PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1577118
PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1577118
3D IC Market Forecasts to 2030 - Global Analysis By Component (Through Glass Via, Through-Silicon Via and Silicon Interposer), Type, Application, End User and By Geography
According to Stratistics MRC, the Global 3D IC Market is accounted for $19.73 billion in 2024 and is expected to reach $61.62 billion by 2030 growing at a CAGR of 20.9% during the forecast period. A 3D IC, or three-dimensional integrated circuit, is a cutting-edge technology that stacks multiple layers of semiconductor devices vertically to enhance performance and functionality. Unlike traditional 2D ICs, which are laid out on a single plane, 3D ICs utilize vertical interconnections, enabling faster data transfer and reduced signal delay. Three-dimensional integrated circuits (3D ICs) offer significant advantages in modern electronics by stacking multiple layers of active components, leading to enhanced performance and reduced footprint.
Market Dynamics:
Driver:
Growing data centers and cloud computing
As the demand for higher performance and energy efficiency escalates in data centers, 3D ICs provide a compelling solution by stacking multiple layers of silicon wafers, enabling closer proximity of components. This reduces latency and improves bandwidth, crucial for handling massive data loads efficiently. Additionally, 3D ICs allow for heterogeneous integration, where different types of chips can be combined in a single package, optimizing functionality and power usage. As cloud computing services expand, the need for scalable, high-performance computing solutions drives investment and innovation in 3D IC technology.
Restraint:
Thermal management issues
Thermal management issues significantly hinder the development and performance of 3D integrated circuits. As transistors are stacked vertically in 3D architectures, the density of components increases, leading to higher heat generation in a confined space. Effective heat dissipation becomes critical, as inadequate thermal management can result in overheating, reduced reliability and lower performance. Traditional cooling methods may not be sufficient for the compactness of 3D ICs, necessitating innovative solutions such as advanced thermal interface materials, microfluidic cooling systems, or enhanced thermal conduction techniques.
Opportunity:
Rising adoption in automotive applications
As vehicles become increasingly reliant on advanced electronics for features like autonomous driving, infotainment systems, and advanced driver-assistance systems (ADAS), the demand for compact and high-performance components grows. 3D IC technology allows for vertical stacking of multiple semiconductor layers, reducing the footprint and improving thermal management. This integration leads to faster data processing and improved power efficiency, essential for the complex computations required in modern vehicles.
Threat:
Regulatory and standardization challenges
The advancement of 3D integrated circuits (ICs) faces significant regulatory and standardization challenges that hinder their widespread adoption. As 3D IC technology incorporates multiple layers of circuitry stacked vertically, ensuring compatibility and interoperability among various components is crucial. Currently, there is a lack of universally accepted standards governing design methodologies, manufacturing processes, and testing protocols. However, this inconsistency complicates collaboration among different manufacturers and can lead to increased costs and time-to-market delays.
Covid-19 Impact:
The COVID-19 pandemic significantly impacted the 3D integrated circuit (IC) industry, highlighting both vulnerabilities and opportunities. Supply chain disruptions caused delays in the production of semiconductor materials and components, leading to increased costs and longer lead times. As manufacturers grappled with labor shortages and factory shutdowns, the urgency for advanced packaging solutions like 3D ICs became more pronounced, given their potential for enhanced performance in compact form factors. The surge in remote work and digital services during the pandemic accelerated demand for high-performance computing and data centers, which rely on advanced semiconductor technologies.
The Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period
Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period by enabling vertical interconnections between multiple semiconductor dies. This innovative approach allows for a compact design, significantly reducing the distance that signals must travel, thereby improving performance and energy efficiency. TSVs facilitate higher data transfer rates and bandwidth, crucial for applications demanding rapid communication, such as high-performance computing, graphics processing and advanced mobile devices. Additionally, the 3D stacking of chips with TSVs optimizes space, allowing for more functionality within a smaller footprint.
The Automotive segment is expected to have the highest CAGR during the forecast period
Automotive segment is expected to have the highest CAGR during the forecast period due to the growing demands for advanced electronic features, enhanced performance and miniaturization in vehicles. 3D ICs allow for multiple layers of circuitry to be stacked vertically, significantly improving space efficiency and power management. This technology facilitates the integration of various functions-such as sensing, processing and communication-within a single compact package, which is crucial for applications like advanced driver-assistance systems (ADAS), infotainment, and electric vehicle (EV) management. Moreover, 3D ICs contribute to higher bandwidth and lower latency, essential for real-time data processing and decision-making in autonomous driving systems.
