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Semiconductor Manufacturing & Equipment

PUBLISHER: Fairfield Market Research | PRODUCT CODE: 1534508

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PUBLISHER: Fairfield Market Research | PRODUCT CODE: 1534508

3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa)

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Description

Table of Contents

The global 3D ICs market is experiencing significant growth, driven by the increasing number of portable devices and the rising need for solutions that improve performance and reduce turnaround time. The market is projected to reach $12.76 billion in 2024, growing to $23.05 billion by 2031, with a compound annual growth rate (CAGR) of 8.80%.

These integrated circuits offer enhanced functionalities, efficiency, and potential for high-density packaging, reducing signal delays and enabling faster communication on the chip. This advantage is expected to fuel the demand for 3D ICs significantly.

A 3D IC package provides faster signal transmission due to shortened logic and memory chips interconnections. Compared with other IC technologies such as system-on-a-chip or package-on-package, 3D ICs exhibit better vertical and heterogeneous integration density. These factors are likely to boost market demand.

Sales Outlook and Demand Forecast

The global 3D ICs Industry is expected to witness significant growth from 2023 to 2033. The use of advanced IC packaging systems and the integration of IoT and artificial intelligence (AI) technologies into products are becoming increasingly popular among manufacturers. Additionally, ongoing product diversification and the growing need for high-bandwidth memory (HBM) are boosting market growth.

The TSV 3D IC system, a highly advanced packaging technology, is expected to compete with existing packaging systems. Developing 2D and 3D ICs for the TSV technology through the collaborative effort of downstream, midstream, and upstream IC vendors is imperative. By providing performance and power efficiency, 3D ICs can help meet the increasing demand.

Factors Facilitating Growth in Demand for 3D ICs

The rapid growth in electronics has driven significant growth in the 3D IC market. The proliferation of smartphones and the demand for convenient, fast, and compact products have increased the popularity of 3D integrated circuits. Technological advances, the internet of things, and 5G networks are also contributing to the market's growth.

Rapid advancements in 3D packaging technology and high-speed memory chips in current mobile devices are expected to increase demand. As more outsourcing semiconductor assembly and testing (OSAT) companies enter the 3D IC market, the complexity of ICs will rise. High investment in research and development to expand the scope of innovation in the coming years will also boost the market.

The development of electric vehicles, industrial equipment, and infrastructure is likely to benefit the 3D IC market. The proliferation of smartphones, wearables, and other gadgets, along with 3D ICs, is influencing the market at a rapid pace. A significant demand in the ICT market would also increase the value of the 3D integrated circuit market.

Country-wise Insights

High Demand for 3D ICs in the United States

The United States is expected to hold a significant share of the global 3D IC market. With technological advancements, the demand for integrated circuits is expected to grow, leading to market expansion during the forecast period.

Data analytics and security systems contribute significantly to market revenues. Improved infrastructure and a growing demand for 3D integrated circuits have also contributed to the market's growth.

The high demand for electronics has prompted the need for cutting-edge technologies and semiconductor devices. Increasing remote working, operation from remote locations, and digitizing block websites are likely to increase market demand for 3D ICs.

Growth Prospects for 3D Integrated Circuits in China and Japan

China and Japan are projected to see substantial growth in the 3D IC market. Both countries have densely populated urban areas that are highly constrained in terms of space. Thus, compact and efficient electronics are in high demand. By stacking multiple layers of circuits on top of each other, 3D ICs provide a way to achieve more functionality in a smaller space, allowing small devices to perform a variety of tasks.

Competitive Analysis

Strategic partnerships between 3D IC manufacturers and other companies in the electronic industry are enhancing technological capabilities, expanding product offerings, and increasing market presence. These partnerships aim to develop innovative products and solutions, giving companies a competitive edge.

Investments in research and development are crucial for improving product performance and capabilities. Companies are launching new products to gain a competitive edge. For instance, Cadence and UMC collaborated on a hybrid bonding reference flow for 3D-ICs, and TSMC's 3DFabric offerings have been certified for the Cadence Integrity 3D-IC platform.

