PUBLISHER: KBV Research | PRODUCT CODE: 1649313
PUBLISHER: KBV Research | PRODUCT CODE: 1649313
North America Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2, 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031
The North America Advanced Packaging Market would witness market growth of 8.4% CAGR during the forecast period (2024-2031).
The US market dominated the North America Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $13,735.8 million by 2031. The Canada market is experiencing a CAGR of 10.8% during (2024 - 2031). Additionally, The Mexico market would exhibit a CAGR of 9.8% during (2024 - 2031).
Advanced packaging refers to cutting-edge techniques and technologies used in the semiconductor industry to integrate and package electronic chips to enhance their performance, efficiency, and functionality. Unlike traditional packaging methods, which primarily focus on protecting the chips and providing electrical connections, advanced packaging is designed to meet the increasing demands for miniaturization, high-speed data transfer, low power consumption, and effective thermal management. It is crucial in enabling modern electronic devices to deliver superior performance in compact form factors.
At its core, advanced packaging involves the arrangement and interconnection of semiconductor components, such as processors, memory, and sensors, into a single package. This integration is achieved using innovative techniques like System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), and 3D Integrated Circuits (3D IC). These methods allow multiple chips or components to be combined in a compact design, enabling faster communication between components, improved energy efficiency, and enhanced reliability. Advanced packaging also facilitates heterogeneous integration, where chips of different types, functionalities, or process technologies are integrated into a single unit.
The U.S. government's strong support for domestic semiconductor manufacturing further bolsters the advanced packaging market. For example, the CHIPS for America Act funds the development of semiconductors and advanced packaging fabrication facilities nationwide, fostering innovation and production capabilities. The National Institute of Standards and Technology (NIST) also extended its funding programs through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures underscore the growing need for robust advanced packaging solutions to optimize electronic system performance and meet escalating market demands. As a result, North America remains a lucrative and rapidly growing region for the advanced packaging market throughout the forecast period.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
List of Key Companies Profiled
- Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Microchip Technology Incorporated
- Infineon Technologies AG
- Samsung Electronics Co., Ltd. (Samsung Group)
- Renesas Electronics Corporation
- VMware, Inc. (Broadcom Inc.)
North America Advanced Packaging Market Report Segmentation
By Type
- Flip-Chip Ball Grid Array
- Fan-out WLP
- Flip chip CSP
- Wafer level CSP
- 2.5D/3D
- Other Type
By End User
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Other End User
By Country
- US
- Canada
- Mexico
- Rest of North America
Table of Contents
Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 North America Advanced Packaging Market, by Type
- 1.4.2 North America Advanced Packaging Market, by End User
- 1.4.3 North America Advanced Packaging Market, by Country
- 1.5 Methodology for the research
Chapter 2. Market at a Glance
- 2.1 Key Highlights
Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.1.1 Overview
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
- 4.1 Market Share Analysis, 2023
- 4.2 Strategies Deployed in Advanced Packaging Market
- 4.3 Porter Five Forces Analysis
Chapter 5. North America Advanced Packaging Market by Type
- 5.1 North America Flip-Chip Ball Grid Array Market by Country
- 5.2 North America Fan-out WLP Market by Country
- 5.3 North America Flip chip CSP Market by Country
- 5.4 North America Wafer level CSP Market by Country
- 5.5 North America 2.5D/3D Market by Country
- 5.6 North America Other Type Market by Country
Chapter 6. North America Advanced Packaging Market by End User
- 6.1 North America Consumer Electronics Market by Country
- 6.2 North America Automotive Market by Country
- 6.3 North America Industrial Market by Country
- 6.4 North America Healthcare Market by Country
- 6.5 North America Aerospace & Defense Market by Country
- 6.6 North America Other End User Market by Country
Chapter 7. North America Advanced Packaging Market by Country
- 7.1 US Advanced Packaging Market
- 7.1.1 US Advanced Packaging Market by Type
- 7.1.2 US Advanced Packaging Market by End User
- 7.2 Canada Advanced Packaging Market
- 7.2.1 Canada Advanced Packaging Market by Type
- 7.2.2 Canada Advanced Packaging Market by End User
- 7.3 Mexico Advanced Packaging Market
- 7.3.1 Mexico Advanced Packaging Market by Type
- 7.3.2 Mexico Advanced Packaging Market by End User
- 7.4 Rest of North America Advanced Packaging Market
- 7.4.1 Rest of North America Advanced Packaging Market by Type
- 7.4.2 Rest of North America Advanced Packaging Market by End User
Chapter 8. Company Profiles
- 8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Segmental and Regional Analysis
- 8.1.4 Research & Development Expense
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Product Launches and Product Expansions:
- 8.1.6 SWOT Analysis
- 8.2 Intel Corporation
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Research & Development Expenses
- 8.2.5 Recent strategies and developments:
- 8.2.5.1 Partnerships, Collaborations, and Agreements:
- 8.2.5.2 Acquisition and Mergers:
- 8.2.6 SWOT Analysis
- 8.3 IBM Corporation
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Regional & Segmental Analysis
- 8.3.4 Research & Development Expenses
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Product Launches and Product Expansions:
- 8.3.6 SWOT Analysis
- 8.4 Texas Instruments, Inc.
