High Density Interconnect Global Market Report 2024

Description

High-density interconnect (HDI) refers to a printed circuit board (PCB) designed to accommodate a greater number of components within the same board space, effectively minimizing the PCB's size while enhancing its functionality and incorporating additional features.

The primary types of high-density interconnect include single panels, double panels, and other variations. Single panels represent a PCB construction where all electronic components and circuitry are situated on a single layer of the board. This configuration is utilized when individual board sizes are substantial, commonly seen in assemblies of low-volume boards. Single panels can be crafted from rigid, flexible, and rigid-flex substrates, catering to diverse applications across industries such as automotive, consumer electronics, telecommunications, medical, and others.

The high-density interconnect research report is one of a series of new reports from The Business Research Company that provides high-density interconnect market statistics, including the high-density interconnect industry's global market size, regional shares, competitors with high-density interconnect market share, detailed high-density interconnect market segments, market trends and opportunities, and any further data you may need to thrive in the high-density interconnect industry. This high-density interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The high density interconnect market size has grown rapidly in recent years. It will grow from $15.05 billion in 2023 to $16.71 billion in 2024 at a compound annual growth rate (CAGR) of 11.1%. The growth observed in the historical period can be ascribed to the trend of electronics miniaturization, the surge in consumer electronics, the proliferation of mobile devices, the pursuit of performance improvement, and the escalating demand for higher functionality.

The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $24.82 billion in 2028 at a compound annual growth rate (CAGR) of 10.4%. ChatGPT

The anticipated growth in the forecast period can be credited to the implementation of 5G technology, the upsurge in Internet of Things (IoT) devices, the emergence of artificial intelligence (AI) and machine learning applications, progress in automotive electronics, and the expansion of wearable devices. Noteworthy trends expected in the forecast period encompass technological advancements in PCB design, progress in semiconductor technology, the advent of ultra-thin HDI solutions, an increase in layer count in HDI boards, and the elevation of microvia technology.

The anticipated growth of the high-density interconnect market is expected to be propelled by the increasing application in the automotive industry. The automotive industry, comprising various organizations involved in the design, development, manufacturing, marketing, selling, and maintenance of motor vehicles, stands to benefit from high-density interconnect (HDI) technology. HDI offers advantages such as improvement in performance, increased reliability, enhanced signal transfer, reduced size of components, and cost savings. For instance, the Bureau of Transportation Statistics (BTS) reported a rise in new vehicle sales to 11,471 (Thousands of vehicles) in 2021 in the United States. Hence, the expanding application in the automotive industry is a driving force for the high-density interconnect market.

The increasing demand for consumer electronics is also expected to contribute to the growth of the high-density interconnect market. Consumer electronics, encompassing electronic devices designed for everyday use, benefit from HDI technology by providing miniaturization, improved electrical performance, higher circuit density, enhanced signal integrity, multilayer construction, superior thermal performance, increased reliability, and support for advanced packaging techniques. For example, gfu Consumer & Home Electronics GmbH reported sales of $36.56 billion (Euro 33.7) in electronics products from January to September 2022. Consequently, the rising demand for consumer electronics is a significant driver for the growth of the high-density interconnect market.

Technological advancements are becoming a prominent trend in the high-density interconnect market, with major companies embracing innovations such as double-sided imaging (DSI) technology to maintain their market positions. DSI technology enables the imaging of both sides of the PCB panel, eliminating the need for multiple independent DI systems, loader/unloader systems, and flipper systems. For example, in October 2022, Orbotech Ltd., an Israel-based company specializing in solutions for the electronics manufacturing industry, introduced the 8M direct imaging (DI) system as part of the Orbotech Corus DI platform. This fully automated and scalable solution enhances accuracy and efficiency in patterning processes, offering the capability to replace an entire DI production line with a single Orbotech Corus 8M DI system. The platform is cost-effective, expandable, and facilitates ongoing innovation for PCBs and IC substrates, providing higher resolution and precision for patterning finer lines.

Leading companies in the high-density interconnect market are directing their efforts towards innovative products, such as a search engine for electronic design, to drive revenue growth. The search engine for electronic design aims to help engineers expedite time-to-market by providing access to an extensive collection of CAD models, including PCB footprints and schematic symbols for electronic components. For instance, in September 2022, Amphenol Corporation, a UK-based company specializing in interconnect systems, launched the SnapEDA viewer in collaboration with Amphenol Communication Solutions. This viewer offers over 21,000 free, usable CAD models for hardware design, including schematic symbols and PCB footprints. Engineers can download these models in various formats, such as Altium, Eagle, KiCad, and others, compatible with popular CAD programs. The user-friendly SnapEDA viewer interface enables engineers to easily browse, preview, and download CAD models.

