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PUBLISHER: DataM Intelligence | PRODUCT CODE: 1474059

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PUBLISHER: DataM Intelligence | PRODUCT CODE: 1474059

Global Tunnel Field-effect Transistor (TFET) Market - 2024-2031

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Overview

Global Tunnel Field-effect Transistor (TFET) Market reached US$ 949.9 Million in 2023 and is expected to reach US$ 2253.0 Million by 2031, growing with a CAGR of 11.4% during the forecast period 2024-2031.

Government programs that support green technology, energy efficiency and semiconductor innovation are all helping promote the TFET market's expansion. Through offering funding opportunities and encouraging policies, research centers and semiconductor companies are being encouraged to take part in TFET development and commercialization initiatives. Regulations that prioritize environmental sustainability and energy efficiency also promote the usage of semiconductor technology like TFETs, which have very low energy consumption.

The competitive landscape of the semiconductor industry, including research institutes, competitors and well-established corporations, promotes innovation and teamwork in TFET technology. Industry consortia, joint ventures, licensing agreements and strategic partnerships drive TFET research, development and market expansion. Due to the combined efforts of semiconductor companies, foundries, equipment suppliers and research institutions, TFETs are becoming increasingly affordable.

North America is the dominating region in the market due to the rapid growth in the semiconductor industry in U.S. and Canada. According to the Institute of Electrical and Electronics Engineers data, Texas Instruments Incorporated, Intel Corporation and NVIDIA Corporation are some of the leading participants in the semiconductor industry in United States. North America's semiconductor sector is expanding rapidly due to the growing industrial demand. The World Semiconductor Trade Statistics indicates that in 2020, the semiconductor sector is expected to grow by 5.9%.

Dynamics

Technological Advancements

One of the main advantages of TFET technology over conventional Field-effect Transistors (FETs) is the ability to achieve lower power consumption and higher energy efficiency. Minimizing leakage currents, improving device designs and reducing sub-threshold swing are the three primary objectives of TFET technological advancements. The advancements result in TFETs that consume less power, making them highly desirable for energy-efficient electronic devices and systems. The growing demand for energy-efficient solutions across various industries drives TFET market growth.

Technological developments increase TFET performance metrics such as overall reliability, ON-state current, OFF-state leakage and switching speed. Enhancements in doping profiles, device architectures, materials and manufacturing techniques allow TFETs to attain greater performance levels, which opens up new application opportunities. TFETs with improved performance characteristics attract more market interest and adoption, driving market growth.

Rapid Growth in the Semiconductor Industry Globally

To encourage creativity and produce cutting-edge semiconductor technology, the semiconductor industry allocates substantial resources to research & development. TFET research, prototyping and testing are all included in this. By addressing technical issues, improving performance characteristics and broadening the spectrum of applications for which TFETs are used, research and development expenditures help to progress TFET technology.

The data provided by IEEE suggests the increased usage of IoT and AI devices has led to a major growth in the semiconductor sector. Semiconductor sales expand slightly yearly when supply and demand changes and disputes over international commerce are also taken into consideration. Sales of semiconductors are predicted to surpass US$ 655 billion by 2025, amid a slower rate of growth for the sector as an entirety.

High Cost of the Development and Production

Developing TFET technology involves extensive R&D efforts to design, simulate, prototype and test TFET devices and circuits. The R&D phase incurs costs related to materials research, device modeling, fabrication process optimization, equipment acquisition and specialized personnel. High R&D costs have an impact on a semiconductor company's finances, particularly for startups or smaller businesses with fewer funds. TFET manufacture entails complex processes requiring specialized equipment, cleanroom facilities and advanced manufacturing techniques. The cost of manufacturing as a whole is increased by setting up and maintaining fabrication facilities, acquiring equipment for semiconductor manufacture and ensuring process control and quality assurance.

Advanced semiconductor materials and heterostructures, such as strained silicon and III-V compound semiconductors, are frequently used in TFETs. The greater cost of these materials compared to conventional silicon results in increased production expenses. Additionally, sourcing high-quality materials, managing material supply chains and ensuring material compatibility with TFET fabrication processes can further increase costs.

Segment Analysis

The global tunnel field-effect transistor (TFET) market is segmented based on type, application, end-user and region.

Lateral Tunneling is Dominating Type in the Tunnel Field-effect Transistor (TFET) Market

Based on the type, the tunnel field-effect transistor (TFET) market is segmented into lateral tunneling and vertical tunneling.

Lateral TFETs offer performance advantages over vertical TFETs and traditional Field-effect Transistors (FETs). It can achieve lower sub-threshold swing values, which are critical for reducing power consumption and improving energy efficiency in electronic devices. The superior performance characteristics of lateral TFETs make them attractive for applications requiring low-power operation, high-speed switching and improved overall performance. Lateral TFETs are known for their scalability and integration capabilities. It is frequently used in advanced semiconductor processes to create electronic components that are more compact, dense and effective.

