3D Printed Electronics 2023: Market Study & Forecast

Table of Contents

Executive Summary

• Defining the value propositions of 3D Electronics Printing
• Miniaturisation
• Design Freedom
• Reshoring and localisation9
• Sustainability
• Challenges to market growth
• Key players in the 3D Electronics Printing Space
• The industry remains consolidated around a small number of player
• Low-cost 3DEP providers reduce barriers to entry
• Forecasting the growth of the market

Chapter One: Trends, opportunities and challenges

• Background and context to this report
• Reading this report
• Trends, Opportunities, and challenges in the 3D printing electronics space
• The current and future potential for 3D printing electronics technologies and applications
• Mapping the current competitive landscape
• Building a future view of the industry and forecasting its opportunity for growth
• The current 3D printing electronics space
• 3D Electronics Printing prepares to move from the lab to the factory
• Electronics prototyping remains the go-to application
• Moving PCB prototyping in-house
• Standing at the precipice of commercial 3D printed electronics
• Notable trends driving the direction of the industry
• Sustainability
• Reducing material consumption in prototyping
• Recyclability through design
• Miniaturisation of devices reducing life cycle impact
• Supply Chain security and compression
• Supporting Semiconductor production using conventional 3D printing
• Creating helpful incentives to produce semiconductors (CHIPs) act
• Opportunities
• Internet of things
• Conformal printing of antenna within IoT devices
• Volumetric IoT
• Flexible IoT
• Low volume, high mix electronics become increasingly viable
• Miniaturisation of electronics
• Off-setting the limitations of physics through compact circuit design
• Interconnects
• Passives
• Embedded and stacked components and vertically integrated ICs
• Protecting Intellectual Property via moving to in-house prototyping
• Freedom of Design
• Top, bottom and side-mounted components, adding another angle to circuit boards
• Higher density routing with multi-directional vias
• Challenges
• Volume production
• Overcoming production volume with SMT integration in the print process
• Continuing materials development
• Building a seamless digital thread for 3D printed electronics
• Delineation of electronic computer-aided design and mechanical computer-aided design begin to blur
• Emerging software solutions to bridge the gap

Chapter Two: Technology, Applications and Markets

• Technologies
• Technologies capable of printing conductive materials
• Polymer Powder Bed Fusion
• Vat Photopolymerization
• Technologies capable of printing static-dissipative materials
• Polymer Powder Bed Fusion
• Vat Photopolymerisation
• Material Extrusion
• 3D Electronic Printing Technologies
• Inkjet Printing
• Aerosol Jet Printing
• Extrusion-Based Printing
• Materials
• Conductive Inks
• Silver Nanoparticle Inks
• Extrusion materials and limitations
• Dielectric inks and resins
• Applications
• PCBs
• 3D printed multi-layer PCBs
• Future of printed PCBs
• Connectors and Interconnects
• Antennas, Amplifiers and Transceiver
• 3DEP supporting advanced antenna production
• Multi-material printing of next-generation antenna
• Rise of 6G
• Capacitors
• Sensors
• Quantum sensors
• Beyond the PCB: 3DEP innovations in next-generation components and applications
• Optoelectronics
• Batteries
• Lab-on-chips

Chapter Three: Market players

• Nano Dimension, Israel, 2012
• Nano Dimensions attempts to acquire Stratasys
• Financial performance
• Technology-Dragonfly IV
• Materials
• Partnerships
• Optomec, United States, 1997
• Technology
• Aerosol Jet Printer Portfolio
• Aerosol jet HD2
• Aerosol Jet AJ Flex
• Aerosol Jet Print Engine
• Bot Factory, United States, 2013
• Ceradrop, France, 2006
• Ceradrop Technology
• F-serie
• X-Serie
• Industrial platform
• Chemcubed, United States, 2014
• NeoTech, Germany, 2006
• Technology
• 15X BT
• 45XG4
• PV Nanocell, Israel, 2010
• Voltera, Canada, 2013
• Fujifilm Corporation, Japan, 1934
• Technology
• Panasonic, Japan, 1918
• Additive Electronics, Germany, 2022
• Notion Systems, Germany, 2012
• nScrypt, United States, 2002
• Nano3DPrint, United States, 2013
• Entry into the professional space with the D4200S

Chapter Four: Ten year forecasts

• Methodology
• Pricing
• Service revenue
• Industry
• 3D printer categorisation
• Total market
  • Exhibit 4.1: Total market for 3D Electronics Printing, by USD$ revenue
  • Exhibit 4.2: Total market for 3D Electronics Printing, by USD$ share
  • Exhibit 4.3: Total market for 3D Electronics Printing, by YoY growth change Hardware
  • Exhibit 4.4: 3D Electronics Printing Hardware Growth, by revenue and YoY change
  • Exhibit 4.5: 3D Electronics Printing Hardware Growth, by printer type
  • Exhibit 4.6: 3D Electronics Printing Hardware Shipments and Install Base
  • Exhibit 4.7: 3D Electronics Printing Hardware Shipments by Printer Category
  • Exhibit 4.8: 3D Electronics Printing Install Base by Printer Category
  • Exhibit 4.9: 3D Electronics Printing Hardware, by Industry
  • Exhibit 4.10: 3D Electronics Printing Hardware, by Industry Share Material
  • Exhibit 4.11: 3D Electronics Printing Material Revenue Growth and Year-on-Year Growth
  • Exhibit 4.12: 3D Electronics Printing Material Revenue by Material Type
  • Exhibit 4.13: 3D Electronics Printing Material Revenue Share by Type
  • Exhibit 4.14: 3D Electronics Printing Material Revenue by Printer Category
  • Exhibit 4.15: 3D Electronics Printing Material Revenue by Printer Category Share
  • Exhibit 4.16: 3D Electronics Printing Material Revenue by industry Services
  • Exhibit 4.17: 3D Electronics Printing Service Revenue Growth and Year-on-Year Growth
  • Exhibit 4.18: 3D Electronics Printing Service Revenue by provider
  • Exhibit 4.19: 3D Electronics Printing Service Revenue by Share
• About Additive Manufacturing Research
• About the Analyst
• Acronyms and Abbreviations Used In this Report