Asia Pacific Wi-Fi Chipset Market Size- By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User- Regional Outlook, Competitive Strategies and Segment Forecast to 2033

Description

Asia Pacific Wi-Fi Chipset Market Introduction and Overview

According to SPER market research, 'Asia Pacific Wi-Fi Chipset Market Size - By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User - Regional Outlook, Competitive Strategies and Segment Forecast to 2033' state that the Asia Pacific Wi-Fi Chipset Market is predicted to reach USD 8919.14 million by 2033 with a CAGR of 3.45%.

Wi-Fi technology has gained in popularity as smartphones become more widely used around the world. Customers choose Voice-Over Mobile Broadband (VOMBB) over traditional telecom carriers because to its superior audio quality, low cost, and ability to conserve power, hence increasing demand for Wi-Fi services.

Furthermore, due to short-term production shutdowns, supply chain interruptions, and a lack of linked product availability, the IoT connection market is predicted to experience an 18% decrease in net device additions in 2020.

Scope of the Report:

Report Metric Details

Market size available for years 2020-2033

Base year considered 2023

Forecast period 2024-2033

Segments covered By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User

Regions covered China, Japan, India, South Korea, Australia, Indonesia, Others

Companies Covered Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO. LTD, Broadcom, Hitachi, Cisco Systems. Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.

Asia Pacific Wi-Fi Chipset Market Segmentation:

By Device: Based on the Device, Asia Pacific Wi-Fi Chipset Market is segmented as; Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others.

By Wi-Fi Standard: Based on the Wi-Fi Standard, Asia Pacific Wi-Fi Chipset Market is segmented as; 802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others.

By MIMO Configuration: Based on the MIMO Configuration, Asia Pacific Wi-Fi Chipset Market is segmented as; MU-MIMO, 4X4 MU-MIMO, 8X8 MU-MIMO, SU-MIMO, 3X3 MU-MIMO, 2X2 MU-MIMO, 1X1 MU-MIMO.

By Region: This research includes data for China, Japan, India, South Korea, Australia, Indonesia, Others.

Product Code: IACT24150

1. Introduction

1.1. Scope of the report
1.2. Market segment analysis

2. Research Methodology

2.1. Research data source
- 2.1.1. Secondary Data
- 2.1.2. Primary Data
- 2.1.3. SPER's internal database
- 2.1.4. Premium insight from KOL's
2.2. Market size estimation
- 2.2.1. Top-down and Bottom-up approach
2.3. Data triangulation

3. Executive Summary

4. Market Dynamics

4.1. Driver, Restraint, Opportunity and Challenges analysis
- 4.1.1. Drivers
- 4.1.2. Restraints
- 4.1.3. Opportunities
- 4.1.4. Challenges
4.2. COVID-19 Impacts of the Asia Pacific Wi-Fi Chipset Market

5. Market variable and outlook

5.1. SWOT Analysis
- 5.1.1. Strengths
- 5.1.2. Weaknesses
- 5.1.3. Opportunities
- 5.1.4. Threats
5.2. PESTEL Analysis
- 5.2.1. Political Landscape
- 5.2.2. Economic Landscape
- 5.2.3. Social Landscape
- 5.2.4. Technological Landscape
- 5.2.5. Environmental Landscape
- 5.2.6. Legal Landscape
5.3. PORTER's Five Forces
- 5.3.1. Bargaining power of suppliers
- 5.3.2. Bargaining power of buyers
- 5.3.3. Threat of Substitute
- 5.3.4. Threat of new entrant
- 5.3.5. Competitive rivalry
5.4. Heat Map Analysis

6. Competitive Landscape

6.1. Asia Pacific Wi-Fi Chipset Market Manufacturing Base Distribution, Sales Area, Product Type
6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Asia Pacific Wi-Fi Chipset Market

7. Asia Pacific Wi-Fi Chipset Market, By Device (USD Million) 2020-2033

7.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2020-2026
7.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2027-2033
7.3. Tablet
7.4. Connected Home Devices
7.5. Smartphones
7.6. PCS
7.7. Access Point Equipment
7.8. Others