To address the needs of miniaturization, high integration density and performance optimization in contemporary semiconductor devices such as wearable electronics, mobile devices and Internet of Things devices this scalability is crucial. Due to their high-speed switching capabilities, lateral TFETs are suitable for high-frequency applications including radiofrequency circuits and signal processing. Its low power consumption and greater frequency capability are ideal for applications requiring rapid data processing, high-speed data transfer and RF signal modulation.

Geographical Penetration

North America is Dominating the Tunnel Field-effect Transistor (TFET) Market

The US has a robust semiconductor industry environment, complete with vendors of semiconductor equipment and well-established supply chain networks. The supports the market leadership and competitiveness of TFET manufacturers operating in the region through efficient manufacturing, quality control and scalability. Significant investments in semiconductor R&D occur in North America, where they are supported by governmental financing, business sector investments and scholarly partnerships.

North America exhibits strong demand for energy-efficient electronics, IoT devices, telecommunication infrastructure, data centers and emerging technologies. TFETs, known for their low-power characteristics, high-speed performance and suitability for IoT applications, align well with market demands in sectors such as consumer electronics, healthcare, automotive, aerospace and defense, contributing to their market dominance in the region. The region's TFET market is growing due to research projects centered on cutting-edge semiconductor technologies, such as TFETs, which stimulate innovation, talent development and knowledge transfer.

Competitive Landscape

The major global players in the market include Qorvo, Inc., Texas Instruments, Inc., Infineon Technologies AG, ON Semiconductor Corporation, Broadcom, Inc, STMicroelectronics N.V., Advanced Linear Devices, Inc., Axcera, Inc., Focus Microwaves, Inc. and Qualcomm.

COVID-19 Impact Analysis

The semiconductor sector had significant supply chain issues during the pandemic. Lockdowns and temporary closures of manufacturing places in countries hindered the production and distribution of semiconductor materials and components. It's possible that TFET producers had trouble finding the required parts, which resulted in supply chain problems, higher prices and production delays.

The epidemic altered trends in consumer behavior and the adoption of new technologies. The demand for some semiconductor devices, such as those used in consumer electronics and telephone services, varied during the epidemic. As they are useful for low-power applications and energy-efficient gadgets, TFET demand has remained stable or even grown in industries that place a high priority on efficiency, connection and digital transformation.

Russia-Ukraine War Impact Analysis

Global supply chains are vital to the semiconductor company to obtain materials and components from different countries. Transportation lines have been hampered by the conflict, which caused delays and shortages in the distribution and manufacturing of semiconductors. The makes it more difficult for TFET producers to get necessary supplies, machinery and parts, which would reduce their ability to produce goods and strengthen their supply chains. The war's consequence of geopolitical tensions and economic sanctions affect semiconductor businesses working in Russia, Ukraine and neighboring territories in terms of commercial relationships, export-import laws and market access. Market instability, regulatory changes and geopolitical uncertainty pose issues for TFET manufacturers who have operations or dependencies in these regions. The challenges influence their market strategy and expansion plans.

The conflict has also contributed to fluctuations in energy prices, particularly affecting critical resources like natural gas and electricity. Higher energy costs increase manufacturing expenses for TFET producers, potentially leading to cost pressures and margin considerations. In reaction to these market changes, businesses must evaluate their resource management procedures, energy-efficient techniques and cost-optimization efforts. Broad financial consequences of the Russia-Ukraine war include market instability, inflationary pressures and currency fluctuations. The macroeconomic variables affect the growth of the TFET market and revenue expectations by influencing corporate confidence in the semiconductor sector. Companies need to adjust their market strategies, pricing models and risk management approaches to navigate these economic challenges effectively.

By Type

  • Lateral Tunneling
  • Vertical Tunneling

By Application

  • Low-Power Electronics
  • High-Speed Switching
  • Analog Circuits

By End-User

  • Consumer Electronics
  • Telecommunications
  • Automotive
  • Healthcare
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • On January 01, 2024, Amplia Infrastructures launched an MP 1000HD cutter head for the specific project of removing damaged surfaces in tunnels. The product is designed for excavators from 35 to 60 tons customized for tunneling, the HD version differs from the MP.
  • On April 14, 2021, Boring Company launched tunneling products and services in the market. The first of which is located in the Las Vegas Convention Centre and is called the Loop. The Loop tunnels by The Boring Company are designed for large-scale transportation and can accommodate cars such as the Tesla Model 3 and Model X.

Why Purchase the Report?

