Flip Chip Global Market Report 2024

“Flip Chip Global Market Report 2024 ” from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on flip chip market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for flip chip? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? “The flip chip market global report ” from The Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

Scope

Markets Covered:

• 1) By Packaging Technology: 3D IC; 2.5D IC; 2D IC
• 2) By Bumping Technology: Copper Pillar; Solder Bumping; Tin-Lead Eutectic Solder; Lead-Free Solder
• 3) By Industry: Electronics; Heavy Machinery and Equipment; IT and Telecommunication; Automotive; Other Industries
• Companies Mentioned: 3M Company; Advanced Micro Devices Inc.; Amkor Technology Inc.; Apple Inc.; Fujitsu Limited.
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Executive Summary

Flip chips, also known as direct chip attach, involve attaching interconnecting dies, such as semiconductor devices, IC chips, integrated passive devices, and microelectromechanical systems (MEMS), bond pad side down to a substrate or carrier. This packaging approach offers several advantages, including lower cost, high packaging density, improved circuit reliability, and compact dimensions. In the flip-chip packaging process, the chip is linked to the substrate of a package carrier. Any surface of a flip chip can be interconnected, typically using copper, nickel, or soldered metal bumps. These bumps, installed on the die surface, facilitate the electrical connection between the device and the package substrate.

The main types of flip chip packaging technologies include 3D IC, 2.5D IC, and 2D IC. 3D ICs involve creating an integrated circuit (IC) in three dimensions by stacking various chips or wafers vertically into a single package. Different flip chip bumping technologies include copper pillar, solder bumping, tin-lead eutectic solder, and lead-free solder. Flip chips find applications across various industries such as electronics, heavy machinery and equipment, IT and telecommunications, automotive, and others.

The flip chip market research report is one of a series of new reports from The Business Research Company that provides flip chip market statistics, including flip chip industry global market size, regional shares, competitors with a flip chip market share, detailed flip chip market segments, market trends and opportunities, and any further data you may need to thrive in the flip chip industry. This flip chip market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The flip chip market size has grown rapidly in recent years. It will grow from $34.9 billion in 2023 to $38.88 billion in 2024 at a compound annual growth rate (CAGR) of 11.4%. The growth observed in the historical period can be attributed to several factors, including the trends toward miniaturization and size reduction in electronic devices, the pursuit of improved electrical performance, the growth of the consumer electronics sector, advancements in heat dissipation technologies, and the increasing demand for higher speed and data transmission capabilities. These factors collectively contributed to the adoption and development of flip chip packaging technologies during the historic period, reflecting the industry's response to evolving technological needs and consumer preferences.

The flip chip market size is expected to see rapid growth in the next few years. It will grow to $60.48 billion in 2028 at a compound annual growth rate (CAGR) of 11.7%. The anticipated growth in the forecast period can be attributed to various factors, including the increasing demand for flip chip technology in automotive electronics, the need for high-density interconnects in electronic devices, the adoption of heterogeneous integration approaches, the integration of 3D IC technology, and advancements in semiconductor materials. Major trends expected in the forecast period encompass the expansion of 5G and high-performance computing, the proliferation of the Internet of Things (IoT), advancements in advanced packaging technologies, the acceleration of artificial intelligence (AI) and machine learning applications, and the development of quantum computing.

The growth of the flip chips market is expected to be propelled by the increasing sales of electronic products during the forecast period. Flip chip technology plays a crucial role in enhancing the performance of portable electronic devices, especially those operating at higher frequencies, making them suitable for applications in ultrasonic and microwave operations. Renowned for its high overall system efficiency, low inductance, and space-saving attributes, flip chip technology is integral to the design of electronic equipment. According to estimates by Gartner, a prominent US-based consulting firm, the global installed base of electronic devices is projected to reach 6.4 billion units in 2022, indicating a 3.2% increase from the previous year. This surge in electronic product sales significantly contributes to the growth of the flip chips market.

The growth trajectory of the flip chips market is further anticipated to be driven by the increasing demand for wearable devices. Wearable devices, encompassing products like smartwatches and fitness trackers, leverage flip chip technology for efficient data processing, sensor integration, and wireless communication. This trend is exemplified by the shipment of 533.6 million wearable devices in 2021, including watches, hearing aids, and other assistive devices, as reported by Vicert, a US-based digital health solution software company. The rising popularity and integration of wearable technology contribute to the expanding market for flip chips.

A notable trend in the flip chips market is the emphasis on technological advancement by key industry players. Companies operating in the flip chip market are actively involved in the development of cutting-edge technologies to reinforce their market position. In August 2021, ACM Research Inc., a prominent US-based single-wafer wet cleaning equipment company, introduced the Ultra ECP GIII plating tool. This tool, designed to support wafer-level packaging (WLP), offers specialized solutions for silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide for compound semiconductors (GaAs). Its capabilities extend to gold (Au) plating in backside deep hole processes, ensuring uniformity and step coverage. This technological innovation showcases the commitment of industry players to stay at the forefront of advancements in the flip chip market.

Key players in the flip chip market are directing their efforts towards product innovation, particularly in the realm of technology, exemplified by the introduction of FC-BGA (Flip Chip Ball Grid Array). FC-BGA serves as a flip chip designed to establish a connection between a semiconductor die and a printed circuit board (PCB). In August 2021, Daeduk Electronics Co., Ltd., a prominent electronics company based in South Korea, unveiled the FC-BGA (Flip Chip Ball Grid Array). This innovative product incorporates high-density interconnect technology and finds applications in cutting-edge fields such as artificial intelligence (AI), autonomous driving, and other high-performance semiconductor domains.

In a strategic move to enhance its capabilities and advance chip designs for various devices, including smartphones and automobiles, Qualcomm, a leading US-based company specializing in semiconductors, software, and wireless technology services, acquired Nuvia for a substantial $1.4 billion in January 2021. Qualcomm's acquisition of Nuvia is aimed at leveraging Nuvia's expertise to develop flagship smartphones, next-generation laptops, digital cockpits, advanced driver-assistance systems (ADAS), extended reality (XR), and infrastructure networking solutions. Nuvia, based in the United States, is recognized for its proficiency in silicon design tailored for high-performance computing environments.

Major companies operating in the flip chip market include 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsung Electronics Co. Ltd., Texas Instruments Incorporated, ASE Technology Holding Co. Ltd., Chipbond Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co. Ltd., Unimicron Technology Corporation, Ibiden Co. Ltd., Nan Ya Printed Circuit Board Corporation, Shiko Electric Industries Co. Ltd., Austria Technologie & Systemtechnik AG, Kinsus Interconnect Technology Corporation, STATS ChipPAC Pte. Ltd., Powertech Technology Inc., UTAC Holdings Ltd., Taiwan Semiconductor Manufacturing Co., TF-AMD Microelectronics Sdn Bhd., Zhen Ding Technology Holding Ltd., Engent Inc., Masterwork Electronics, Advotech Company Inc., First Level Inc., Flipchip International LLC, Cormetech Inc., DCL International Inc.

Asia-Pacific was the largest region in the flip chip market in 2023 and is expected to be the fastest-growing region in the forecast period. The regions covered in flip chip market analysis report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

The countries covered in the flip chip market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA.

The flip chips market consists of revenues earned by entities by providing flip chip services such as interconnecting semiconductor devices, IC chips, and integrated passive devices. The market value includes the value of related goods sold by the service provider or included within the service offering. The flip chip market also includes sales of integrated circuits (ICs), infrared sensors, large-area pixelated detector arrays, optical devices, micro-electrical mechanical systems (MEMS), and surface acoustic wave (SAW) devices. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.