Japan Semiconductor Manufacturing Equipment Market Report by Equipment Type, Product Type, Dimension, Supply Chain Participant, and Region 2024-2032

Description

Japan semiconductor manufacturing equipment market size reached US$ 5.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 13.3 Billion by 2032, exhibiting a growth rate (CAGR) of 9.50% during 2024-2032. The rising popularity of device miniaturization, along with the widespread adoption of connected devices, is primarily driving the market growth.

Semiconductor manufacturing equipment encompass the machinery employed in the production of a wide range of electronic components and integrated circuits (ICs). Among the commonly utilized devices are the front-end and back-end equipment. In addition to this, the front-end category comprises machines used in silicon-wafer fabrication, photolithography, deposition, etching, ion implantation, and mechanical polishing. In contrast, the back-end category involves machinery used in the assembly, packaging, and testing of integrated circuits. These machines offer numerous advantages, including streamlined production processes, enhanced yield and reliability, reduction in design and manufacturing errors, and improved workplace safety. Consequently, they have found widespread applications in the manufacturing of various products across industries such as automotive, electronics, robotics, etc.

Japan Semiconductor Manufacturing Equipment Market Trends:

The Japan market for semiconductor manufacturing equipment is primarily being propelled by the burgeoning electronics sector, given the widespread use of semiconductors in consumer electronics like smartphones, tablets, and laptops. Furthermore, the increasing demand for hybrid and electric vehicles (H/EVs) stands as another significant driver of growth. Besides this, these manufacturing equipment is instrumental in the assembly of multiple semiconductors onto a single chip, reducing electronic interference and enhancing the protection of electronic devices, which is positively influencing the regional market. Additionally, several key market players are introducing advanced product variations in a bid to broaden their customer base. This, combined with various technological advancements, such as the integration of artificial intelligence (AI) solutions and the incorporation of connected devices into the Internet of Things (IoT), is exerting a positive impact on market growth. Apart from this, manufacturers are employing silicon-based sensors in their manufacturing equipment. These sensors provide the ability to remotely monitor intricate circuit boards. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are among the other factors expected to drive market growth in the forthcoming years in Japan.

Japan Semiconductor Manufacturing Equipment Market Segmentation:

Equipment Type Insights:

Front-End
Lithography
Deposition
Cleaning
Wafer Surface Conditioning
Others
Back-End
Testing
Assembly and Packaging
Dicing
Bonding
Metrology
Others
Fab Facility Equipment
Automation
Chemical Control
Gas Control
Others

Product Type Insights:

Memory
Logic Components
Microprocessor
Analog Components
Optoelectronic Components
Discrete Components
Others

Dimension Insights:

2D
2.5D
3D

Supply Chain Participant Insights:

IDM Firms
OSAT Companies
Foundries

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

How has the Japan semiconductor manufacturing equipment market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the Japan semiconductor manufacturing equipment market?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of equipment type?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of product type?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of dimension?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of supply chain participant?
What are the various stages in the value chain of the Japan semiconductor manufacturing equipment market?
What are the key driving factors and challenges in the Japan semiconductor manufacturing equipment?
What is the structure of the Japan semiconductor manufacturing equipment market and who are the key players?
What is the degree of competition in the Japan semiconductor manufacturing equipment market?

Product Code: SR112024A18686

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Manufacturing Equipment Market - Introduction

4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Japan Semiconductor Manufacturing Equipment Market Landscape

5.1 Historical and Current Market Trends (2018-2023)
5.2 Market Forecast (2024-2032)

6 Japan Semiconductor Manufacturing Equipment Market - Breakup by Equipment Type

6.1 Front-End
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2018-2023)
- 6.1.3 Market Segmentation
  - 6.1.3.1 Lithography
  - 6.1.3.2 Deposition
  - 6.1.3.3 Cleaning
  - 6.1.3.4 Wafer Surface Conditioning
  - 6.1.3.5 Others
- 6.1.4 Market Forecast (2024-2032)
6.2 Back-End
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2018-2023)
- 6.2.3 Market Segmentation
  - 6.2.3.1 Testing
  - 6.2.3.2 Assembly and Packaging
  - 6.2.3.3 Dicing
  - 6.2.3.4 Bonding
  - 6.2.3.3 Metrology
  - 6.2.3.4 Others
- 6.2.4 Market Forecast (2024-2032)
6.3 Fab Facility Equipment
- 6.3.1 Overview
- 6.3.2 Historical and Current Market Trends (2018-2023)
- 6.3.3 Market Segmentation
  - 6.3.3.1 Automation
  - 6.3.3.2 Chemical Control
  - 6.3.3.3 Gas Control
  - 6.3.3.4 Others
- 6.3.4 Market Forecast (2024-2032)

