Industrial Electronics Packaging Market - By Material Type (Plastics, Metals, Ceramics, Composites), By Packaging Type (Trays, Tubes, Bags and pouches, Boxes and Cases, Racks and Cabinets), By Protection Level, By Application & Forecast, 2023

Description

List of Tables

The Industrial Electronics Packaging Market is estimated to register a CAGR of over 4% during 2023 and 2032. The increasing adoption of advanced automation and control systems across various industries, including manufacturing, automotive, and aerospace, is fueling the demand for specialized packaging solutions for sensitive electronic components. These systems require secure packaging to safeguard against environmental factors, such as dust, moisture, and electrostatic discharge, which can adversely affect their functionality.

Moreover, the growing trend of miniaturization in electronic devices is contributing to the market expansion. For instance, in June 2023, Toshiba introduced 100V N-channel power MOSFET that is anticipated to support power supply circuit miniaturization. This has led to innovations in packaging materials and designs that can accommodate these smaller components while providing robust protection.

The global industrial electronics packaging industry is classified based on material type, packaging type, protection level, application, and region.

The ceramic material is gaining significant traction and will continue to record notable CAGR through 2032 due to its exceptional attributes, such as high thermal conductivity, excellent electrical insulation, and resistance to extreme temperatures and corrosive environments. As electronic devices become more compact and power-dense, ceramics offer an ideal solution to dissipate heat efficiently, ensuring the longevity and reliability of these components. Moreover, their stability and resistance to chemical degradation make them well-suited for applications in harsh industrial settings.

Hermetic packaging segment of industrial electronics packaging market is slated to grow decently over 2023-2032, due to its unmatched ability to provide an impermeable and secure environment for sensitive electronic components. Hermetic packages maintain the integrity of components, ensuring their long-term functionality and reliability, especially in critical applications where even the slightest ingress of moisture or impurities can lead to catastrophic failures. This level of protection is crucial in industries like aerospace, defense, and medical devices, where precision and durability are paramount, boosting the segment growth.

The industrial electronics packaging industry size from telecommunications equipment packaging application is touted to grow tremendously through 2032, owing to the rapid expansion of global communication networks and the deployment of advanced technologies like 5G. Robust packaging is essential to shield sensitive telecom equipment from environmental factors, vibration, and mechanical stress, which can impact signal quality and operational efficiency. The need for specialized and tailored packaging solutions for telecom equipment will favor the market expansion.

Asia Pacific industrial electronics packaging market is experiencing robust growth and will register strong CAGR through 2032, due to its position as a global manufacturing hub, with increased demand for electronic components across various industries. The rapid adoption of advanced technologies, collective focus on sustainability, in consort with availability of a skilled, cost-effective labor force will position the APAC region as a lucrative avenue for industrial electronics packaging industry players in the near future.

Product Code: 6376

Chapter 1 Methodology & Scope

1.1 Industry coverage
1.2 Market scope & definition
1.3 Base estimates & calculations
- 1.3.1 Data collection
1.4 Forecast parameters
1.5 COVID-19 impact analysis at global level
1.6 Data validation
1.7 Data Sources
- 1.7.1 Primary
- 1.7.2 Secondary
  - 1.7.2.1 Paid sources
  - 1.7.2.2 Unpaid sources

Chapter 2 Executive Summary

2.1 Industrial electronics packaging industry 360 degree synopsis, 2018 - 2032
2.2 Business trends
2.3 Material type trends
2.4 Packaging type trends
2.5 Protection kevel trends
2.6 Application trends
2.7 Regional trends

Chapter 3 Industrial Electronics Packaging Industry Insights

3.1 Industry ecosystem analysis
3.2 Industry impact forces
- 3.2.1 Growth drivers
- 3.2.2 Industry pitfalls & challenges
3.3 Growth potential analysis
- 3.3.1 By material type
- 3.3.2 By packaging type
- 3.3.3 By protection level
- 3.3.4 By application
3.4 COVID- 19 impact analysis
3.5 Regulatory landscape
- 3.5.1 U.S.
- 3.5.2 Europe
3.6 Pricing analysis, 2022
3.7 Technology landscape
- 3.7.1 Future market trends
3.8 Porter's analysis
3.9 PESTEL analysis
3.10 Impact of Russia Ukraine war

Chapter 4 Competitive Landscape, 2022

4.1 Introduction
4.2 Company matrix analysis, 2022
4.3 Global company market share analysis, 2022
4.4 Competitive positioning matrix
4.5 Strategy dashboard

Chapter 5 Industrial Electronics Packaging Market Size and Forecast, By Material Type 2018 - 2032

5.1 Plastics
5.2 Metals
5.3 Ceramics
5.4 Composites
5.6 Others

Chapter 6 Industrial electronics packaging Market Size and Forecast, By Packaging Type 2018 - 2032

6.1 Trays
6.2 Tubes
6.3 Bags and pouches
6.4 Boxes and cases
6.5 Racks and cabinets
6.6 Others

Chapter 7 Industrial electronics packaging Market Size and Forecast, By Protection Level 2018 - 2032

7.1 Standard packaging
7.2 Electrostatic Discharge packaging
7.3 Electromagnetic Interference shielding
7.4 Hermetic packaging
7.5 Others

Chapter 8 Industrial electronics packaging Market Size and Forecast, By Application 2018 - 2032

8.1 Semiconductor packaging
8.2 Power electronics packaging
8.3 Industrial control systems packaging
8.4 Telecommunications equipment packaging
8.5 Automation and robotics equipment packaging
8.6 Others

Chapter 9 Industrial Electronics Packaging Market Size and Forecast, By Region 2018 - 2032

9.1 Key trends, by region
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 France
- 9.3.4 Spain
- 9.3.5 Italy
9.4 Asia Pacific
- 9.4.1 Japan
- 9.4.2 China
- 9.4.3 India
- 9.4.4 Australia
- 9.4.5 South Korea
- 9.4.6 Indonesia
- 9.4.7 Malaysia
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Argentina
9.6 MEA
- 9.6.1 South Africa
- 9.6.2 Saudi Arabia
- 9.6.3 UAE
- 9.6.4 Egypt

Chapter 10 Company Profiles

10.1 DS Smith Plc.
10.2 Smurfit Kappa Group Plc.
10.3 UFP Technologies Inc.
10.4 Sealed Air Corporation
10.5 Achilles Corporation
10.6 Desco Industries Inc.
10.7 Botron Company Inc.
10.8 Kiva Container Corporation
10.9 Orlando Products Inc.
10.10 Delphon Industries LLC
10.11 Summit Container Corporation
10.12 Protective Packaging Corporation
10.13 Dou Yee Enterprises (S) Pte Ltd.
10.14 Dordan Manufacturing Company Inc.
10.15 GWP Group Limited