Key Companies Profiled

  • Mediatek
  • 3M Company
  • Advanced Semiconductor Engineering
  • Micron Technology
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • IBM
  • STMicroelectronics
  • Xilinx
  • Taiwan Semiconductor Manufacturing Company Ltd

Market Outlook by Category

By Substrate

  • Silicon on Insulator (SOI)
  • Bulk Silicon

By 3D Technology

  • Wafer Level Packaging
  • System Integration

By Application

  • Consumer Electronics
  • ICT/Telecommunication
  • Military
  • Automotive
  • Biomedical
  • Others

By Component

  • Through Silicon Vias
  • Through Glass Vias
  • Silicon Interposer
  • Others

By Product

  • Sensors
  • Memories
  • Logics
  • Light Emitting Diodes (LED)
  • Micro Electro Mechanical Systems (MEMS)

By Region

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa
Show more

Table of Contents

1. Executive Summary

  • 1.1. Global 3D ICs Market Snapshot
  • 1.2. Future Projections
  • 1.3. Key Market Trends
  • 1.4. Regional Snapshot, by Value , 2023
  • 1.5. Analyst Recommendations

2. Market Overview

  • 2.1. Market Definitions and Segmentations
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Market Opportunities
  • 2.3. Value Chain Analysis
  • 2.4. Porter's Five Forces Analysis
  • 2.5. COVID-19 Impact Analysis
    • 2.5.1. Supply
    • 2.5.2. Demand
  • 2.6. Impact of Ukraine-Russia Conflict
  • 2.7. Economic Overview
    • 2.7.1. World Economic Projections
  • 2.8. PESTLE Analysis

3. Global 3D ICs Market Outlook, 2019-2031

  • 3.1. Global 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 3.1.1. Key Highlights
      • 3.1.1.1. Sensors
      • 3.1.1.2. Memories
      • 3.1.1.3. Logics
      • 3.1.1.4. Light Emitting Diodes (LED)
      • 3.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 3.2. Global 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 3.2.1. Key Highlights
      • 3.2.1.1. Silicon on Insulator (SOI)
      • 3.2.1.2. Bulk Silicon
  • 3.3. Global 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 3.3.1. Key Highlights
      • 3.3.1.1. Wafer Level Packaging
      • 3.3.1.2. System Integration
  • 3.4. Global 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 3.4.1. Key Highlights
      • 3.4.1.1. Through Silicon Vias
      • 3.4.1.2. Through Glass Vias
      • 3.4.1.3. Silicon Interposer
      • 3.4.1.4. Others
  • 3.5. Global 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 3.5.1. Key Highlights
      • 3.5.1.1. Consumer Electronics
      • 3.5.1.2. ICT/Telecommunication
      • 3.5.1.3. Military
      • 3.5.1.4. Automotive
      • 3.5.1.5. Biomedical
      • 3.5.1.6. Others
  • 3.6. Global 3D ICs Market Outlook, by Region, Value (US$ Bn) 2019-2031
    • 3.6.1. Key Highlights
      • 3.6.1.1. North America
      • 3.6.1.2. Europe
      • 3.6.1.3. Asia Pacific
      • 3.6.1.4. Latin America
      • 3.6.1.5. Middle East & Africa

4. North America 3D ICs Market Outlook, 2019-2031

  • 4.1. North America 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 4.1.1. Key Highlights
      • 4.1.1.1. Sensors
      • 4.1.1.2. Memories
      • 4.1.1.3. Logics
      • 4.1.1.4. Light Emitting Diodes (LED)
      • 4.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 4.2. North America 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 4.2.1. Key Highlights
      • 4.2.1.1. Silicon on Insulator (SOI)
      • 4.2.1.2. Bulk Silicon
  • 4.3. North America 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 4.3.1. Key Highlights
      • 4.3.1.1. Wafer Level Packaging
      • 4.3.1.2. System Integration
  • 4.4. North America 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 4.4.1. Key Highlights
      • 4.4.1.1. Through Silicon Vias
      • 4.4.1.2. Through Glass Vias
      • 4.4.1.3. Silicon Interposer
      • 4.4.1.4. Others
  • 4.5. North America 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 4.5.1. Key Highlights
      • 4.5.1.1. Consumer Electronics
      • 4.5.1.2. ICT/Telecommunication
      • 4.5.1.3. Military
      • 4.5.1.4. Automotive
      • 4.5.1.5. Biomedical
      • 4.5.1.6. Others
  • 4.6. North America 3D ICs Market Outlook, by Country, Value (US$ Bn) 2019-2031
    • 4.6.1. Key Highlights
      • 4.6.1.1. U.S. 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 4.6.1.2. U.S. 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 4.6.1.3. U.S. 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 4.6.1.4. U.S. 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 4.6.1.5. U.S. 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 4.6.1.6. Canada 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 4.6.1.7. Canada 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 4.6.1.8. Canada 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 4.6.1.9. Canada 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 4.6.1.10. Canada 3D ICs Market by Application, Value (US$ Bn) 2019-2031