In May 2022, Summit Interconnect Inc., a US-based manufacturer of printed circuit boards for innovative technologies, completed the acquisition of Royal Circuit Solutions for an undisclosed amount. This strategic move enhances Summit's engineering and service resources, providing expertise in CAM (computer-aided manufacturing), DFMA (design for manufacturing and assembly), and PCB design and layout. Royal Circuit Solutions, a US-based manufacturer of prototype printed circuits, brings valuable capabilities in complex 12-layer high-density interconnect and quick-turn prototype SMT (surface-mount technology) assembly services.

Major companies operating in the high density interconnect market report are Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., Empresa Provincial de Energia de Cordoba, CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd., Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc., XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.

Asia-Pacific was the largest region in the high-density interconnect market in 2023 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The high-density interconnect market consists of sales of dielectric or impedance, rogers PCB, rogers PCB with heavy copper, ENEPIG (electroless nickel electroless palladium immersion gold), and RoHS (restriction of hazardous substances) compliance. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

High Density Interconnect Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on high density interconnect market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
Measure the impact of high global inflation on market growth.
Create regional and country strategies on the basis of local data and analysis.
Identify growth segments for investment.
Outperform competitors using forecast data and the drivers and trends shaping the market.
Understand customers based on the latest market shares.
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Where is the largest and fastest growing market for high density interconnect ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The high density interconnect market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The market characteristics section of the report defines and explains the market.
The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of covid 19 on supply chains and consumption patterns.

Market segmentations break down the market into sub markets.
The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

Markets Covered:

1) By Type: Single Panel; Double Panel; Other Types
2) By Substrate: Rigid; Flexible; Rigid-Flex
3) By End User: Automotive; Consumer Electronics; Telecommunications; Medical; Other End-Users
Companies Mentioned: Unimicron Technology Corporation; TTM Technologies Inc.; Austria Technologie & Systemtechnik AG; Zhen Ding Tech. Group; Meiko Electronics Co. Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery format: PDF, Word and Excel Data Dashboard.

Product Code: r13694

1. Executive Summary

2. High Density Interconnect Market Characteristics

3. High Density Interconnect Market Trends And Strategies

4. High Density Interconnect Market - Macro Economic Scenario

4.1. Impact Of High Inflation On The Market
4.2. Ukraine-Russia War Impact On The Market
4.3. COVID-19 Impact On The Market

5. Global High Density Interconnect Market Size and Growth

5.1. Global High Density Interconnect Market Drivers and Restraints
- 5.1.1. Drivers Of The Market
- 5.1.2. Restraints Of The Market
5.2. Global High Density Interconnect Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
5.3. Global High Density Interconnect Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. High Density Interconnect Market Segmentation

6.1. Global High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Single Panel
Double Panel
Other Types
6.2. Global High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Rigid
Flexible
Rigid-Flex
6.3. Global High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Automotive
Consumer Electronics
Telecommunications
Medical
Other End-Users

7. High Density Interconnect Market Regional And Country Analysis

7.1. Global High Density Interconnect Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
7.2. Global High Density Interconnect Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific High Density Interconnect Market

8.1. Asia-Pacific High Density Interconnect Market Overview
Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
8.2. Asia-Pacific High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.3. Asia-Pacific High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.4. Asia-Pacific High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China High Density Interconnect Market

9.1. China High Density Interconnect Market Overview
9.2. China High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.3. China High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.4. China High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India High Density Interconnect Market

10.1. India High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.2. India High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.3. India High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan High Density Interconnect Market

11.1. Japan High Density Interconnect Market Overview
11.2. Japan High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.3. Japan High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.4. Japan High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia High Density Interconnect Market

12.1. Australia High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.2. Australia High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.3. Australia High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia High Density Interconnect Market

13.1. Indonesia High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.2. Indonesia High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.3. Indonesia High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea High Density Interconnect Market

14.1. South Korea High Density Interconnect Market Overview
14.2. South Korea High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.3. South Korea High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.4. South Korea High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe High Density Interconnect Market

15.1. Western Europe High Density Interconnect Market Overview
15.2. Western Europe High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.3. Western Europe High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.4. Western Europe High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK High Density Interconnect Market

16.1. UK High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.2. UK High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.3. UK High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany High Density Interconnect Market

