PUBLISHER: The Business Research Company | PRODUCT CODE: 1425875
PUBLISHER: The Business Research Company | PRODUCT CODE: 1425875
Thin Wafer Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses on thin wafer market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Where is the largest and fastest growing market for thin wafer? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The thin wafer market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
Thin wafers, essential in semiconductor device production, are formed via mechanical grinding and stress reduction methods.
These wafers primarily come in sizes of 125 mm, 200 mm, and 300 mm. The 125 mm wafers serve as robust and shatterproof semiconductor bases. The manufacturing processes for thin wafers involve temporary bonding and debonding, along with carrier-less or taiko methods. Technologies applied include wafer grinding, polishing, and dicing. Thin wafers find application in various fields such as MEMS, CIS, RF devices, LED production, interposers, logic circuits, and other specialized uses.
The thin wafer market research report is one of a series of new reports from The Business Research Company that provides thin wafer market statistics, including thin wafer industry global market size, regional shares, competitors with a thin wafer market share, detailed thin wafer market segments, market trends and opportunities, and any further data you may need to thrive in the thin wafer industry. This thin wafer market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The thin wafer market size has grown rapidly in recent years. It will grow from $10.73 billion in 2023 to $11.85 billion in 2024 at a compound annual growth rate (CAGR) of 10.4%. In the historic period, the growth of thin wafers was driven by increased demand for miniaturized devices, expanded adoption within the semiconductor industry, cost reduction initiatives, a surge in the consumer electronics market, and rising demand for photovoltaic cells.
The thin wafer market size is expected to see strong growth in the next few years. It will grow to $17.33 billion in 2028 at a compound annual growth rate (CAGR) of 10.0%. In the forecast period, the growth of thin wafers is anticipated to rise due to their increased utilization in automotive electronics, a growing emphasis on renewable energy sources, the focus on energy-efficient solutions, and the demand for compact and lightweight devices. Major trends expected during this period include the surge in IoT and connected devices, advancements in semiconductor packaging techniques, the expansion of 5G technology, the adoption of wafer-level chip scale packaging (WLCSP), and technological innovations in wafer thinning processes.
The expanding smartphone and consumer electronics market are anticipated to drive the growth of the thin wafer market. Consumer electronics encompass electronic devices designed for daily, non-commercial, or professional use by end-users. These devices, powered by electricity and featuring circuit boards, utilize thin wafers for fabricating integrated circuits and enabling high-density packaging in compact or microelectronic devices that power consumer electronics. The surge in the smartphone and consumer electronics market is evident, with 71.8 million mobile connections in the UK, representing a 3.8% increase in 2022 compared to 2021. Additionally, consumer electronics spending has witnessed a 20% rise since 2020, with smartphones contributing significantly to the $481 billion revenue generated in 2021. Projections indicate this revenue surpassing $500 billion by 2026, affirming the substantial impact of the growing consumer electronics market on the thin wafer market.
The increasing adoption of Internet of Things (IoT) devices is poised to fuel the growth of the thin wafer market. IoT encompasses interconnected devices and the technology facilitating communication between them and the cloud. These devices play a pivotal role in thin wafer manufacturing by facilitating real-time monitoring, data collection, process optimization, and quality control. In 2021, there were 12.2 billion active endpoints in the IoT ecosystem, marking an 8% increase in total IoT connections. The IoT industry is expected to witness an 18% growth, reaching 14.4 billion active connections in 2022. This surge in IoT adoption underscores its role in driving the growth of the thin wafer market.
Technological advancement emerges as a prominent trend in the thin wafer market, with major companies emphasizing the development of new cleaning technology to fortify their market position. For instance, in May 2022, Soitec, a France-based semiconductor company, introduced a 200-mm SmartSiC-engineered substrate tailored for automotive applications. This innovative 200mm SmartSiC wafer enhances power electronics device performance and energy efficiency for electric vehicles. Soitec's commitment to innovation and meeting industry demands is evident in its efforts to advance cleaning technology and deliver improved solutions for automotive applications.
Major companies in the thin wafer market are actively focusing on introducing innovative silicone film-forming emulsions to gain a competitive advantage. A silicone film-forming emulsion is a stable mixture of silicone-based polymers or resins dispersed in water, typically formulated as an emulsion. This development is exemplified by Shin-Etsu Chemical Co., Ltd., a Japan-based chemical company, which introduced the industry's first silicone film-forming emulsion in October 2022. This product offers several advantages, including not requiring a metallic curing catalyst, serving as a low-VOC (volatile organic compound) emulsion, and minimizing unwanted low-molecular-weight siloxanes. Specifically designed for fiber-treatment applications, this product is part of a line of silicone emulsions characterized by their eco-friendliness, safety, and user-friendliness.
In June 2022, Applied Materials, Inc., a US-based global semiconductor materials engineering solutions provider, made a strategic move by acquiring Picosun Oy for an undisclosed amount. This acquisition was aimed at leveraging Picosun's atomic layer deposition (ALD) technology and thin wafer solutions for specialty semiconductors. By integrating Picosun's ALD technology, Applied Materials sought to enhance its capabilities in ICAPS markets, strengthen its portfolio, and create opportunities for accelerated growth in its customer base. Picosun Oy, based in Finland, was recognized as an innovative provider of ALD technology and thin wafer solutions, making it a valuable addition to Applied Materials' strategic expansion efforts.
Major companies operating in the thin wafer market report are 3M Company, Applied Materials Inc., Brewer Science Inc., DISCO Corporation, EV Group, GlobalWafers Co. Ltd., Shin-Estu Chemical Co. Ltd., Sil'tronix Silicon Technologies, SK Siltron Co. Ltd., SUMCO Corporation, SUSS MicroTec, Synova S A, Virginia Semiconductor Inc., ULVAC GmbH, Wafer Works Corporation, Atecom Technology Co. Ltd., UniversityWafer Inc., Mechatronic Systemtechnik GmbH, Soitec, My-Chip Production GmbH, Polishing Corporation of America, Kulicke & Soffa Industries Inc., SunEdison Semiconductor, LG Siltronic, Han's Laser Technology Industry Group Co. Ltd., ASM Pacific Technology Ltd., Aixtron SE, SPTS Technologies Limited, Nuvonyx Inc., Semiconductor Equipment Corporation
Asia-Pacific was the largest region in the thin wafer market analysis in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the thin wafer market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the thin wafer market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The thin wafer market consists of sales of silicon wafers and sapphire wafers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods. The thin wafer market is segmented into silicon wafers, sapphire wafers and other wafers.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.