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PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1681365

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PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1681365

Global Electronic Packaging Market Size Study, By Material (Plastic, Metal, Glass), By End-use (Consumer Electronics, Automotive, Aerospace & Defence, Healthcare), And Regional Forecasts 2022-2032

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The global electronic packaging market is valued at USD 1744.99 million in 2023 and is anticipated to grow with a healthy growth rate of 17.29% CAGR over the forecast period 2024-2032. The rising demand for miniaturized consumer electronics, growing adoption of electric vehicles (EVs), and rapid advancements in 5G, AI, and IoT-enabled devices are significantly fueling the market growth. Semiconductor manufacturers and electronics companies are focusing on system-in-package (SiP), fan-out wafer-level packaging (FOWLP), and 3D packaging to improve device performance, reduce power consumption, and enhance thermal management.

The increasing demand for high-performance and durable electronic components across automotive, healthcare, and aerospace industries is further boosting market expansion. The push toward sustainability and eco-friendly materials is also leading to innovations in recyclable electronic packaging, biodegradable encapsulants, and lead-free soldering materials.

Growing Semiconductor Manufacturing and Demand for Advanced Packaging Solutions

The transition towards 7nm, 5nm, and below process nodes in semiconductor manufacturing is driving demand for high-density interconnects, advanced substrates, and multi-layer packaging solutions. The increasing adoption of AI-powered data centers, automotive ADAS (Advanced Driver Assistance Systems), and wearable electronics is propelling the need for high-performance, reliable, and miniaturized electronic packaging.

Furthermore, government initiatives such as the U.S. CHIPS and Science Act and China's semiconductor localization policies are accelerating investments in domestic semiconductor packaging facilities. The shift towards chiplet-based architectures and heterogeneous integration is leading to advancements in power-efficient packaging, fan-out wafer-level packaging (FOWLP), and 3D-IC (Integrated Circuit) stacking.

Challenges in Supply Chain and Cost Volatility

The electronic packaging industry faces challenges such as raw material shortages, high production costs, and supply chain disruptions. The industry relies on high-purity metals (copper, gold), advanced polymers, and semiconductor-grade ceramics, making it vulnerable to geopolitical trade restrictions and fluctuations in commodity prices.

Additionally, the transition to sustainable electronic packaging requires heavy R&D investments, posing a challenge for small- and mid-sized manufacturers. Ensuring recyclability, thermal efficiency, and high-performance standards while keeping costs low remains a key challenge.

Regional Insights: Asia Pacific Dominates, North America Strengthens Domestic Manufacturing

The Asia Pacific electronic packaging market is expected to hold the largest revenue share in 2024, driven by China, Japan, Taiwan, and South Korea-global leaders in semiconductor manufacturing. The presence of major OSAT (Outsourced Semiconductor Assembly and Test) companies, along with government incentives for domestic chip production, is fueling demand for advanced packaging solutions in the region.

The North America electronic packaging market is experiencing strong growth due to increasing investments in semiconductor fabrication and advanced packaging. The U.S. CHIPS Act has led to billions of dollars in funding to establish domestic semiconductor production, reducing dependence on Asian supply chains. Companies are investing in wafer-level packaging (WLP), flip-chip packaging, and system-in-package (SiP) technologies to cater to automotive, healthcare, and industrial electronics sectors.

Meanwhile, Europe's electronic packaging market is driven by sustainability regulations and the circular economy movement. The EU's directives on reducing electronic waste (e-waste) are pushing manufacturers to develop biodegradable encapsulants, solvent-free adhesives, and lead-free solder materials.

Major Market Players

  • UFP Technologies, Inc
  • Sealed Air Corporation
  • DuPont de Nemours, Inc.
  • SCHOTT AG
  • Sonoco Products Company
  • Amkor Technology
  • ASE Group
  • Jabil
  • Mondi plc
  • DS Smith plc

The detailed segments and sub-segments of the market are explained below:

By Material:

  • Plastic
  • Metal
  • Glass
  • Others

By End-Use:

  • Consumer Electronics
  • Automotive
  • Aerospace & Defence
  • Healthcare
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Central & South America
  • Brazil
  • Argentina
  • Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Years Considered for the Study:

  • Historical Year - 2022
  • Base Year - 2023
  • Forecast Period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecasts for 10 years from 2022 to 2032.
  • Annualized revenues and regional-level analysis for each market segment.
  • Detailed analysis of geographical landscape with country-level breakdowns.
  • Competitive landscape with profiles of major companies in the industry.
  • Analysis of key business strategies and future market trends.
  • Supply chain analysis and impact of raw material price fluctuations.
  • Demand-side and supply-side analysis of the market.