Region with largest share:
North America region is anticipated to command the largest share of the market over the extrapolated period by enabling the seamless combination of memory and processing functions within a single chip. By stacking memory directly on top of logic components, manufacturers can achieve higher bandwidth and density while maintaining compact designs. As North America continues to lead in semiconductor technology development, the focus on Memory and Logic Integration will drive further advancements, fostering collaboration between tech giants and startups. This evolution not only enhances the performance of electronic devices but also positions the region at the forefront of global semiconductor innovation, ensuring it remains competitive in a rapidly advancing technological landscape.
Region with highest CAGR:
Europe region is poised to hold profitable growth during the projected period. By establishing stringent standards for safety, environmental impact, and performance, these regulations ensure that innovations in 3D IC technology align with broader sustainability goals. This not only fosters trust among consumers and industry stakeholders but also encourages investment in research and development. The emphasis on standardization enhances interoperability among devices, paving the way for more efficient manufacturing processes and reduced time-to-market for new products. As European governments also prioritize digital sovereignty, they incentivize local production and innovation in the semiconductor sector, ensuring that the region remains competitive on a global scale.
Key players in the market
Some of the key players in 3D IC market include ASE Group, Infineon Technologies, Intel Corporation, Keyence Corporation, NXP Semiconductors, Qualcomm Incorporated, Renesas Electronics, Siliconware Precision Industries, Synopsys and United Microelectronics Corporation.
Key Developments:
In November 2023, Samsung Electronics is gearing up to introduce a new advanced 3D chip packaging technology named SAINT in a bid to viral Taiwan semiconductor manufacturing company's market dominance.
In February 2023, Cadence and UMC collaborated on a hybrid bonding reference flow for 3D-ICs. UMC intends to launch hybrid bonding solutions that are suitable for edge AI, image processing, and wireless communication across a broad range of technology nodes.
In October 2022, TSMC's 3DFabricTM offerings, including the integrated fan-out (InFO), chip-on-wafer-on-substrate (TSMC-SoICTM), and system-on-integrated chips (TSMC-SoICTM), have been certified by the leading Cadence(R) IntegrityTM 3D-IC platform and have met all reference design flow criteria. Cadence supports TSMC 3DbloxTM as part of the collaboration to accelerate the development of advanced multi-die packages for 5G, artificial intelligence, mobile, and hyperscale computing.
In March 2022, Amkor Technology, a company based in South Korea teamed up with the TSMC OIP 3D Fabric. With a first chance to use TSMC's 3D Fabric tech, new partners of the 3D Fabric Alliance can move their products forward at the same time as TSMC.
Components Covered:
- Through Glass Via (TGV)
- Through-Silicon Via (TSV)
- Silicon Interposer
Types Covered:
- Monolithic 3D
- Stacked 3D
Applications Covered:
- Aerospace
- Imaging and Optoelectronics
- Sensors
- Other Applications
End Users Covered:
- Telecommunications
- Consumer Electronics
- Automotive
- Medical Devices
- Other End Users
Regions Covered:
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
- South America
- Argentina
- Brazil
- Chile
- Rest of South America
- Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
- Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
- Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
- Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
- 2.1 Abstract
- 2.2 Stake Holders
- 2.3 Research Scope
- 2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
- 2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions
3 Market Trend Analysis
- 3.1 Introduction
- 3.2 Drivers
- 3.3 Restraints
- 3.4 Opportunities
- 3.5 Threats
- 3.6 Application Analysis
- 3.7 End User Analysis
- 3.8 Emerging Markets
- 3.9 Impact of Covid-19
4 Porters Five Force Analysis
- 4.1 Bargaining power of suppliers
- 4.2 Bargaining power of buyers
- 4.3 Threat of substitutes
- 4.4 Threat of new entrants
- 4.5 Competitive rivalry
5 Global 3D IC Market, By Component
- 5.1 Introduction
- 5.2 Through Glass Via (TGV)
- 5.3 Through-Silicon Via (TSV)
- 5.4 Silicon Interposer
6 Global 3D IC Market, By Type
- 6.1 Introduction
- 6.2 Monolithic 3D
- 6.3 Stacked 3D
7 Global 3D IC Market, By Application
- 7.1 Introduction
- 7.2 Aerospace
- 7.3 Imaging and Optoelectronics
- 7.4 Sensors
- 7.5 Other Applications
8 Global 3D IC Market, By End User
- 8.1 Introduction
- 8.2 Telecommunications
- 8.3 Consumer Electronics
- 8.4 Automotive
- 8.5 Medical Devices
- 8.6 Other End Users
9 Global 3D IC Market, By Geography
- 9.1 Introduction
- 9.2 North America
- 9.2.1 US
- 9.2.2 Canada
- 9.2.3 Mexico
- 9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 Italy
- 9.3.4 France
- 9.3.5 Spain
- 9.3.6 Rest of Europe
- 9.4 Asia Pacific
- 9.4.1 Japan
- 9.4.2 China
- 9.4.3 India
- 9.4.4 Australia
- 9.4.5 New Zealand
- 9.4.6 South Korea
- 9.4.7 Rest of Asia Pacific
- 9.5 South America
- 9.5.1 Argentina
- 9.5.2 Brazil
- 9.5.3 Chile
- 9.5.4 Rest of South America
- 9.6 Middle East & Africa
- 9.6.1 Saudi Arabia
- 9.6.2 UAE
- 9.6.3 Qatar
- 9.6.4 South Africa
- 9.6.5 Rest of Middle East & Africa
10 Key Developments
- 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
- 10.2 Acquisitions & Mergers
- 10.3 New Product Launch
- 10.4 Expansions
- 10.5 Other Key Strategies
11 Company Profiling
- 11.1 ASE Group
- 11.2 Infineon Technologies
- 11.3 Intel Corporation
- 11.4 Keyence Corporation
- 11.5 NXP Semiconductors
- 11.6 Qualcomm Incorporated
- 11.7 Renesas Electronics
- 11.8 Siliconware Precision Industries
- 11.9 Synopsys
- 11.10 United Microelectronics Corporation
List of Tables
- Table 1 Global 3D IC Market Outlook, By Region (2022-2030) ($MN)
- Table 2 Global 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 3 Global 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 4 Global 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 5 Global 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 6 Global 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 7 Global 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 8 Global 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 9 Global 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 10 Global 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 11 Global 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 12 Global 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 13 Global 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 14 Global 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 15 Global 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 16 Global 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 17 Global 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 18 Global 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 19 Global 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