5. Europe 3D ICs Market Outlook, 2019-2031

  • 5.1. Europe 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 5.1.1. Key Highlights
      • 5.1.1.1. Sensors
      • 5.1.1.2. Memories
      • 5.1.1.3. Logics
      • 5.1.1.4. Light Emitting Diodes (LED)
      • 5.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 5.2. Europe 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 5.2.1. Key Highlights
      • 5.2.1.1. Silicon on Insulator (SOI)
      • 5.2.1.2. Bulk Silicon
  • 5.3. Europe 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 5.3.1. Key Highlights
      • 5.3.1.1. Wafer Level Packaging
      • 5.3.1.2. System Integration
  • 5.4. Europe 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 5.4.1. Key Highlights
      • 5.4.1.1. Through Silicon Vias
      • 5.4.1.2. Through Glass Vias
      • 5.4.1.3. Silicon Interposer
      • 5.4.1.4. Others
  • 5.5. Europe 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 5.5.1. Key Highlights
      • 5.5.1.1. Consumer Electronics
      • 5.5.1.2. ICT/Telecommunication
      • 5.5.1.3. Military
      • 5.5.1.4. Automotive
      • 5.5.1.5. Biomedical
      • 5.5.1.6. Others
  • 5.6. Europe 3D ICs Market Outlook, by Country, Value (US$ Bn) 2019-2031
    • 5.6.1. Key Highlights
      • 5.6.1.1. Germany 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.2. Germany 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.3. Germany 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.4. Germany 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.5. Germany 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.6. U.K. 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.7. U.K. 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.8. U.K. 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.9. U.K. 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.10. U.K. 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.11. France 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.12. France 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.13. France 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.14. France 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.15. France 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.16. Italy 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.17. Italy 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.18. Italy 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.19. Italy 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.20. Italy 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.21. Turkey 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.22. Turkey 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.23. Turkey 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.24. Turkey 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.25. Turkey 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.26. Russia 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.27. Russia 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.28. Russia 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.29. Russia 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.30. Russia 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 5.6.1.31. Rest of Europe 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 5.6.1.32. Rest of Europe 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 5.6.1.33. Rest of Europe 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 5.6.1.34. Rest of Europe 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 5.6.1.35. Rest of Europe 3D ICs Market by Application, Value (US$ Bn) 2019-2031

6. Asia Pacific 3D ICs Market Outlook, 2019-2031

  • 6.1. Asia Pacific 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 6.1.1. Key Highlights
      • 6.1.1.1. Sensors
      • 6.1.1.2. Memories
      • 6.1.1.3. Logics
      • 6.1.1.4. Light Emitting Diodes (LED)
      • 6.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 6.2. Asia Pacific 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 6.2.1. Key Highlights
      • 6.2.1.1. Silicon on Insulator (SOI)
      • 6.2.1.2. Bulk Silicon
  • 6.3. Asia Pacific 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 6.3.1. Key Highlights
      • 6.3.1.1. Wafer Level Packaging
      • 6.3.1.2. System Integration
  • 6.4. Asia Pacific 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 6.4.1. Key Highlights
      • 6.4.1.1. Through Silicon Vias
      • 6.4.1.2. Through Glass Vias
      • 6.4.1.3. Silicon Interposer
      • 6.4.1.4. Others
  • 6.5. Asia Pacific 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 6.5.1. Key Highlights
      • 6.5.1.1. Consumer Electronics
      • 6.5.1.2. ICT/Telecommunication
      • 6.5.1.3. Military
      • 6.5.1.4. Automotive
      • 6.5.1.5. Biomedical
      • 6.5.1.6. Others
  • 6.6. Asia Pacific 3D ICs Market Outlook, by Country, Value (US$ Bn) 2019-2031
    • 6.6.1. Key Highlights
      • 6.6.1.1. China 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.2. China 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.3. China 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.4. China 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.5. China 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 6.6.1.6. Japan 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.7. Japan 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.8. Japan 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.9. Japan 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.10. Japan 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 6.6.1.11. South Korea 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.12. South Korea 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.13. South Korea 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.14. South Korea 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.15. South Korea 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 6.6.1.16. India 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.17. India 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.18. India 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.19. India 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.20. India 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 6.6.1.21. Southeast Asia 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.22. Southeast Asia 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.23. Southeast Asia 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.24. Southeast Asia 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.25. Southeast Asia 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 6.6.1.26. Rest of Asia Pacific 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 6.6.1.27. Rest of Asia Pacific 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 6.6.1.28. Rest of Asia Pacific 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 6.6.1.29. Rest of Asia Pacific 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 6.6.1.30. Rest of Asia Pacific 3D ICs Market by Application, Value (US$ Bn) 2019-2031