7 Japan Semiconductor Manufacturing Equipment Market - Breakup by Product Type

7.1 Memory
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2018-2023)
- 7.1.3 Market Forecast (2024-2032)
7.2 Logic Components
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2018-2023)
- 7.2.3 Market Forecast (2024-2032)
7.3 Microprocessor
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2018-2023)
- 7.3.3 Market Forecast (2024-2032)
7.4 Analog Components
- 7.4.1 Overview
- 7.4.2 Historical and Current Market Trends (2018-2023)
- 7.4.3 Market Forecast (2024-2032)
7.5 Optoelectronic Components
- 7.5.1 Overview
- 7.5.2 Historical and Current Market Trends (2018-2023)
- 7.5.3 Market Forecast (2024-2032)
7.6 Discrete Components
- 7.6.1 Overview
- 7.6.2 Historical and Current Market Trends (2018-2023)
- 7.6.3 Market Forecast (2024-2032)
7.7 Others
- 7.7.1 Historical and Current Market Trends (2018-2023)
- 7.7.2 Market Forecast (2024-2032)

8 Japan Semiconductor Manufacturing Equipment Market - Breakup by Dimension

8.1 2D
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2018-2023)
- 8.1.3 Market Forecast (2024-2032)
8.2 2.5D
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2018-2023)
- 8.2.3 Market Forecast (2024-2032)
8.3 3D
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2018-2023)
- 8.3.3 Market Forecast (2024-2032)

9 Japan Semiconductor Manufacturing Equipment Market - Breakup by Supply Chain Participant

9.1 IDM Firms
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2018-2023)
- 9.1.3 Market Forecast (2024-2032)
9.2 OSAT Companies
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2018-2023)
- 9.2.3 Market Forecast (2024-2032)
9.3 Foundries
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2018-2023)
- 9.3.3 Market Forecast (2024-2032)

10 Japan Semiconductor Manufacturing Equipment Market - Competitive Landscape

10.1 Overview
10.2 Market Structure
10.3 Market Player Positioning
10.4 Top Winning Strategies
10.5 Competitive Dashboard
10.6 Company Evaluation Quadrant

11 Profiles of Key Players

11.1 Company A
- 11.1.1 Business Overview
- 11.1.2 Product Portfolio
- 11.1.3 Business Strategies
- 11.1.4 SWOT Analysis
- 11.1.5 Major News and Events
11.2 Company B
- 11.2.1 Business Overview
- 11.2.2 Product Portfolio
- 11.2.3 Business Strategies
- 11.2.4 SWOT Analysis
- 11.2.5 Major News and Events
11.3 Company C
- 11.3.1 Business Overview
- 11.3.2 Product Portfolio
- 11.3.3 Business Strategies
- 11.3.4 SWOT Analysis
- 11.3.5 Major News and Events
11.4 Company D
- 11.4.1 Business Overview
- 11.4.2 Product Portfolio
- 11.4.3 Business Strategies
- 11.4.4 SWOT Analysis
- 11.4.5 Major News and Events
11.5 Company E
- 11.5.1 Business Overview
- 11.5.2 Product Portfolio
- 11.5.3 Business Strategies
- 11.5.4 SWOT Analysis
- 11.5.5 Major News and Events

12 Japan Semiconductor Manufacturing Equipment Market - Industry Analysis

12.1 Drivers, Restraints, and Opportunities
- 12.1.1 Overview
- 12.1.2 Drivers
- 12.1.3 Restraints
- 12.1.4 Opportunities
12.2 Porters Five Forces Analysis
- 12.2.1 Overview
- 12.2.2 Bargaining Power of Buyers
- 12.2.3 Bargaining Power of Suppliers
- 12.2.4 Degree of Competition
- 12.2.5 Threat of New Entrants
- 12.2.6 Threat of Substitutes
12.3 Value Chain Analysis