Global eFuse Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

List of Tables

The global demand for eFuse Market is presumed to reach the market size of nearly USD 5.09 BN by 2030 from USD 3.58 BN in 2022 with a CAGR of 4.5% under the study period 2023 - 2030.

An electronic fuse (eFuse) is a small fuse embedded in a computer chip. IBM developed this technique to enable dynamic real-time reprogramming of semiconductors. Electronic fuses, or eFuses, are integrated circuits that can replace traditional fuses or other protective devices like resettable polymeric fuses. They include a control circuit and a low-on-resistance power switch, connecting the input port to the load, in compact plastic packages such as DFN and Flip-chip.

Market Dynamics:

During the forecast period, the worldwide eFuse market is likely to benefit from rising demand for cloud computing across the globe, increased acceptance in the automotive industry, and the advent of eFuse ICs for intelligent electronic devices and VR/AR applications. The market has been propelled by the increasing use of eFuses in automotive applications such as the automobile eFuse box, body control module, and automotive electronic subassemblies such as ABS cards, engine control units, audio systems, navigation systems, and security systems.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of efuse. The growth and trends of efuse industry provide a holistic approach to this study.

Market Segmentation:

This section of the efuse market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Type

Latched Type Efuse
Auto-Retry Type Efuse

By Package Type

Small Outline No Lead (SON)
Dual Flat No Leads (DFN)
Quad Flat No-Lead (QFN)
Thin Shrink Small Outline Package (TSSOP)
Others (Chip Scale Package [CSP], Ceramic Flat-Pack [CFP], Etc.)

By Application

Solid State Drives
Hard Disk Drives
Servers And Data Center Equipment
Automotive Electronics
Others (Power Tools, Surveillance Equipment, Networking Etc.)

By End-Use Industry

Automotive & Transportation
Aerospace & Defense
Consumer Electronics
Healthcare
It & Telecommunication
Others (Manufacturing, Agriculture, Etc.)

Regional Analysis:

This section covers the regional outlook, which accentuates current and future demand for the eFuse market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the efuse market include Analog Devices Inc., Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Qorvo, Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Electronic Devices & Storage Corporation. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

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Product Code: VMR11216854

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . EFUSE - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 By Type
- 3.7.2 By Package Type
- 3.7.3 By Application
- 3.7.4 By End-use Industry
- 3.7.5 By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL EFUSE MARKET ANALYSIS BY TYPE

6.1 Overview by Type
6.2 Historical and Forecast Data
6.3 Analysis by Type
6.4 Latched Type eFuse Market by Regions
6.5 Auto-retry Type eFuse Market by Regions

7 . GLOBAL EFUSE MARKET ANALYSIS BY PACKAGE TYPE

7.1 Overview by Package Type
7.2 Historical and Forecast Data
7.3 Analysis by Package Type
7.4 Small Outline No Lead (SON) Market by Regions
7.5 Dual Flat No Leads (DFN) Market by Regions
7.6 Quad Flat No-lead (QFN) Market by Regions
7.7 Thin Shrink Small Outline Package (TSSOP) Market by Regions
7.8 Others Market by Regions

8 . GLOBAL EFUSE MARKET ANALYSIS BY APPLICATION

8.1 Overview by Application
8.2 Historical and Forecast Data
8.3 Analysis by Application
8.4 Solid State Drives Market by Regions
8.5 Hard Disk Drives Market by Regions
8.6 Servers and Data Center Equipment Market by Regions
8.7 Automotive Electronics Market by Regions
8.8 Others Market by Regions

9 . GLOBAL EFUSE MARKET ANALYSIS BY END-USE INDUSTRY

9.1 Overview by End-use Industry
9.2 Historical and Forecast Data
9.3 Analysis by End-use Industry
9.4 Automotive & Transportation Market by Regions
9.5 Aerospace & Defense Market by Regions
9.6 Consumer Electronics Market by Regions
9.7 Healthcare Market by Regions
9.8 IT & Telecommunication Market by Regions
9.9 Others Market by Regions

10 . GLOBAL EFUSE MARKET ANALYSIS BY GEOGRAPHY

10.1. Regional Outlook
10.2. Introduction
10.3. North America
- 10.3.1. Overview, Historic and Forecast Data
- 10.3.2. North America By Segment
- 10.3.3. North America By Country
- 10.3.4. United State
- 10.3.5. Canada
- 10.3.6. Mexico
10.4. Europe
- 10.4.1. Overview, Historic and Forecast Data
- 10.4.2. Europe by Segment
- 10.4.3. Europe by Country
- 10.4.4. United Kingdom
- 10.4.5. France
- 10.4.6. Germany
- 10.4.7. Italy
- 10.4.8. Russia
- 10.4.9. Rest Of Europe
10.5. Asia Pacific
- 10.5.1. Overview, Historic and Forecast Data
- 10.5.2. Asia Pacific by Segment
- 10.5.3. Asia Pacific by Country
- 10.5.4. China
- 10.5.5. India
- 10.5.6. Japan
- 10.5.7. South Korea
- 10.5.8. Australia
- 10.5.9. Rest Of Asia Pacific
10.6. Latin America
- 10.6.1. Overview, Historic and Forecast Data
- 10.6.2. Latin America by Segment
- 10.6.3. Latin America by Country
- 10.6.4. Brazil
- 10.6.5. Argentina
- 10.6.6. Peru
- 10.6.7. Chile
- 10.6.8. Rest of Latin America
10.7. Middle East & Africa
- 10.7.1. Overview, Historic and Forecast Data
- 10.7.2. Middle East & Africa by Segment
- 10.7.3. Middle East & Africa by Country
- 10.7.4. Saudi Arabia
- 10.7.5. UAE
- 10.7.6. Israel
- 10.7.7. South Africa
- 10.7.8. Rest Of Middle East And Africa

11 . COMPETITIVE LANDSCAPE OF THE EFUSE COMPANIES

11.1. EFuse Market Competition
11.2. Partnership/Collaboration/Agreement
11.3. Merger And Acquisitions
11.4. New Product Launch
11.5. Other Developments

12 . COMPANY PROFILES OF EFUSE INDUSTRY

12.1. Company Share Analysis
12.2. Market Concentration Rate
12.3. Analog Devices Inc.
- 12.3.1. Company Overview
- 12.3.2. Financials
- 12.3.3. Products
- 12.3.4. Recent Developments
12.4. Diodes Incorporated
- 12.4.1. Company Overview
- 12.4.2. Financials
- 12.4.3. Products
- 12.4.4. Recent Developments
12.5. Microsemi Corporation
- 12.5.1. Company Overview
- 12.5.2. Financials
- 12.5.3. Products
- 12.5.4. Recent Developments
12.6. On Semiconductor Corporation
- 12.6.1. Company Overview
- 12.6.2. Financials
- 12.6.3. Products
- 12.6.4. Recent Developments
12.7. Qorvo, Inc.
- 12.7.1. Company Overview
- 12.7.2. Financials
- 12.7.3. Products
- 12.7.4. Recent Developments
12.8. STMicroelectronics N.V.
- 12.8.1. Company Overview
- 12.8.2. Financials
- 12.8.3. Products
- 12.8.4. Recent Developments
12.9. Texas Instruments Incorporated
- 12.9.1. Company Overview
- 12.9.2. Financials
- 12.9.3. Products
- 12.9.4. Recent Developments
12.10. Toshiba Electronic Devices & Storage Corporation
- 12.10.1. Company Overview
- 12.10.2. Financials
- 12.10.3. Products
- 12.10.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies