Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type and Application

Description

List of Tables

The redistribution layer material market size was valued at US$ 192.39 million in 2022 and is expected to reach US$ 460.15 million by 2030; it is estimated to register a CAGR of 11.5% from 2022 to 2030.

The advanced packaging process starts at the die level, where the objective is always to lessen the die sizes without compromising the input-output (I/O) density. Several other budding packaging technologies play a key role in the heterogeneous integration of devices. Wafer-level fan-out packaging (WLFO) is one of the key packaging technologies that has emerged as a comprehensive packaging process. The WLFO process earlier had only single-die designs, i.e., a single redistribution layer (RDL) on one side of a reconstituted wafer.

The redistribution layer acts as a crucial step in the advanced wafer packaging. RDL serves as a rerouting of the I/O layout and allows a higher I/O number. A high I/O density usually creates better electrical performance, as more outputs result in faster electrical signals between the die and minimize the risk posed by electrical shorts. Besides, a higher I/O density enables the package to achieve better performance simultaneously. Moreover, the Asia's strategic location as a global manufacturing hub, coupled with competitive production costs, has attracted multinational corporations looking to optimize their supply chains. This has created a robust ecosystem for the redistribution layer material market, with various suppliers and manufacturers establishing a presence in the region.

Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest market share in 2022. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry. Polyimides require higher cure temperatures, which is its major drawback, as packaging demands lower cure temperatures. Several material suppliers have thus focused on providing polyimides with lower cure temperatures. PI is majorly used in all the flip-chip wafer bumping and WLP applications. Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. The redistribution layer material market share of the 2.5D/3D IC packaging segment was notable in 2022. The increased costs of lithography steps and wafer processing in general at the next-generation silicon nodes are driving the industry to find alternatives to improve the performance and functionality of electronic devices. Additionally, the need to integrate disparate technologies such as logic, memory, RF, and sensors in small form factors is driving the semiconductor industry toward 3D integration as a solution.

In 2022, Asia Pacific held the largest share of the global redistribution layer material market. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China's evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs. As per the study by the Semiconductor Industry Association, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are key players operating in the global redistribution layer material market. Market players focus on providing high-quality products to fulfill customer demand. They are also adopting strategies such as investments in research and development activities and new product launches.

The overall global redistribution layer material market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights into the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the redistribution layer material market.

Reasons to Buy:

Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in the global redistribution layer material market, thereby allowing players to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth the market trends and outlook coupled with the factors driving the market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation, and industry verticals.

Product Code: TIPRE00002904

1. Introduction

1.1 The Insight Partners Research Report Guidance
1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights
2.2 Market Attractiveness
- 2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage
3.2 Secondary Research
3.3 Primary Research

4. Global Redistribution Layer Material Market Landscape

4.1 Overview
4.2 Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Intensity of Competitive Rivalry
- 4.2.5 Threat of Substitutes
4.3 Ecosystem Analysis
- 4.3.1 Raw Material Suppliers
- 4.3.2 Manufacturers
- 4.3.3 End Use
- 4.3.4 List of Vendors in the Value Chain
  - 4.3.4.1 List of Raw Material Suppliers in Value Chain
  - 4.3.4.2 List of Manufacturers in Value Chain

5. Global Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers
- 5.1.1 Growing Focus on AI-based Equipment and Tools
- 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
5.2 Market Restraints
- 5.2.1 Fluctuation in Raw Material Prices
5.3 Market Opportunities
- 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
5.4 Future Trends
- 5.4.1 Advancements in the Packaging Technology
5.5 Impact Analysis

6. Global Redistribution Layer Material Market - Global Market Analysis

6.1 Global Redistribution Layer Material Market Volume (Tons)
6.2 Global Redistribution Layer Material Market Revenue (US$ Million)
6.3 Global Redistribution Layer Material Market Forecast and Analysis

7. Global Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)
- 7.1.1 Overview
- 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
7.2 Polybenzoxazole (PBO)
7.3 Benzocylobutene (BCB)
7.4 Others

8. Global Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)
- 8.1.1 Overview
- 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
8.2 2 5D/3D IC Packaging
- 8.2.1 Overview
- 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
- 8.2.3 High Bandwidth Memory (HBM)
  - 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
- 8.2.4 Multi-Chip Integration
  - 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
- 8.2.5 Package on Package (FOPOP)
  - 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
- 8.2.6 Others
  - 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Global Redistribution Layer Material Market - Geographical Analysis

