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PUBLISHER: SPER Market Research Pvt. Ltd. | PRODUCT CODE: 1273233

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PUBLISHER: SPER Market Research Pvt. Ltd. | PRODUCT CODE: 1273233

Chip Mounter Market Size- By Technology, By Application- Regional Outlook, Competitive Strategies and Segment Forecast to 2033

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Global Chip Mounter Market Overview

According to SPER Market Research, the Global Chip Mounter Market is estimated to reach USD 11.14 billion by 2033 with a CAGR of 5.79%.

A chip mounter, also known as a pick-and-place machine, is an electronic device used in the manufacturing of printed circuit boards (PCBs) to place surface-mount devices (SMDs) onto the board. The chip mounter market is a segment of the electronics manufacturing industry and has experienced significant growth in recent years due to the increasing demand for smaller, more powerful electronic devices. The chip mounter market is driven by a variety of factors, including the proliferation of smart devices and the Internet of Things (IoT), which require the use of smaller and more complex electronic components.

What challenges does the Global Chip Mounter Market face?

While the global chip mounter market has experienced significant growth in recent years, it is not without its challenges. One of the main challenges is the increasing complexity of electronic components, which has led to a need for more advanced and precise chip mounters. This has made it difficult for smaller companies to compete in the market, as they may not have the resources to invest in the latest technology.

Scope of the Report

Report Metric Details:

  • Market size available for years: 2019-2033
  • Base year considered: 2022
  • Forecast period: 2023-2033
  • Segments covered: By Technology, By Application.
  • Regions covered: Asia-Pacific, Europe, Middle East and Africa, North America, Latin America
  • Companies Covered: ASM Pacific Technology, Canon, Essemtech, Hitachi, Juki, Nordson, Ohashi Engineering, Panasonic, Samsung, Sony

Global Chip Mounter Market Segmentation:

  • By Technology: Based on the Technology, Global Chip Mounter Market is segmented as; Hole Technology, Surface Mount Technology, Fine Pitch Technology.
  • By Application: Based on the Application, Global Chip Mounter Market is segmented as; Consumer Electronics, Medical, Automotive, Telecommunication, Others.
  • By Region: This report also provides the data for key regional segments of Asia-Pacific, Europe, Middle East and Africa, North America, Latin America.
Product Code: MACH2324

Table of Contents

1. Introduction

  • 1.1. Scope of the report
  • 1.2. Market segment analysis

2. Research Methodology

  • 2.1. Research data source
    • 2.1.1. Secondary Data
    • 2.1.2. Primary Data
    • 2.1.3. SPER's internal database
    • 2.1.4. Premium insight from KOL's
  • 2.2. Market size estimation
    • 2.2.1. Top-down and Bottom-up approach
  • 2.3. Data triangulation

3. Executive Summary

4. Market Dynamics

  • 4.1. Driver, Restraint, Opportunity and Challenges analysis
    • 4.1.1. Drivers
    • 4.1.2. Restraints
    • 4.1.3. Opportunities
    • 4.1.4. Challenges
  • 4.2. COVID-19 Impacts of the Global Chip Mounter Market

5. Market variable and outlook

  • 5.1. SWOT Analysis
    • 5.1.1. Strengths
    • 5.1.2. Weaknesses
    • 5.1.3. Opportunities
    • 5.1.4. Threats
  • 5.2. PESTEL Analysis
    • 5.2.1. Political Landscape
    • 5.2.2. Economic Landscape
    • 5.2.3. Social Landscape
    • 5.2.4. Technological Landscape
    • 5.2.5. Environmental Landscape
    • 5.2.6. Legal Landscape
  • 5.3. PORTER's Five Forces
    • 5.3.1. Bargaining power of suppliers
    • 5.3.2. Bargaining power of buyers
    • 5.3.3. Threat of Substitute
    • 5.3.4. Threat of new entrant
    • 5.3.5. Competitive rivalry
  • 5.4. Heat Map Analysis

6. Competitive Landscape

  • 6.1. Global Chip Mounter Market Manufacturing Base Distribution, Sales Area, Product Type
  • 6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Chip Mounter Market

7. Global Chip Mounter Market, By Technology (USD Million)

  • 7.1. Global Chip Mounter Market Value Share and Forecast, By Technology, 2023-2033
  • 7.2. Hole Technology
  • 7.3. Surface Mount Technology
  • 7.4. Fine Pitch Technology