  • To visualize the global tunnel field-effect transistor (TFET) market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of tunnel field-effect transistor (TFET) market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global tunnel field-effect transistor (TFET) market report would provide approximately 62 tables, 53 figures and 182 Pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies
Product Code: ICT8399

Table of Contents

1.Methodology and Scope

  • 1.1.Research Methodology
  • 1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

  • 3.1.Snippet by Type
  • 3.2.Snippet by Application
  • 3.3.Snippet by End-User
  • 3.4.Snippet by Region

4.Dynamics

  • 4.1.Impacting Factors
    • 4.1.1.Drivers
      • 4.1.1.1.Technological Advancements
      • 4.1.1.2.Rapid Growth in the Semiconductor Industry Globally
    • 4.1.2.Restraints
      • 4.1.2.1.High Cost of the Development and Production
    • 4.1.3.Opportunity
    • 4.1.4.Impact Analysis

5.Industry Analysis

  • 5.1.Porter's Five Force Analysis
  • 5.2.Supply Chain Analysis
  • 5.3.Pricing Analysis
  • 5.4.Regulatory Analysis
  • 5.5.Russia-Ukraine War Impact Analysis
  • 5.6.DMI Opinion

6.COVID-19 Analysis

  • 6.1.Analysis of COVID-19
    • 6.1.1.Scenario Before COVID-19
    • 6.1.2.Scenario During COVID-19
    • 6.1.3.Scenario Post COVID-19
  • 6.2.Pricing Dynamics Amid COVID-19
  • 6.3.Demand-Supply Spectrum
  • 6.4.Government Initiatives Related to the Market During Pandemic
  • 6.5.Manufacturers Strategic Initiatives
  • 6.6.Conclusion

7.By Type

  • 7.1.Introduction
    • 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2.Market Attractiveness Index, By Type
  • 7.2.Lateral Tunneling*
    • 7.2.1.Introduction
    • 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3.Vertical Tunneling

8.By Application

  • 8.1.Introduction
    • 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2.Market Attractiveness Index, By Application
  • 8.2.Low-Power Electronics*
    • 8.2.1.Introduction
    • 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3.High-Speed Switching
  • 8.4.Analog Circuits

9.By End-User

  • 9.1.Introduction
    • 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 9.1.2.Market Attractiveness Index, By End-User
  • 9.2.Consumer Electronics*
    • 9.2.1.Introduction
    • 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3.Telecommunications
  • 9.4.Automotive
  • 9.5.Healthcare
  • 9.6.Others

10.By Region

  • 10.1.Introduction
    • 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2.Market Attractiveness Index, By Region
  • 10.2.North America
    • 10.2.1.Introduction
    • 10.2.2.Key Region-Specific Dynamics
    • 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1.U.S.
      • 10.2.6.2.Canada
      • 10.2.6.3.Mexico
  • 10.3.Europe
    • 10.3.1.Introduction
    • 10.3.2.Key Region-Specific Dynamics
    • 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1.Germany
      • 10.3.6.2.UK
      • 10.3.6.3.France
      • 10.3.6.4.Italy
      • 10.3.6.5.Spain
      • 10.3.6.6.Rest of Europe
  • 10.4.South America
    • 10.4.1.Introduction
    • 10.4.2.Key Region-Specific Dynamics
    • 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1.Brazil
      • 10.4.6.2.Argentina
      • 10.4.6.3.Rest of South America
  • 10.5.Asia-Pacific
    • 10.5.1.Introduction
    • 10.5.2.Key Region-Specific Dynamics
    • 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1.China
      • 10.5.6.2.India
      • 10.5.6.3.Japan
      • 10.5.6.4.Australia
      • 10.5.6.5.Rest of Asia-Pacific
  • 10.6.Middle East and Africa
    • 10.6.1.Introduction
    • 10.6.2.Key Region-Specific Dynamics
    • 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

  • 11.1.Competitive Scenario
  • 11.2.Market Positioning/Share Analysis
  • 11.3.Mergers and Acquisitions Analysis

12.Company Profiles

  • 12.1.Qorvo, Inc.*
    • 12.1.1.Company Overview
    • 12.1.2.Product Portfolio and Description
    • 12.1.3.Financial Overview
    • 12.1.4.Key Developments
  • 12.2.Texas Instruments, Inc.
  • 12.3.Infineon Technologies AG
  • 12.4.ON Semiconductor Corporation
  • 12.5.Broadcom, Inc
  • 12.6.STMicroelectronics N.V.
  • 12.7.Advanced Linear Devices, Inc.
  • 12.8.Axcera, Inc.
  • 12.9.Focus Microwaves, Inc.
  • 12.10.Qualcomm

LIST NOT EXHAUSTIVE

13.Appendix

  • 13.1.About Us and Services
  • 13.2.Contact Us
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