PUBLISHER: KBV Research | PRODUCT CODE: 1649328
PUBLISHER: KBV Research | PRODUCT CODE: 1649328
Europe Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2, 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031
The Europe Advanced Packaging Market would witness market growth of 8.9% CAGR during the forecast period (2024-2031).
The Germany market dominated the Europe Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $3,206.8 million by 2031. The UK market is exhibiting a CAGR of 8% during (2024 - 2031). Additionally, The France market would experience a CAGR of 10.1% during (2024 - 2031).
In consumer electronics, advanced packaging has been a game-changer, enabling the development of compact, lightweight, and multifunctional devices. Smartphones, tablets, wearables, and AR/VR devices benefit from packaging technologies that optimize performance while maintaining sleek form. As consumers demand more powerful and energy-efficient devices, manufacturers continue to invest in research and development to push the boundaries of packaging innovation. The automotive sector represents another key driver of the advanced packaging market as vehicles become increasingly connected and autonomous. Advanced Driver Assistance Systems (ADAS), electric vehicles (EVs), and in-car infotainment systems rely on high-performance semiconductors that handle complex data processing and communication tasks.
Advanced packaging technologies, such as System-in-Package and Chip-on-Chip, have become essential for enhancing energy efficiency in modern electronic devices. Integrating multiple components like processors, memory, and sensors into a single compact package reduces the distance for electrical signals, minimizing power loss and improving overall efficiency. SiP is widely used in wearables, IoT devices, and medical implants, where long battery life and compact designs are crucial. Similarly, CoC technology, which stacks chips vertically to improve data transfer efficiency, is integral to smartphones and high-performance computing systems, enabling powerful functionality with reduced energy consumption.
Italy's growing adoption of industrial automation and its focus on sustainable technologies drive demand for advanced packaging in applications like renewable energy systems and smart factories. The country's robust manufacturing base, combined with its efforts to modernize infrastructure and integrate digital technologies, ensures steady growth in advanced packaging demand across various industrial applications. These trends and strategic initiatives, like the European Chips Act, position Europe as a rapidly growing player in the advanced packaging market, aligning with its broader technological leadership and sustainability goals.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
List of Key Companies Profiled
- Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Microchip Technology Incorporated
- Infineon Technologies AG
- Samsung Electronics Co., Ltd. (Samsung Group)
- Renesas Electronics Corporation
- VMware, Inc. (Broadcom Inc.)
Europe Advanced Packaging Market Report Segmentation
By Type
- Flip-Chip Ball Grid Array
- Fan-out WLP
- Flip chip CSP
- Wafer level CSP
- 2.5D/3D
- Other Type
By End User
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Other End User
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Europe Advanced Packaging Market, by Type
- 1.4.2 Europe Advanced Packaging Market, by End User
- 1.4.3 Europe Advanced Packaging Market, by Country
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
- 2.1 Key Highlights
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.1.1 Overview
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
- 4.1 Market Share Analysis, 2023
- 4.2 Strategies Deployed in Advanced Packaging Market
- 4.3 Porter Five Forces Analysis
Chapter 5. Europe Advanced Packaging Market by Type
- 5.1 Europe Flip-Chip Ball Grid Array Market by Country
- 5.2 Europe Fan-out WLP Market by Country
- 5.3 Europe Flip chip CSP Market by Country
- 5.4 Europe Wafer level CSP Market by Country
- 5.5 Europe 2.5D/3D Market by Country
- 5.6 Europe Other Type Market by Country
Chapter 6. Europe Advanced Packaging Market by End User
- 6.1 Europe Consumer Electronics Market by Country
- 6.2 Europe Automotive Market by Country
- 6.3 Europe Industrial Market by Country
- 6.4 Europe Healthcare Market by Country
- 6.5 Europe Aerospace & Defense Market by Country
- 6.6 Europe Other End User Market by Country
Chapter 7. Europe Advanced Packaging Market by Country
- 7.1 Germany Advanced Packaging Market
- 7.1.1 Germany Advanced Packaging Market by Type
- 7.1.2 Germany Advanced Packaging Market by End User
- 7.2 UK Advanced Packaging Market
- 7.2.1 UK Advanced Packaging Market by Type
- 7.2.2 UK Advanced Packaging Market by End User
- 7.3 France Advanced Packaging Market
- 7.3.1 France Advanced Packaging Market by Type
- 7.3.2 France Advanced Packaging Market by End User
- 7.4 Russia Advanced Packaging Market
- 7.4.1 Russia Advanced Packaging Market by Type
- 7.4.2 Russia Advanced Packaging Market by End User
- 7.5 Spain Advanced Packaging Market
- 7.5.1 Spain Advanced Packaging Market by Type
- 7.5.2 Spain Advanced Packaging Market by End User
- 7.6 Italy Advanced Packaging Market
- 7.6.1 Italy Advanced Packaging Market by Type
- 7.6.2 Italy Advanced Packaging Market by End User
- 7.7 Rest of Europe Advanced Packaging Market
- 7.7.1 Rest of Europe Advanced Packaging Market by Type
- 7.7.2 Rest of Europe Advanced Packaging Market by End User
Chapter 8. Company Profiles
- 8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Segmental and Regional Analysis
- 8.1.4 Research & Development Expense
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Product Launches and Product Expansions:
- 8.1.6 SWOT Analysis
- 8.2 Intel Corporation
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Research & Development Expenses
- 8.2.5 Recent strategies and developments:
- 8.2.5.1 Partnerships, Collaborations, and Agreements:
- 8.2.5.2 Acquisition and Mergers:
- 8.2.6 SWOT Analysis
- 8.3 IBM Corporation
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Regional & Segmental Analysis
- 8.3.4 Research & Development Expenses
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Product Launches and Product Expansions:
- 8.3.6 SWOT Analysis
- 8.4 Texas Instruments, Inc.