- Table 20 North America 3D IC Market Outlook, By Country (2022-2030) ($MN)
- Table 21 North America 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 22 North America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 23 North America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 24 North America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 25 North America 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 26 North America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 27 North America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 28 North America 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 29 North America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 30 North America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 31 North America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 32 North America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 33 North America 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 34 North America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 35 North America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 36 North America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 37 North America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 38 North America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
- Table 39 Europe 3D IC Market Outlook, By Country (2022-2030) ($MN)
- Table 40 Europe 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 41 Europe 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 42 Europe 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 43 Europe 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 44 Europe 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 45 Europe 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 46 Europe 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 47 Europe 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 48 Europe 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 49 Europe 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 50 Europe 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 51 Europe 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 52 Europe 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 53 Europe 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 54 Europe 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 55 Europe 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 56 Europe 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 57 Europe 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
- Table 58 Asia Pacific 3D IC Market Outlook, By Country (2022-2030) ($MN)
- Table 59 Asia Pacific 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 60 Asia Pacific 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 61 Asia Pacific 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 62 Asia Pacific 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 63 Asia Pacific 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 64 Asia Pacific 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 65 Asia Pacific 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 66 Asia Pacific 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 67 Asia Pacific 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 68 Asia Pacific 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 69 Asia Pacific 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 70 Asia Pacific 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 71 Asia Pacific 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 72 Asia Pacific 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 73 Asia Pacific 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 74 Asia Pacific 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 75 Asia Pacific 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 76 Asia Pacific 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
- Table 77 South America 3D IC Market Outlook, By Country (2022-2030) ($MN)
- Table 78 South America 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 79 South America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 80 South America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 81 South America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 82 South America 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 83 South America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 84 South America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 85 South America 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 86 South America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 87 South America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 88 South America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 89 South America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 90 South America 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 91 South America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 92 South America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 93 South America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 94 South America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 95 South America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
- Table 96 Middle East & Africa 3D IC Market Outlook, By Country (2022-2030) ($MN)
- Table 97 Middle East & Africa 3D IC Market Outlook, By Component (2022-2030) ($MN)
- Table 98 Middle East & Africa 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
- Table 99 Middle East & Africa 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
- Table 100 Middle East & Africa 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
- Table 101 Middle East & Africa 3D IC Market Outlook, By Type (2022-2030) ($MN)
- Table 102 Middle East & Africa 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
- Table 103 Middle East & Africa 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
- Table 104 Middle East & Africa 3D IC Market Outlook, By Application (2022-2030) ($MN)
- Table 105 Middle East & Africa 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
- Table 106 Middle East & Africa 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
- Table 107 Middle East & Africa 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
- Table 108 Middle East & Africa 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
- Table 109 Middle East & Africa 3D IC Market Outlook, By End User (2022-2030) ($MN)
- Table 110 Middle East & Africa 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
- Table 111 Middle East & Africa 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
- Table 112 Middle East & Africa 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
- Table 113 Middle East & Africa 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
- Table 114 Middle East & Africa 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