- 8.4.1 Company Overview
- 8.4.2 Financial Analysis
- 8.4.3 Segmental and Regional Analysis
- 8.4.4 Research & Development Expense
- 8.4.5 SWOT Analysis
- 8.5 Analog Devices, Inc.
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Regional Analysis
- 8.5.4 Research & Development Expenses
- 8.5.5 SWOT Analysis
- 8.6 Microchip Technology Incorporated
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Segmental and Regional Analysis
- 8.6.4 Research & Development Expenses
- 8.6.5 SWOT Analysis
- 8.7 Infineon Technologies AG
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.7.5 SWOT Analysis
- 8.8 Samsung Electronics Co., Ltd. (Samsung Group)
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expenses
- 8.8.5 SWOT Analysis
- 8.9 Renesas Electronics Corporation
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Segmental and Regional Analysis
- 8.9.4 Research & Development Expense
- 8.9.5 SWOT Analysis
- 8.10. VMware, Inc. (Broadcom Inc.)
- 8.10.1 Company Overview
- 8.10.2 Financial Analysis
- 8.10.3 Segmental and Regional Analysis
- 8.10.4 Research & Development Expense
- 8.10.5 SWOT Analysis
LIST OF TABLES
- TABLE 1 North America Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 2 North America Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 3 North America Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 4 North America Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 5 North America Flip-Chip Ball Grid Array Market by Country, 2020 - 2023, USD Million
- TABLE 6 North America Flip-Chip Ball Grid Array Market by Country, 2024 - 2031, USD Million
- TABLE 7 North America Fan-out WLP Market by Country, 2020 - 2023, USD Million
- TABLE 8 North America Fan-out WLP Market by Country, 2024 - 2031, USD Million
- TABLE 9 North America Flip chip CSP Market by Country, 2020 - 2023, USD Million
- TABLE 10 North America Flip chip CSP Market by Country, 2024 - 2031, USD Million
- TABLE 11 North America Wafer level CSP Market by Country, 2020 - 2023, USD Million
- TABLE 12 North America Wafer level CSP Market by Country, 2024 - 2031, USD Million
- TABLE 13 North America 2.5D/3D Market by Country, 2020 - 2023, USD Million
- TABLE 14 North America 2.5D/3D Market by Country, 2024 - 2031, USD Million
- TABLE 15 North America Other Type Market by Country, 2020 - 2023, USD Million
- TABLE 16 North America Other Type Market by Country, 2024 - 2031, USD Million
- TABLE 17 North America Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 18 North America Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 19 North America Consumer Electronics Market by Country, 2020 - 2023, USD Million
- TABLE 20 North America Consumer Electronics Market by Country, 2024 - 2031, USD Million
- TABLE 21 North America Automotive Market by Country, 2020 - 2023, USD Million
- TABLE 22 North America Automotive Market by Country, 2024 - 2031, USD Million
- TABLE 23 North America Industrial Market by Country, 2020 - 2023, USD Million
- TABLE 24 North America Industrial Market by Country, 2024 - 2031, USD Million
- TABLE 25 North America Healthcare Market by Country, 2020 - 2023, USD Million
- TABLE 26 North America Healthcare Market by Country, 2024 - 2031, USD Million
- TABLE 27 North America Aerospace & Defense Market by Country, 2020 - 2023, USD Million
- TABLE 28 North America Aerospace & Defense Market by Country, 2024 - 2031, USD Million
- TABLE 29 North America Other End User Market by Country, 2020 - 2023, USD Million
- TABLE 30 North America Other End User Market by Country, 2024 - 2031, USD Million
- TABLE 31 North America Advanced Packaging Market by Country, 2020 - 2023, USD Million
- TABLE 32 North America Advanced Packaging Market by Country, 2024 - 2031, USD Million
- TABLE 33 US Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 34 US Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 35 US Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 36 US Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 37 US Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 38 US Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 39 Canada Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 40 Canada Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 41 Canada Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 42 Canada Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 43 Canada Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 44 Canada Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 45 Mexico Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 46 Mexico Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 47 Mexico Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 48 Mexico Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 49 Mexico Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 50 Mexico Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 51 Rest of North America Advanced Packaging Market, 2020 - 2023, USD Million
- TABLE 52 Rest of North America Advanced Packaging Market, 2024 - 2031, USD Million
- TABLE 53 Rest of North America Advanced Packaging Market by Type, 2020 - 2023, USD Million
- TABLE 54 Rest of North America Advanced Packaging Market by Type, 2024 - 2031, USD Million
- TABLE 55 Rest of North America Advanced Packaging Market by End User, 2020 - 2023, USD Million
- TABLE 56 Rest of North America Advanced Packaging Market by End User, 2024 - 2031, USD Million
- TABLE 57 Key Information - Qualcomm Incorporated
- TABLE 58 Key Information - Intel Corporation
- TABLE 59 Key Information - IBM Corporation
- TABLE 60 Key Information - Texas Instruments, Inc.
- TABLE 61 key information - Analog Devices, Inc.
- TABLE 62 Key Information - Microchip Technology Incorporated
- TABLE 63 Key Information - Infineon Technologies AG
- TABLE 64 Key Information - Samsung Electronics Co., Ltd.
- TABLE 65 Key Information - Renesas Electronics Corporation
- TABLE 66 Key Information - VMware, Inc.
