Rest of LAMEA Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 75 Key Information - Qualcomm Incorporated
- TABLE 76 Key Information - Intel Corporation
- TABLE 77 Key Information - IBM Corporation
- TABLE 78 Key Information - Texas Instruments, Inc.
- TABLE 79 key information - Analog Devices, Inc.
- TABLE 80 Key Information - Microchip Technology Incorporated
- TABLE 81 Key Information - Infineon Technologies AG
- TABLE 82 Key Information - Samsung Electronics Co., Ltd.
- TABLE 83 Key Information - Renesas Electronics Corporation
- TABLE 84 Key Information - VMware, Inc.
