PUBLISHER: Verified Market Research | PRODUCT CODE: 1628511
PUBLISHER: Verified Market Research | PRODUCT CODE: 1628511
Flexible Substrates Market size was valued at USD 656.64 Million in 2024 and is projected to reach USD 2036.79 Million by 2031, growing at a CAGR of 15.20% during the forecast period 2024-2031.
Across the globe, there has been a huge growth in the electronics industry which is characterized by innovative and advanced electronic products. Thus it has created the need for the development of substrates that are portable as well as efficient. Thus the emerging electronic technologies and growing demand for Organic Light-Emitting Diodes (OLED) are the key factors contributing to the revenue growth of the Global Flexible Substrates Market. The Global Flexible Substrates Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.
Global Flexible Substrates Market Definition
A flexible substrate is defined as a thin, heat-resistant material that is usually made of polymers like polyimide and polyethylene terephthalate (PET). The flexible substrates are commonly used for electronic devices on glass, metal, and polymers. In many computing and electronics devices, the tiny PCBs that transmit signals between the control prompts and screens are generally made of flexible substrates. The features like flexibility and durability of the material have rendered it suitable for small devices and intense working environments where factors like vibration and extreme levels of heat often come into play.
Flexible substrate materials offer numerous benefits which include reducing weight and space, easier installation and service, increasing reliability, managing heat, improving aesthetics, eliminating connectors, reducing assembly costs, etc. Additionally, the deposition on flexible substrates offers a huge cost reduction due to a large reduction in energy levels required for the heating film before coating.
Global Flexible Substrates Market Overview
The rapidly rising field of printed electronics technologies is the main key factor driving the growth of the Global Flexible Substrates Market. Printed electronics technologies are used to design electrical devices on numerous substrates. In addition to this, the rising demand for Organic Light-Emitting Diodes (OLED) which are usually made up of carbon-based organic materials and emits light on applying electricity is boosting the growth of the Global Flexible Substrates Market.
The increasing demand for flexible substrates across a wide range of application areas which include automotive, medical & healthcare, consumer electronics, defense & aerospace sector, etc is anticipated to be a key force that drives the market demand. Moreover, the enhancement of flexible medical devices and the growing adoption of organic electronics-based IC designing methods for non-invasive monitoring devices are expected to drive the growth in the Global Flexible Substrates Market in the forecast period.
Despite having various advantages of flexible substrates, some factors restrain and challenge the growth of the overall market. The factors like the high production cost of substrates revealing higher temperature resistance are fairly high which limits the scope of their applications, thus restricting the growth of the Flexible Substrates Market. On the other hand, strict regulations, increasing product launches, and the growing number of mergers and acquisitions among drug key players are expected to limit the growth of the Global Flexible Substrates Market.
The Global Flexible Substrates Market is Segmented on the basis of Type, Application, and Geography.
By Type
Plastic
Glass
Metal
Based on Type, the market is bifurcated into Plastic, Glass, and Metal. The plastic segment is estimated to witness the highest CAGR for the forecast period. The factors that can be attributed to the growth of plastic flexible substrates are associated with the low costs convoluted in using this technology for manufacturing low-cost, flexible printed circuit boards, so that permissive increased production of consumer electronics.
By Application
Consumer Electronics
Solar Energy
Medical & Healthcare
Aerospace & Defense
Others
Based on Application, the market is bifurcated into Consumer Electronics, Solar Energy, Medical & Healthcare, Aerospace & Defense, and Others. The Consumer electronics application segment is estimated to witness the highest CAGR for the forecast period. The factor that can be attributed to the growing demand for the Consumer electronics application segment is a fast-growing demand for consumer electronic products in which flexible substrates are widely used in the manufacturing display and other electronic devices.
By Geography
North America
Europe
Asia Pacific
Rest of the World
On the basis of Geography, the Global Flexible Substrates Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. North America dominates the Global Flexible Substrates Market because of the fast-growing adoption rate of new and advanced electronic products. However, Asia Pacific is expected to witness significant growth in the market during the forecast period as many companies are constructing manufacturing facilities in this region.
The "Global Flexible Substrates Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are Dupont Teijin Films, Polyonics Inc., I-Components Co. Ltd., Nippon Electric Glass Co. Ltd., SCHOTT AG, 3M, American Semiconductor Inc., Kolon Industries Inc., Corning Incorporated, and Heraeus Group.
Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.
In Sept 2021, SCHOTT signs a deal to buy Applied Microarrays Inc., expanding its diagnostics business.
In June 2021, Stanford University researchers have developed a manufacturing technology that produces flexible, atomically thin transistors with a length of fewer than 100 nanometers, which is several orders of magnitude smaller than previously achievable.
In April 2022, Nippon Electric Glass Succeeds in Melting Glass Using Hydrogen-Oxygen Burner Combustion Technology.
In January 2022, FLEXINITY(R) connect, the latest invention in the advanced packaging business was introduced by SCHOTT, the inventor of specialty glass and an international technological group. Ultra-fine structured glass, in the form of FLEXINITY(R) connect, adds a game-changing aspect to semiconductor production, which has previously relied on printed circuit boards (PCB) and silicon interposers for advanced chip packaging solutions.