9.1 North America
- 9.1.1 North America Redistribution Layer Material Market Overview
- 9.1.2 North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
- 9.1.3 North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
- 9.1.4 North America Redistribution Layer Material Market Breakdown by Type
  - 9.1.4.1 North America Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
  - 9.1.4.2 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
- 9.1.5 North America Redistribution Layer Material Market Breakdown by Application
  - 9.1.5.1 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
- 9.1.6 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
  - 9.1.6.1 Redistribution Layer Material Market Breakdown by Country
  - 9.1.6.2 US Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.1.6.3 US Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.1.6.3.1 US Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.3.2 US Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.3.3 US Redistribution Layer Material Market Breakdown by Application
  - 9.1.6.4 Canada Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.1.6.5 Canada Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.1.6.5.1 Canada Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.5.2 Canada Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.5.3 Canada Redistribution Layer Material Market Breakdown by Application
  - 9.1.6.6 Mexico Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.1.6.7 Mexico Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.1.6.7.1 Mexico Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.7.2 Mexico Redistribution Layer Material Market Breakdown by Type
    - 9.1.6.7.3 Mexico Redistribution Layer Material Market Breakdown by Application
9.2 Europe
- 9.2.1 Europe Redistribution Layer Material Market Overview
- 9.2.2 Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
- 9.2.3 Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
- 9.2.4 Europe Redistribution Layer Material Market Breakdown by Type
  - 9.2.4.1 Europe Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
  - 9.2.4.2 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
- 9.2.5 Europe Redistribution Layer Material Market Breakdown by Application
  - 9.2.5.1 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
- 9.2.6 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
  - 9.2.6.1 Redistribution Layer Material Market Breakdown by Country
  - 9.2.6.2 Germany Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.2.6.3 Germany Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.2.6.3.1 Germany Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.3.2 Germany Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.3.3 Germany Redistribution Layer Material Market Breakdown by Application
  - 9.2.6.4 Austria Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.2.6.5 Austria Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.2.6.5.1 Austria Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.5.2 Austria Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.5.3 Austria Redistribution Layer Material Market Breakdown by Application
  - 9.2.6.6 Italy Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.2.6.7 Italy Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.2.6.7.1 Italy Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.7.2 Italy Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.7.3 Italy Redistribution Layer Material Market Breakdown by Application
  - 9.2.6.8 Rest of Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.2.6.9 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.2.6.9.1 Rest of Europe Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.9.2 Rest of Europe Redistribution Layer Material Market Breakdown by Type
    - 9.2.6.9.3 Rest of Europe Redistribution Layer Material Market Breakdown by Application
9.3 Asia Pacific
- 9.3.1 Asia Pacific Redistribution Layer Material Market Overview
- 9.3.2 Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
- 9.3.3 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
- 9.3.4 Asia Pacific Redistribution Layer Material Market Breakdown by Type
  - 9.3.4.1 Asia Pacific Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
  - 9.3.4.2 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
- 9.3.5 Asia Pacific Redistribution Layer Material Market Breakdown by Application
  - 9.3.5.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
- 9.3.6 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
  - 9.3.6.1 Redistribution Layer Material Market Breakdown by Country
  - 9.3.6.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.3.6.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.3.6.3.1 China Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.3.2 China Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.3.3 China Redistribution Layer Material Market Breakdown by Application
  - 9.3.6.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.3.6.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.3.6.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application
  - 9.3.6.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.3.6.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.3.6.7.1 Japan Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.7.2 Japan Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.7.3 Japan Redistribution Layer Material Market Breakdown by Application
  - 9.3.6.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.3.6.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.3.6.9.1 South Korea Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.9.2 South Korea Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.9.3 South Korea Redistribution Layer Material Market Breakdown by Application
  - 9.3.6.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
  - 9.3.6.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    - 9.3.6.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
    - 9.3.6.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application
9.4 Rest of World
- 9.4.1 Rest of World Redistribution Layer Material Market Overview
- 9.4.2 Rest of World Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
- 9.4.3 Rest of World Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
- 9.4.4 Rest of World Redistribution Layer Material Market Breakdown by Type
  - 9.4.4.1 Rest of World Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
  - 9.4.4.2 Rest of World Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
- 9.4.5 Rest of World Redistribution Layer Material Market Breakdown by Application
  - 9.4.5.1 Rest of World Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application

10. Impact of COVID-19 Pandemic on Global Redistribution Layer Material Market

10.1 Pre & Post Covid-19 Impact

11. Competitive Landscape

11.1 Heat Map Analysis by Key Players
11.2 Company Positioning & Concentration

12. Industry Landscape

12.1 Overview
12.2 Market Initiative
12.3 New Product Development
12.4 Merger and Acquisition

13. Company Profiles

13.1 SK Hynix Inc
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
13.2 Samsung Electronics Co Ltd
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
13.3 Infineon Technologies AG
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
13.4 DuPont de Nemours Inc
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
13.5 FUJIFILM Holdings Corp
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
13.6 Amkor Technology Inc
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments
13.7 ASE Technology Holding Co Ltd
- 13.7.1 Key Facts
- 13.7.2 Business Description
- 13.7.3 Products and Services
- 13.7.4 Financial Overview
- 13.7.5 SWOT Analysis
- 13.7.6 Key Developments
13.8 NXP Semiconductors NV
- 13.8.1 Key Facts
- 13.8.2 Business Description
- 13.8.3 Products and Services
- 13.8.4 Financial Overview
- 13.8.5 SWOT Analysis
- 13.8.6 Key Developments
13.9 JCET Group Co Ltd
- 13.9.1 Key Facts
- 13.9.2 Business Description
- 13.9.3 Products and Services
- 13.9.4 Financial Overview
- 13.9.5 SWOT Analysis
- 13.9.6 Key Developments
13.10 Shin-Etsu Chemical Co Ltd
- 13.10.1 Key Facts
- 13.10.2 Business Description
- 13.10.3 Products and Services
- 13.10.4 Financial Overview
- 13.10.5 SWOT Analysis
- 13.10.6 Key Developments

14. Appendix