Table of Contents

Chapter 1. Global Electronic Packaging Market Executive Summary

  • 1.1. Global Electronic Packaging Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Material
    • 1.3.2. By End-Use
  • 1.4. Key Market Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Electronic Packaging Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion Criteria
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Raw Material Availability
      • 2.3.3.2. Manufacturing Capabilities & Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Adoption Trends & Consumer Preferences
      • 2.3.4.2. Technological Advancements in Packaging
      • 2.3.4.3. Environmental Regulations & Compliance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Electronic Packaging Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Growing Demand for Miniaturization in Electronics
    • 3.1.2. Increasing Adoption of Advanced Semiconductor Packaging
    • 3.1.3. Rising Popularity of 5G, AI, and IoT Technologies
  • 3.2. Market Challenges
    • 3.2.1. Supply Chain Disruptions & Raw Material Price Volatility
    • 3.2.2. Environmental Concerns Over Packaging Waste
    • 3.2.3. Complex Manufacturing & High Capital Investments
  • 3.3. Market Opportunities
    • 3.3.1. Expansion in Emerging Markets & Semiconductor Hubs
    • 3.3.2. Development of Sustainable and Biodegradable Packaging Solutions
    • 3.3.3. Advances in Chiplet Technology & Heterogeneous Integration

Chapter 4. Global Electronic Packaging Market Industry Analysis

  • 4.1. Porter's Five Forces Analysis
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. PESTEL Analysis
    • 4.2.1. Political Factors
    • 4.2.2. Economic Trends & Inflation Impact
    • 4.2.3. Social Factors & Consumer Behavior
    • 4.2.4. Technological Developments in Advanced Packaging
    • 4.2.5. Environmental Regulations & Green Initiatives
    • 4.2.6. Legal & Compliance Considerations
  • 4.3. Key Investment Opportunities
  • 4.4. Top Winning Strategies in the Market
  • 4.5. Industry Expert Perspectives
  • 4.6. Analyst Recommendations & Conclusion

Chapter 5. Global Electronic Packaging Market Size & Forecast by Material (2022-2032)

  • 5.1. Segment Dashboard
  • 5.2. Revenue Trend Analysis by Material, 2022 & 2032 (USD Billion)
    • 5.2.1. Plastic
    • 5.2.2. Metal
    • 5.2.3. Glass
    • 5.2.4. Others

Chapter 6. Global Electronic Packaging Market Size & Forecast by End-Use (2022-2032)

  • 6.1. Segment Dashboard
  • 6.2. Revenue Trend Analysis by End-Use, 2022 & 2032 (USD Billion)
    • 6.2.1. Consumer Electronics
    • 6.2.2. Automotive
    • 6.2.3. Aerospace & Defence
    • 6.2.4. Healthcare
    • 6.2.5. Others

Chapter 7. Global Electronic Packaging Market Size & Forecast by Region (2022-2032)

  • 7.1. North America Electronic Packaging Market
    • 7.1.1. U.S. Electronic Packaging Market
    • 7.1.2. Canada Electronic Packaging Market
    • 7.1.3. Mexico Electronic Packaging Market
  • 7.2. Europe Electronic Packaging Market
    • 7.2.1. U.K. Electronic Packaging Market
    • 7.2.2. Germany Electronic Packaging Market
    • 7.2.3. France Electronic Packaging Market
    • 7.2.4. Italy Electronic Packaging Market
    • 7.2.5. Spain Electronic Packaging Market
    • 7.2.6. Rest of Europe
  • 7.3. Asia Pacific Electronic Packaging Market
    • 7.3.1. China Electronic Packaging Market
    • 7.3.2. India Electronic Packaging Market
    • 7.3.3. Japan Electronic Packaging Market
    • 7.3.4. South Korea Electronic Packaging Market
    • 7.3.5. Australia Electronic Packaging Market
    • 7.3.6. Rest of Asia Pacific
  • 7.4. Central & South America Electronic Packaging Market
    • 7.4.1. Brazil Electronic Packaging Market
    • 7.4.2. Argentina Electronic Packaging Market
    • 7.4.3. Rest of Central & South America
  • 7.5. Middle East & Africa Electronic Packaging Market
    • 7.5.1. Saudi Arabia Electronic Packaging Market
    • 7.5.2. UAE Electronic Packaging Market
    • 7.5.3. South Africa Electronic Packaging Market
    • 7.5.4. Rest of Middle East & Africa

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
    • 8.1.1. UFP Technologies, Inc
    • 8.1.2. Sealed Air Corporation
    • 8.1.3. DuPont de Nemours, Inc.
  • 8.2. Top Market Strategies Adopted by Key Players
  • 8.3. Company Profiles
    • 8.3.1. UFP Technologies, Inc
    • 8.3.2. Sealed Air Corporation
    • 8.3.3. DuPont de Nemours, Inc.
    • 8.3.4. SCHOTT AG
    • 8.3.5. Sonoco Products Company
    • 8.3.6. Amkor Technology
    • 8.3.7. ASE Group
    • 8.3.8. Jabil
    • 8.3.9. Mondi plc
    • 8.3.10. DS Smith plc

Chapter 9. Research Process

  • 9.1. Research Methodology
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes
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