PUBLISHER: Aranca | PRODUCT CODE: 1459584
PUBLISHER: Aranca | PRODUCT CODE: 1459584
Global CMP Materials Market 2024
The Chemical Mechanical Planarization (CMP) materials market is poised for remarkable growth, projected to surpass USD 6.5 billion by 2030, with a compelling CAGR of approximately 8% from a value of USD 3.7 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for CMP materials.
This report provides a deep dive into the following points in this detailed assessment of materials for Chemical Mechanical Planarization:
Product Overview
Defining the major components used in CMP:
- CMP Pads
- CMP Slurries
Global Chemical Mechanical Planarization Market Overview
Insight on current (2022) and forecasted (2030) global market for CMP materials including an analysis of the key trends and drivers impacting market growth and choice of materials.
Global market segmentation by material type
Global market segmentation by key materials used ; Polymers, Metals, Ceramics, etc.
Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Polishing and Removal rate, Planarity, and Uniformity
Competition overview:
Key competitor profiles and analyzing the competitor landscape of 10+ companies including 3M, Dow, Merck, Resonac, DuPont, etc.
Patent overview:
Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.
Market Outlook
Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.
Table of Contents
1. Introduction
- 1.1 Report Overview
- 1.2 Product Focus
- 1.3 Methodology
2. Process Overview
- 2.1 Thin Film Molding
- 2.2 Photolithography
- 2.3 Etching
- 2.4 Doping
- 2.5 CMP
- 2.6 Dicing
- 2.7 Wire Bonding
- 2.8 Packaging
3. Value Chain Overview
4. Market Overview
5. Detailed Market Assessment
- 5.1 Materials for CMP (Slurries & pads)
5. Patent Overview
6. Market Outlook
7. Annexure
List of Tables
- Table 4.1: Global Semiconductor Materials Market - By Material Type
- Table 4.2: Global Semiconductor Materials Market - Key Competitors
- Table 5.1.1: Global CMP Materials Market - By Material Type
- Table 5.1.2: Manufacturers v/s Component and Material Used - CMP Materials
- Table 6.1: Patent Publications by Geography - CMP Slurries
- Table 6.2: Patent Listing - CMP Slurries
- Table 6.3: Patent Publications by Geography - CMP Polishing Pad
- Table 6.4: Patent Listing - CMP Polishing Pad
List of Figures
- Chart 4.1: Global Semiconductor Materials Market
- Chart 4.2: Global Semiconductor Materials Market - By Material Type
- Chart 4.3: Global Semiconductor Materials Market - By Component
- Chart 5.1.1: Global CMP Materials Market
- Chart 5.1.2: Global CMP Materials Market, By Material
- Chart 6.1: Patent Publication Trend - CMP Slurries
- Chart 6.2: Patent Publication Trend - CMP Polishing Pads