8. Asia Pacific Wi-Fi Chipset Market, By Band (USD Million) 2020-2033

8.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2020-2026
8.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2027-2033
8.3. Single Band
8.4. Dual Band
8.5. Tri Band

9. Asia Pacific Wi-Fi Chipset Market, By Fabrication Technology (USD Million) 2020-2033

9.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2020-2026
9.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2027-2033
9.3. Finfet
9.4. FDSOI CMOS
9.5. Silicon on Insulator
9.6. Sige

10. Asia Pacific Wi-Fi Chipset Market, By Wifi Standard (USD Million) 2020-2033

10.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2020-2026
10.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2027-2033
10.3. 802.11AY
10.4. 802.11AD
10.5. 802.11AX
10.6. 802.11AC
10.7. WAVE 1
10.8. 802.11AC
10.9. WAVE 2
10.10. 802.11B
10.11. 802.11G
10.12. 802.11N

11. Asia Pacific Wi-Fi Chipset Market, By MIMO Configuration (USD Million) 2020-2033

11.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2020-2026
11.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2027-2033
11.3. SU-MIMO
11.4. MU-MIMO
11.5. 1X1 MU-MIMO
11.6. 2X2 MU-MIMO
11.7. 3X3 MU-MIMO
11.8. 4X4 MU-MIMO
11.9. 8X8 MU-MIMO

12. Asia Pacific Wi-Fi Chipset Market, By End User (USD Million) 2020-2033

12.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2020-2026
12.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2027-2033
12.3. Consumer
12.4. Automotive
12.5. Transportation
12.6. Healthcare
12.7. Education
12.8. BFSI
12.9. Travel
12.10. Hospitality
12.11. Others

13. Asia Pacific Wi-Fi Chipset Market Forecast, 2020-2033 (USD Million)

13.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share

14. Asia Pacific Wi-Fi Chipset Market, By Region, 2020-2033 (USD Million)

14.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2020-2026)
14.2. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2027-2033)
14.3. China
14.4. Japan
14.5. India
14.6. South Korea
14.7. Australia
14.8. Indonesia
14.9. Others

15. Company Profile

15.1. Intel Corporation
- 15.1.1. Company details
- 15.1.2. Financial outlook
- 15.1.3. Product summary
- 15.1.4. Recent developments
15.2. Qualcomm Technologies. Inc
- 15.2.1. Company details
- 15.2.2. Financial outlook
- 15.2.3. Product summary
- 15.2.4. Recent developments
15.3. ESPRESSIF SYSTEMS (SHANGHAI) CO LTD
- 15.3.1. Company details
- 15.3.2. Financial outlook
- 15.3.3. Product summary
- 15.3.4. Recent developments
15.4. Broadcom
- 15.4.1. Company details
- 15.4.2. Financial outlook
- 15.4.3. Product summary
- 15.4.4. Recent developments
15.5. Hitachi
- 15.5.1. Company details
- 15.5.2. Financial outlook
- 15.5.3. Product summary
- 15.5.4. Recent developments
15.6. Cisco Systems, Inc
- 15.6.1. Company details
- 15.6.2. Financial outlook
- 15.6.3. Product summary
- 15.6.4. Recent developments
15.7. Microsoft
- 15.7.1. Company details
- 15.7.2. Financial outlook
- 15.7.3. Product summary
- 15.7.4. Recent developments
15.8. Apple Inc
- 15.8.1. Company details
- 15.8.2. Financial outlook
- 15.8.3. Product summary
- 15.8.4. Recent developments
15.9. Celeno Communications
- 15.9.1. Company details
- 15.9.2. Financial outlook
- 15.9.3. Product summary
- 15.9.4. Recent developments
15.10. Taiwan Semiconductor Manufacturing Company Limited
- 15.10.1. Company details
- 15.10.2. Financial outlook
- 15.10.3. Product summary
- 15.10.4. Recent developments
15.11. STMicroelectronics
- 15.11.1. Company details
- 15.11.2. Financial outlook
- 15.11.3. Product summary
- 15.11.4. Recent developments
15.12. Others