Advanced Chip Packaging Global Market Report 2024

Description

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $10.51 billion in 2023 to $12.41 billion in 2024 at a compound annual growth rate (CAGR) of 18.1%. The growth observed during the historic period can be attributed to several factors such as the increasing demand for smaller, more powerful consumer electronics, the proliferation of mobile devices and smartphones, the expansion of high-speed data networks, the rising integration of electronics in the automotive sector, and the evolving requirements of computing technology.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $24.29 billion in 2028 at a compound annual growth rate (CAGR) of 18.3%. The anticipated growth during the forecast period is driven by several key factors such as the widespread adoption of 5G technology, the expansion of Internet of Things (IoT) devices, the increasing prevalence of artificial intelligence (AI) and machine learning, and the rise of wearable technology. Notable trends for the forecast period include the growing use of 3D packaging technologies, advancements in thermal management, progress in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and the development of flexible and stretchable packaging solutions.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2023. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
Understand how the market has been affected by the COVID-19 and how it is responding as the impact of the virus abates.
Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
Measure the impact of high global inflation on market growth.
Create regional and country strategies on the basis of local data and analysis.
Identify growth segments for investment.
Outperform competitors using forecast data and the drivers and trends shaping the market.
Understand customers based on the latest market shares.
Benchmark performance against key competitors.
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Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
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Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The market characteristics section of the report defines and explains the market.
The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of COVID-19 on supply chains and consumption patterns.

Market segmentations break down the market into sub markets.
The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
Companies Mentioned: Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery format: PDF, Word and Excel Data Dashboard.

Product Code: r19526

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario

4.1. Impact Of High Inflation On The Market
4.2. Ukraine-Russia War Impact On The Market
4.3. COVID-19 Impact On The Market

5. Global Advanced Chip Packaging Market Size and Growth

5.1. Global Advanced Chip Packaging Market Drivers and Restraints
- 5.1.1. Drivers Of The Market
- 5.1.2. Restraints Of The Market
5.2. Global Advanced Chip Packaging Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
5.3. Global Advanced Chip Packaging Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Advanced Chip Packaging Market Segmentation

6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Ball Grid Array (BGA)
Quad Flat Package (QFP)
Chip Scale Package (CSP)
Wafer-Level Chip Scale Package (WLCSP)
6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Five-Dimensional (5D) Packaging
Three-Dimensional (3D) Packaging
Fan-Out Wafer-Level Packaging
Flip-Chip Packaging
System-In-Package Solutions
6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Electronics
Automotive
Telecommunications
Industrial
Healthcare
Aerospace And Defense

7. Advanced Chip Packaging Market Regional And Country Analysis

7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

8.1. Asia-Pacific Advanced Chip Packaging Market Overview
Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Advanced Chip Packaging Market

9.1. China Advanced Chip Packaging Market Overview
9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Advanced Chip Packaging Market

10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Advanced Chip Packaging Market

11.1. Japan Advanced Chip Packaging Market Overview
11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Advanced Chip Packaging Market

12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Advanced Chip Packaging Market

13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Advanced Chip Packaging Market

14.1. South Korea Advanced Chip Packaging Market Overview
14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Advanced Chip Packaging Market

15.1. Western Europe Advanced Chip Packaging Market Overview
15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Advanced Chip Packaging Market

16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Advanced Chip Packaging Market

17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Advanced Chip Packaging Market

18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Advanced Chip Packaging Market

19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Advanced Chip Packaging Market

20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

21.1. Eastern Europe Advanced Chip Packaging Market Overview
21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Advanced Chip Packaging Market

22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Advanced Chip Packaging Market

23.1. North America Advanced Chip Packaging Market Overview
23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Advanced Chip Packaging Market

24.1. USA Advanced Chip Packaging Market Overview
24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Advanced Chip Packaging Market

25.1. Canada Advanced Chip Packaging Market Overview
25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Advanced Chip Packaging Market

26.1. South America Advanced Chip Packaging Market Overview
26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Advanced Chip Packaging Market

27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Advanced Chip Packaging Market

28.1. Middle East Advanced Chip Packaging Market Overview
28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Advanced Chip Packaging Market

29.1. Africa Advanced Chip Packaging Market Overview
29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

30.1. Advanced Chip Packaging Market Competitive Landscape
30.2. Advanced Chip Packaging Market Company Profiles
- 30.2.1. Samsung Electronics Co. Ltd.
  - 30.2.1.1. Overview
  - 30.2.1.2. Products and Services
  - 30.2.1.3. Strategy
  - 30.2.1.4. Financial Performance
- 30.2.2. Advanced Micro Devices Inc.
  - 30.2.2.1. Overview
  - 30.2.2.2. Products and Services
  - 30.2.2.3. Strategy
  - 30.2.2.4. Financial Performance
- 30.2.3. Advanced Semiconductor Engineering Inc
  - 30.2.3.1. Overview
  - 30.2.3.2. Products and Services
  - 30.2.3.3. Strategy
  - 30.2.3.4. Financial Performance
- 30.2.4. Henkel Group
  - 30.2.4.1. Overview
  - 30.2.4.2. Products and Services
  - 30.2.4.3. Strategy
  - 30.2.4.4. Financial Performance
- 30.2.5. Texas Instruments Incorporated
  - 30.2.5.1. Overview
  - 30.2.5.2. Products and Services
  - 30.2.5.3. Strategy
  - 30.2.5.4. Financial Performance

31. Advanced Chip Packaging Market Other Major And Innovative Companies

31.1. Lam Research Corporation
31.2. NXP Semiconductors
31.3. Onsemi
31.4. Amkor Technology
31.5. Nordson Corporation
31.6. Siliconware Precision Industries Co. Ltd.
31.7. Kulicke and Soffa Industries Inc.
31.8. ChipMOS Technologies Inc.
31.9. SUSS MicroTec SE
31.10. EV Group
31.11. Indium Corporation
31.12. Palomar Technologies
31.13. Brewer Science Inc.
31.14. MacDermid Alpha Electronics Solutions
31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking

33. Global Advanced Chip Packaging Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market Future Outlook and Potential Analysis

35.1 Advanced Chip Packaging Market In 2028 - Countries Offering Most New Opportunities
35.2 Advanced Chip Packaging Market In 2028 - Segments Offering Most New Opportunities
35.3 Advanced Chip Packaging Market In 2028 - Growth Strategies
- 35.3.1 Market Trend Based Strategies
- 35.3.2 Competitor Strategies

36. Appendix

36.1. Abbreviations
36.2. Currencies
36.3. Historic And Forecast Inflation Rates
36.4. Research Inquiries
36.5. The Business Research Company
36.6. Copyright And Disclaimer