- 8.4.1 Company Overview
- 8.4.2 Financial Analysis
- 8.4.3 Segmental and Regional Analysis
- 8.4.4 Research & Development Expense
- 8.4.5 SWOT Analysis
- 8.5 Analog Devices, Inc.
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Regional Analysis
- 8.5.4 Research & Development Expenses
- 8.5.5 SWOT Analysis
- 8.6 Microchip Technology Incorporated
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Segmental and Regional Analysis
- 8.6.4 Research & Development Expenses
- 8.6.5 SWOT Analysis
- 8.7 Infineon Technologies AG
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.7.5 SWOT Analysis
- 8.8 Samsung Electronics Co., Ltd. (Samsung Group)
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expenses
- 8.8.5 SWOT Analysis
- 8.9 Renesas Electronics Corporation
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Segmental and Regional Analysis
- 8.9.4 Research & Development Expense
- 8.9.5 SWOT Analysis
- 8.10. VMware, Inc. (Broadcom Inc.)
- 8.10.1 Company Overview
- 8.10.2 Financial Analysis
- 8.10.3 Segmental and Regional Analysis
- 8.10.4 Research & Development Expense
- 8.10.5 SWOT Analysis
LIST OF TABLES
- TABLE 1 Europe Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 2 Europe Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 3 Europe Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 4 Europe Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 5 Europe Flip-Chip Ball Grid Array Market by Country, 2020 - 2023, USD Million
- TABLE 6 Europe Flip-Chip Ball Grid Array Market by Country, 2024 - 2031, USD Million
- TABLE 7 Europe Fan-out WLP Market by Country, 2020 - 2023, USD Million
- TABLE 8 Europe Fan-out WLP Market by Country, 2024 - 2031, USD Million
- TABLE 9 Europe Flip chip CSP Market by Country, 2020 - 2023, USD Million
- TABLE 10 Europe Flip chip CSP Market by Country, 2024 - 2031, USD Million
- TABLE 11 Europe Wafer level CSP Market by Country, 2020 - 2023, USD Million
- TABLE 12 Europe Wafer level CSP Market by Country, 2024 - 2031, USD Million
- TABLE 13 Europe 2.5D/3D Market by Country, 2020 - 2023, USD Million
- TABLE 14 Europe 2.5D/3D Market by Country, 2024 - 2031, USD Million
- TABLE 15 Europe Other Type Market by Country, 2020 - 2023, USD Million
- TABLE 16 Europe Other Type Market by Country, 2024 - 2031, USD Million
- TABLE 17 Europe Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 18 Europe Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 19 Europe Consumer Electronics Market by Country, 2020 - 2023, USD Million
- TABLE 20 Europe Consumer Electronics Market by Country, 2024 - 2031, USD Million
- TABLE 21 Europe Automotive Market by Country, 2020 - 2023, USD Million
- TABLE 22 Europe Automotive Market by Country, 2024 - 2031, USD Million
- TABLE 23 Europe Industrial Market by Country, 2020 - 2023, USD Million
- TABLE 24 Europe Industrial Market by Country, 2024 - 2031, USD Million
- TABLE 25 Europe Healthcare Market by Country, 2020 - 2023, USD Million
- TABLE 26 Europe Healthcare Market by Country, 2024 - 2031, USD Million
- TABLE 27 Europe Aerospace & Defense Market by Country, 2020 - 2023, USD Million
- TABLE 28 Europe Aerospace & Defense Market by Country, 2024 - 2031, USD Million
- TABLE 29 Europe Other End User Market by Country, 2020 - 2023, USD Million
- TABLE 30 Europe Other End User Market by Country, 2024 - 2031, USD Million
- TABLE 31 Europe Advanced Packaging Market by Country, 2020 - 2023, USD Million
- TABLE 32 Europe Advanced Packaging Market by Country, 2024 - 2031, USD Million
- TABLE 33 Germany Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 34 Germany Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 35 Germany Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 36 Germany Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 37 Germany Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 38 Germany Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 39 UK Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 40 UK Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 41 UK Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 42 UK Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 43 UK Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 44 UK Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 45 France Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 46 France Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 47 France Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 48 France Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 49 France Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 50 France Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 51 Russia Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 52 Russia Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 53 Russia Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 54 Russia Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 55 Russia Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 56 Russia Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 57 Spain Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 58 Spain Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 59 Spain Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 60 Spain Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 61 Spain Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 62 Spain Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 63 Italy Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 64 Italy Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 65 Italy Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 66 Italy Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 67 Italy Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 68 Italy Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 69 Rest of Europe Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 70 Rest of Europe Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 71 Rest of Europe Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 72 Rest of Europe Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 73 Rest of Europe Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 74 Rest of Europe Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 75 Key Information - Qualcomm Incorporated
- TABLE 76 Key Information - Intel Corporation
- TABLE 77 Key Information - IBM Corporation
- TABLE 78 Key Information - Texas Instruments, Inc.
- TABLE 79 key information - Analog Devices, Inc.
- TABLE 80 Key Information - Microchip Technology Incorporated
- TABLE 81 Key Information - Infineon Technologies AG
- TABLE 82 Key Information - Samsung Electronics Co., Ltd.
- TABLE 83 Key Information - Renesas Electronics Corporation
- TABLE 84 Key Information - VMware, Inc.