17.1. Germany High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.2. Germany High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.3. Germany High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France High Density Interconnect Market

18.1. France High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.2. France High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.3. France High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy High Density Interconnect Market

19.1. Italy High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.2. Italy High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.3. Italy High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain High Density Interconnect Market

20.1. Spain High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.2. Spain High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.3. Spain High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe High Density Interconnect Market

21.1. Eastern Europe High Density Interconnect Market Overview
21.2. Eastern Europe High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.3. Eastern Europe High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.4. Eastern Europe High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia High Density Interconnect Market

22.1. Russia High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.2. Russia High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.3. Russia High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America High Density Interconnect Market

23.1. North America High Density Interconnect Market Overview
23.2. North America High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.3. North America High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.4. North America High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA High Density Interconnect Market

24.1. USA High Density Interconnect Market Overview
24.2. USA High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.3. USA High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.4. USA High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada High Density Interconnect Market

25.1. Canada High Density Interconnect Market Overview
25.2. Canada High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.3. Canada High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.4. Canada High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America High Density Interconnect Market

26.1. South America High Density Interconnect Market Overview
26.2. South America High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.3. South America High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.4. South America High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil High Density Interconnect Market

27.1. Brazil High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.2. Brazil High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.3. Brazil High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East High Density Interconnect Market

28.1. Middle East High Density Interconnect Market Overview
28.2. Middle East High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.3. Middle East High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.4. Middle East High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa High Density Interconnect Market

29.1. Africa High Density Interconnect Market Overview
29.2. Africa High Density Interconnect Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.3. Africa High Density Interconnect Market, Segmentation By Substrate, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.4. Africa High Density Interconnect Market, Segmentation By End User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. High Density Interconnect Market Competitive Landscape And Company Profiles

30.1. High Density Interconnect Market Competitive Landscape
30.2. High Density Interconnect Market Company Profiles
- 30.2.1. Unimicron Technology Corporation
  - 30.2.1.1. Overview
  - 30.2.1.2. Products and Services
  - 30.2.1.3. Strategy
  - 30.2.1.4. Financial Performance
- 30.2.2. TTM Technologies Inc.
  - 30.2.2.1. Overview
  - 30.2.2.2. Products and Services
  - 30.2.2.3. Strategy
  - 30.2.2.4. Financial Performance
- 30.2.3. Austria Technologie & Systemtechnik AG
  - 30.2.3.1. Overview
  - 30.2.3.2. Products and Services
  - 30.2.3.3. Strategy
  - 30.2.3.4. Financial Performance
- 30.2.4. Zhen Ding Tech. Group
  - 30.2.4.1. Overview
  - 30.2.4.2. Products and Services
  - 30.2.4.3. Strategy
  - 30.2.4.4. Financial Performance
- 30.2.5. Meiko Electronics Co. Ltd.
  - 30.2.5.1. Overview
  - 30.2.5.2. Products and Services
  - 30.2.5.3. Strategy
  - 30.2.5.4. Financial Performance

31. High Density Interconnect Market Other Major And Innovative Companies

31.1. Fujitsu Limited
31.2. Multek Corporation
31.3. NCAB Group
31.4. Sierra Circuits Inc.
31.5. Ibiden Co. Ltd.
31.6. Samsung Electro-Mechanics
31.7. Unitech Printed Circuit Board Corp.
31.8. Empresa Provincial de Energia de Cordoba
31.9. CMK Corporation
31.10. Nan Ya Printed Circuit Board Corporation
31.11. RayMing Technology Co.Ltd
31.12. Advanced Circuits Inc.
31.13. Calumet Electronics Corporation
31.14. ChinaPCBOne Technology Limited
31.15. Epec Engineered Technologies

32. Global High Density Interconnect Market Competitive Benchmarking

33. Global High Density Interconnect Market Competitive Dashboard

34. Key Mergers And Acquisitions In The High Density Interconnect Market

35. High Density Interconnect Market Future Outlook and Potential Analysis

35.1 High Density Interconnect Market In 2028 - Countries Offering Most New Opportunities
35.2 High Density Interconnect Market In 2028 - Segments Offering Most New Opportunities
35.3 High Density Interconnect Market In 2028 - Growth Strategies
- 35.3.1 Market Trend Based Strategies
- 35.3.2 Competitor Strategies

36. Appendix

36.1. Abbreviations
36.2. Currencies
36.3. Historic And Forecast Inflation Rates
36.4. Research Inquiries
36.5. The Business Research Company
36.6. Copyright And Disclaimer