8. Global Chip Mounter Market, By Application (USD Million)

  • 8.1. Global Chip Mounter Market Value Share and Forecast, By Application, 2023-2033
  • 8.2. Consumer Electronics
  • 8.3. Medical
  • 8.4. Automotive
  • 8.5. Telecommunication
  • 8.6. Others

9. Global Chip Mounter Market Forecast, 2019-2033 (USD Million)

  • 9.1. Global Chip Mounter Market Size and Market Share

10. Global Chip Mounter Market, By Technology, 2019-2033 (USD Million)

  • 10.1. Global Chip Mounter Market Size and Market Share By Technology (2019-2026)
  • 10.2. Global Chip Mounter Market Size and Market Share By Technology (2027-2033)

11. Global Chip Mounter Market, By Application, 2019-2033 (USD Million)

  • 11.1. Global Chip Mounter Market Size and Market Share By Application (2019-2026)
  • 11.2. Global Chip Mounter Market Size and Market Share By Application (2027-2033)

12. Global Chip Mounter Market, By Region, 2019-2033 (USD Million)

  • 12.1. Global Chip Mounter Market Size and Market Share By Region (2019-2026)
  • 12.2. Global Chip Mounter Market Size and Market Share By Region (2027-2033)
  • 12.3. Asia-Pacific
    • 12.3.1. Australia
    • 12.3.2. China
    • 12.3.3. India
    • 12.3.4. Japan
    • 12.3.5. South Korea
    • 12.3.6. Rest of Asia-Pacific
  • 12.4. Europe
    • 12.4.1. France
    • 12.4.2. Germany
    • 12.4.3. Italy
    • 12.4.4. Spain
    • 12.4.5. United Kingdom
    • 12.4.6. Rest of Europe
  • 12.5. Middle East and Africa
    • 12.5.1. Kingdom of Saudi Arabia
    • 12.5.2. United Arab Emirates
    • 12.5.3. Rest of Middle East & Africa
  • 12.6. North America
    • 12.6.1. Canada
    • 12.6.2. Mexico
    • 12.6.3. United States
  • 12.7. Latin America
    • 12.7.1. Argentina
    • 12.7.2. Brazil
    • 12.7.3. Rest of Latin America

13. Company Profile

  • 13.1. ASM Pacific Technology
    • 13.1.1. Company details
    • 13.1.2. Financial outlook
    • 13.1.3. Product summary
    • 13.1.4. Recent developments
  • 13.2. Canon
    • 13.2.1. Company details
    • 13.2.2. Financial outlook
    • 13.2.3. Product summary
    • 13.2.4. Recent developments
  • 13.3. Essemtech
    • 13.3.1. Company details
    • 13.3.2. Financial outlook
    • 13.3.3. Product summary
    • 13.3.4. Recent developments
  • 13.4. Hitachi
    • 13.4.1. Company details
    • 13.4.2. Financial outlook
    • 13.4.3. Product summary
    • 13.4.4. Recent developments
  • 13.5. Juki
    • 13.5.1. Company details
    • 13.5.2. Financial outlook
    • 13.5.3. Product summary
    • 13.5.4. Recent developments
  • 13.6. Nordson
    • 13.6.1. Company details
    • 13.6.2. Financial outlook
    • 13.6.3. Product summary
    • 13.6.4. Recent developments
  • 13.7. Ohashi Engineering
    • 13.7.1. Company details
    • 13.7.2. Financial outlook
    • 13.7.3. Product summary
    • 13.7.4. Recent developments
  • 13.8. Panasonic
    • 13.8.1. Company details
    • 13.8.2. Financial outlook
    • 13.8.3. Product summary
    • 13.8.4. Recent developments
  • 13.9. Samsung
    • 13.9.1. Company details
    • 13.9.2. Financial outlook
    • 13.9.3. Product summary
    • 13.9.4. Recent developments
  • 13.10. Sony
    • 13.10.1. Company details
    • 13.10.2. Financial outlook
    • 13.10.3. Product summary
    • 13.10.4. Recent developments

14. List of Abbreviations

15. Reference Links

16. Conclusion

17. Research Scope

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