7. Latin America 3D ICs Market Outlook, 2019-2031

  • 7.1. Latin America 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 7.1.1. Key Highlights
      • 7.1.1.1. Sensors
      • 7.1.1.2. Memories
      • 7.1.1.3. Logics
      • 7.1.1.4. Light Emitting Diodes (LED)
      • 7.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 7.2. Latin America 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 7.2.1. Key Highlights
      • 7.2.1.1. Silicon on Insulator (SOI)
      • 7.2.1.2. Bulk Silicon
  • 7.3. Latin America 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 7.3.1. Key Highlights
      • 7.3.1.1. Wafer Level Packaging
      • 7.3.1.2. System Integration
  • 7.4. Latin America 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 7.4.1. Key Highlights
      • 7.4.1.1. Through Silicon Vias
      • 7.4.1.2. Through Glass Vias
      • 7.4.1.3. Silicon Interposer
      • 7.4.1.4. Others
  • 7.5. Latin America 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 7.5.1. Key Highlights
      • 7.5.1.1. Consumer Electronics
      • 7.5.1.2. ICT/Telecommunication
      • 7.5.1.3. Military
      • 7.5.1.4. Automotive
      • 7.5.1.5. Biomedical
      • 7.5.1.6. Others
  • 7.6. Latin America 3D ICs Market Outlook, by Country, Value (US$ Bn) 2019-2031
    • 7.6.1. Key Highlights
      • 7.6.1.1. Brazil 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 7.6.1.2. Brazil 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 7.6.1.3. Brazil 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 7.6.1.4. Brazil 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 7.6.1.5. Brazil 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 7.6.1.6. Mexico 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 7.6.1.7. Mexico 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 7.6.1.8. Mexico 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 7.6.1.9. Mexico 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 7.6.1.10. Mexico 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 7.6.1.11. Argentina 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 7.6.1.12. Argentina 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 7.6.1.13. Argentina 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 7.6.1.14. Argentina 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 7.6.1.15. Argentina 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 7.6.1.16. Rest of Latin America 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 7.6.1.17. Rest of Latin America 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 7.6.1.18. Rest of Latin America 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 7.6.1.19. Rest of Latin America 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 7.6.1.20. Rest of Latin America 3D ICs Market by Application, Value (US$ Bn) 2019-2031

8. Middle East & Africa 3D ICs Market Outlook, 2019-2031

  • 8.1. Middle East & Africa 3D ICs Market Outlook, by Product Type, Value (US$ Bn) 2019-2031
    • 8.1.1. Key Highlights
      • 8.1.1.1. Sensors
      • 8.1.1.2. Memories
      • 8.1.1.3. Logics
      • 8.1.1.4. Light Emitting Diodes (LED)
      • 8.1.1.5. Micro Electro Mechanical Systems (MEMS)
  • 8.2. Middle East & Africa 3D ICs Market Outlook, by Substrate, Value (US$ Bn) 2019-2031
    • 8.2.1. Key Highlights
      • 8.2.1.1. Silicon on Insulator (SOI)
      • 8.2.1.2. Bulk Silicon
  • 8.3. Middle East & Africa 3D ICs Market Outlook, by 3D Technology, Value (US$ Bn) 2019-2031
    • 8.3.1. Key Highlights
      • 8.3.1.1. Wafer Level Packaging
      • 8.3.1.2. System Integration
  • 8.4. Middle East & Africa 3D ICs Market Outlook, by Component, Value (US$ Bn) 2019-2031
    • 8.4.1. Key Highlights
      • 8.4.1.1. Through Silicon Vias
      • 8.4.1.2. Through Glass Vias
      • 8.4.1.3. Silicon Interposer
      • 8.4.1.4. Others
  • 8.5. Middle East & Africa 3D ICs Market Outlook, by Application, Value (US$ Bn) 2019-2031
    • 8.5.1. Key Highlights
      • 8.5.1.1. Consumer Electronics
      • 8.5.1.2. ICT/Telecommunication
      • 8.5.1.3. Military
      • 8.5.1.4. Automotive
      • 8.5.1.5. Biomedical
      • 8.5.1.6. Others
  • 8.6. Middle East & Africa 3D ICs Market Outlook, by Country, Value (US$ Bn) 2019-2031
    • 8.6.1. Key Highlights
      • 8.6.1.1. GCC 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 8.6.1.2. GCC 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 8.6.1.3. GCC 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 8.6.1.4. GCC 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 8.6.1.5. GCC 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 8.6.1.6. South Africa 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 8.6.1.7. South Africa 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 8.6.1.8. South Africa 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 8.6.1.9. South Africa 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 8.6.1.10. South Africa 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 8.6.1.11. Egypt 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 8.6.1.12. Egypt 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 8.6.1.13. Egypt 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 8.6.1.14. Egypt 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 8.6.1.15. Egypt 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 8.6.1.16. Nigeria 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 8.6.1.17. Nigeria 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 8.6.1.18. Nigeria 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 8.6.1.19. Nigeria 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 8.6.1.20. Nigeria 3D ICs Market by Application, Value (US$ Bn) 2019-2031
      • 8.6.1.21. Rest of Middle East & Africa 3D ICs Market by Product Type, Value (US$ Bn) 2019-2031
      • 8.6.1.22. Rest of Middle East & Africa 3D ICs Market by Substrate, Value (US$ Bn) 2019-2031
      • 8.6.1.23. Rest of Middle East & Africa 3D ICs Market by 3D Technology, Value (US$ Bn) 2019-2031
      • 8.6.1.24. Rest of Middle East & Africa 3D ICs Market by Component, Value (US$ Bn) 2019-2031
      • 8.6.1.25. Rest of Middle East & Africa 3D ICs Market by Application, Value (US$ Bn) 2019-2031

