Global Thin Layer Deposition Equipment Market Size By Product (Physical vapor deposition (PVD), Chemical vapor deposition (CVD)), By Application (Semiconductor, Electronic, Computer), By Geographic Scope And Forecast

Thin Layer Deposition Equipment Market Size And Forecast

Thin Layer Deposition Equipment Market size was valued at USD 69.8 Billion in 2024 and is projected to reach USD 218.3 Billion by 2031 , growing at a CAGR of 15.6% from 2024 to 2031. The prominent factor responsible for boosting the growth of the market is the increase in demand for microelectronics and consumer electronics across the globe. The Global Thin Layer Deposition Equipment Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Thin Layer Deposition Equipment Market Definition

A significant increase has been seen in methods of forming thin films materials. Thin-film possesses small thickness that produces by majorly two techniques, physical vapor deposition process (PVD) and chemical vapor deposition process (CVD). Though PVD techniques have some drawbacks it is more beneficial than CVD. Most deposition techniques follow three steps for deposition, synthesis of the deposition species followed by conveyance from source to substrate and then deposition and adhesion of the source onto the substrate and subsequent film growth.

Nowadays, Pulsed-laser deposition (PLD) is another physical deposition technique used for thin film deposition, during this process laser beam is used to ablate the material for deposition of the thin film inside a vacuum chamber. Various industries are using thin layer deposition equipment such as Microelectronics Industry, Specialty Packaging, Data Storage, Cutting Tools, Industrial Applications, Optoelectronic Components, and Medical Technology.

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Global Thin Layer Deposition Equipment Market Overview

Advancements in technology such as thin-film semiconductors are achieving rapid acceptance across various industries, wide applications of semiconductors in solar panels are fueling the demand for thin-film semiconductors deposition manufacturing. In addition, increased demand for thin-layer deposition semiconductors due to various advantages over other such as, lightweight, higher efficiency, flexibility in shape, and less space consumption is fueling the growth of market.

These are used in DRAMs, microprocessors, and wearable technologies. Furthermore, increasing demand for microelectronics and flexible electronics that include flexible displays and batteries. The need for miniaturization is fulfilled by Thin Layer Deposition. Moreover, the growing demand for sensors in smartphones and wide applications in transportation facilities and aircraft are expected to generate lucrative opportunities for the market. On the other side, high initial investment in initial settings and increasing cost of raw material is anticipated to restrict the market growth of the Market for Thin Layer Deposition Equipment.

Global Thin Layer Deposition Equipment Market Segmentation Analysis

The Global Thin Layer Deposition Equipment Market is segmented on the basis of Product, Application, And Geography.

Thin Layer Deposition Equipment Market, By Product

• Physical vapor deposition (PVD)
• Chemical vapor deposition (CVD)
• Atomic layer deposition (ALD)

Based on Product, The market is segmented into, Physical vapor deposition (PVD), Chemical vapor deposition (CVD), And Atomic layer deposition (ALD). Physical vapor deposition (PVD) is expected to hold the largest share in the market whereas, the atomic layer deposition segment is growing at the fastest pace due to wide applications of technology in the growing electronics and semiconductors industry driving the growth of Atomic layer deposition (ALD).

Thin Layer Deposition Equipment Market, By Application

• Semiconductor
• Electronic
• Computer
• Car
• Other

Based on Application, The market is segmented into, Semiconductor, Electronic, Computer, Car, And Other. The semiconductors industry segment has accounted for holding the largest share in the market due to semiconductor technology node transition and drive for miniaturized components in the semiconductors industry.

Thin Layer Deposition Equipment Market, By Geography

• North America
• Europe
• Asia Pacific
• Rest of the World

Based on Geography, The Global Thin Layer Deposition Equipment Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. Europe and Asia-Pacific are expected to dominate the market due to the progression of electronics and semiconductors industries in the region mainly in china. In addition, deep-rooted electronics manufacturing bases in South Korea and Taiwan are fueling the market growth of the market in the region.

Key Players

• The "Global Thin Layer Deposition Equipment Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
• AIXTRON, Applied Materials, ASM International, Canon ANELVA, CHA Industries, CVD Equipment, Denton Vacuum, Edwards, Ionbond, Jusung Engineering, KDF Electronic & Vacuum Services, Kokusai Semiconductor Equipment, Lam Research, RIBER, Seki Diamond Systems, Silicon Genesis.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

• Partnerships, Collaborations and Agreements
• On June 2019, AIXTRON SE a worldwide leading provider of deposition equipment to the semiconductor industry, is a partner in the European research project "UltimateGaN" (Research for GaN technologies, devices and applications to address the challenges of the futureGaN roadmap).
• On February 2021, AIXTRON SE is a partner of the future cluster "NeuroSys". As one of the leading suppliers of deposition equipment to the semiconductor industry, AIXTRON develops, builds and optimizes the necessary MOCVD tool for the new application. The work on the "NeuroSys" future cluster is expected to run for several years.
• Mergers and Acquisitions
• On July 2019, Applied Materials, Inc. ("Applied") announced a definitive agreement under which Applied will acquire all outstanding shares of Kokusai Electric Corporation ("Kokusai Electric") for $2.2 billion in cash from global investment firm KKR.
• Product Launches and Product Expansions
• On December 2019, AIXTRON SE, a worldwide leading provider of deposition equipment to the semiconductor industry, announced that Japanese group Sumitomo Electric Device Innovations, Inc. has ordered an AIX G5+ tool with 8X6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications such as radars, satellite communication and base stations for the rapidly expanding 5G mobile networks.