PUBLISHER: The Business Research Company | PRODUCT CODE: 1464109
PUBLISHER: The Business Research Company | PRODUCT CODE: 1464109
High Bandwidth Memory (HBM) represents a cutting-edge computer memory interface tailored for 3D-stacked Synchronous Dynamic Random-Access Memory (SDRAM), delivering substantially heightened bandwidth compared to conventional memory technologies. Its deployment spans a range of high-performance computing environments including alongside high-end graphics accelerators, network devices, AI Application-Specific Integrated Circuits (ASICs) in top-tier data centers, as on-package cache within Central Processing Units (CPUs), and as on-package RAM in upcoming CPU iterations. Furthermore, HBM finds application in Field-Programmable Gate Arrays (FPGAs) and specific supercomputing systems.
High Bandwidth Memory encompasses several main memory types, notably Hybrid Memory Cube (HMC) and various iterations of HBM itself. Additionally, High Bandwidth Wide Processing-in-Memory (PIM) emerges as a notable high-performance memory architecture embedding processing elements directly within memory modules, thereby amplifying data processing speed and efficacy. Variants such as HBWPIM, HBM3, HBM2E, and HBM2 cater to diverse applications spanning servers, networking, consumer electronics, automotive systems, and other specialized fields.
The high bandwidth memory (HBM) market research report is one of a series of new reports from The Business Research Company that provides high bandwidth memory (HBM) market statistics, including high bandwidth memory (HBM) industry global market size, regional shares, competitors with high bandwidth memory (HBM) market share, detailed high bandwidth memory (HBM) market segments, market trends, and opportunities, and any further data you may need to thrive in the high bandwidth memory (HBM) industry. This high bandwidth memory (HBM) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.
The high bandwidth memory (HBM) market size has grown exponentially in recent years. It will grow from $1.85 billion in 2023 to $2.36 billion in 2024 at a compound annual growth rate (CAGR) of 27.4%. The growth observed during the historic period can be ascribed to several factors, including advancements in Graphics Processing Units (GPUs), the rise of big data and analytics, the proliferation of Artificial Intelligence (AI) and Machine Learning (ML) technologies, the escalating complexity of workloads, and the surging demand for High-Performance Computing (HPC) solutions.
The high bandwidth memory (HBM) market size is expected to see exponential growth in the next few years. It will grow to $6.12 billion in 2028 at a compound annual growth rate (CAGR) of 26.9%. The anticipated growth in the forecast period is driven by several key factors, including the widespread rollout of 5G networks, the rapid expansion of edge computing capabilities, heightened adoption of Internet of Things (IoT) technologies, advancements in Artificial Intelligence (AI) and Deep Learning, and the burgeoning market for Virtual Reality (VR) and Augmented Reality (AR) technologies. Major trends expected during this period encompass integration within autonomous vehicles, increased utilization in data center applications, advancements in the gaming industry, enhancements to mobile devices, and innovations in wearable technology.
The growing demand for high-performance computing (HPC) is anticipated to be a key driver for the expansion of the high-bandwidth memory (HBM) market. High-performance computing involves utilizing advanced computing technologies to tackle complex tasks beyond the capabilities of traditional systems. High-bandwidth memory plays a crucial role in HPC by providing faster and more efficient access to data for processors through vertically stacked memory dies, resulting in increased bandwidth and reduced latency. This enhancement significantly boosts the overall computational performance of data-intensive applications. For example, in January 2023, the Department of Energy announced a $1.8 million investment in projects leveraging HPC resources to address manufacturing challenges and improve energy efficiency. These initiatives underscore the pivotal role of HBM in advancing computational capabilities for various sectors, such as reducing carbon emissions in steelmaking and optimizing battery manufacturing for electric vehicles.
Leading companies in the high-bandwidth memory market are prioritizing innovation to maintain a competitive edge, particularly by developing products with high-bandwidth memory integrated with AI processing power. Such solutions combine the computational capacity and efficiency of hardware systems dedicated to artificial intelligence (AI) tasks. For instance, Samsung Electronics introduced HBM-PIM in February 2021, a revolutionary high-bandwidth memory integrated with AI processing power. This processing-in-memory (PIM) architecture, compatible with diverse AI-driven workloads, enhances data center, high-performance computing, and AI-enabled mobile applications. By embedding a DRAM-optimized AI engine within each memory bank, HBM-PIM enables parallel processing, leading to a performance boost of over two times while reducing energy consumption by more than 70%. With seamless integration into existing HBM2 solutions, this technology promises to revolutionize AI processing efficiency without necessitating hardware or software modifications.
In February 2022, Advanced Micro Devices Inc., a leading US semiconductor firm, completed the acquisition of Xilinx Inc. for an estimated $35 billion. This strategic move has notably augmented AMD's presence in the high-performance and adaptive computing sector, offering an extensive array of cutting-edge CPUs, GPUs, FPGAs, and adaptive SoCs. With this expanded portfolio, AMD is well-positioned to tap into a wider market landscape spanning cloud computing, edge computing, and intelligent devices. Xilinx Inc., also headquartered in the US, specializes in the development of versatile processing platforms catering to various technologies, complemented by its expertise in high-bandwidth memory solutions.
Major companies operating in the high bandwidth memory (HBM) market report are Samsung Electronics Co. Ltd, Intel Corporation, International Business Machines (IBM) Corporation, Qualcomm Incorporated, SK Hynix Inc., Fujitsu Limited, Micron Technology Inc., Nvidia Corporation, Toshiba Corporation, Advanced Micro Devices Inc., Western Digital Corporation, STMicroelectronics SA, Renesas Electronics Corporation, Powerchip Technology Corporation, Cypress Semiconductor Corporation, Nanya Technology Corporation, Macronix International Co., Ltd., Silicon Motion Technology Corporation, Transcend Information Inc., Integrated Silicon Solution Inc. (ISSI), Adata Technology Co. Ltd., Netlist Inc., Open Silicon Inc., Micronet Ltd., Winbond Electronics Corporation
North America was the largest region in the high bandwidth memory (HBM) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the high bandwidth memory (HBM) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the high bandwidth memory (HBM) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The high bandwidth memory market consists of sales of graphics processing units, data center accelerators, networking equipment and field-programmable gate arrays (FPGAs). Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
High Bandwidth Memory (HBM) Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses on high bandwidth memory (HBM) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Where is the largest and fastest growing market for high bandwidth memory (HBM) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The high bandwidth memory (HBM) market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
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