9. Competitive Landscape

  • 9.1. Product vs Application Heatmap
  • 9.2. Company Market Share Analysis, 2023
  • 9.3. Competitive Dashboard
  • 9.4. Company Profiles
    • 9.4.1. 3M Company
      • 9.4.1.1. Company Overview
      • 9.4.1.2. Product Portfolio
      • 9.4.1.3. Financial Overview
      • 9.4.1.4. Business Strategies and Development
    • 9.4.2. Advanced Semiconductor Engineering
      • 9.4.2.1. Company Overview
      • 9.4.2.2. Product Portfolio
      • 9.4.2.3. Financial Overview
      • 9.4.2.4. Business Strategies and Development
    • 9.4.3. Micron Technology
      • 9.4.3.1. Company Overview
      • 9.4.3.2. Product Portfolio
      • 9.4.3.3. Financial Overview
      • 9.4.3.4. Business Strategies and Development
    • 9.4.4. ST Microelectronics
      • 9.4.4.1. Company Overview
      • 9.4.4.2. Product Portfolio
      • 9.4.4.3. Financial Overview
      • 9.4.4.4. Business Strategies and Development
    • 9.4.5. STATS ChipPAC
      • 9.4.5.1. Company Overview
      • 9.4.5.2. Product Portfolio
      • 9.4.5.3. Financial Overview
      • 9.4.5.4. Business Strategies and Development
    • 9.4.6. Taiwan Semiconductor Manufacturing
      • 9.4.6.1. Company Overview
      • 9.4.6.2. Product Portfolio
      • 9.4.6.3. Financial Overview
      • 9.4.6.4. Business Strategies and Development
    • 9.4.7. Samsung Electronics
      • 9.4.7.1. Company Overview
      • 9.4.7.2. Product Portfolio
      • 9.4.7.3. Financial Overview
      • 9.4.7.4. Business Strategies and Development
    • 9.4.8. IBM
      • 9.4.8.1. Company Overview
      • 9.4.8.2. Product Portfolio
      • 9.4.8.3. Financial Overview
      • 9.4.8.4. Business Strategies and Development
    • 9.4.9. STMicroelectronics
      • 9.4.9.1. Company Overview
      • 9.4.9.2. Product Portfolio
      • 9.4.9.3. Financial Overview
      • 9.4.9.4. Business Strategies and Development
    • 9.4.10. Xilinx
      • 9.4.10.1. Company Overview
      • 9.4.10.2. Product Portfolio
      • 9.4.10.3. Financial Overview
      • 9.4.10.4. Business Strategies and Development
    • 9.4.11. Taiwan Semiconductor Manufacturing Company, Ltd
      • 9.4.11.1. Company Overview
      • 9.4.11.2. Product Portfolio
      • 9.4.11.3. Financial Overview
      • 9.4.11.4. Business Strategies and Development

10. Appendix

  • 10.1. Research Methodology
  • 10.2. Report Assumptions
  • 10.3. Acronyms and Abbreviations
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