Bonding Sheet Market Forecasts to 2030 - Global Analysis By Adhesive Material, End User and By Geography

According to Stratistics MRC, the Global Bonding Sheet Market is accounted for $422.53 million in 2023 and is expected to reach $792.47 million by 2030 growing at a CAGR of 9.4% during the forecast period. A bonding sheet is a sheet or film used for surface covering or bonding that has a cement coating on one side. To prevent an early grip, it has a separate paper discharge layer. Despite occasionally is available in finished variations, it is often reflexive and smooth. It goes under a variety of names, including sheet glue, unadulterated cement, and just glue. A Bonding sheet is typically employed in multi-facet coverings to join flexible interior layers or stiff cap layers. It is frequently used for creating intensity sinks, rigid flex PCBs, bond stiffeners, and other components to attach flexible circuits to unbending flex sheets. In addition, it is used for elaborate overlays.

Market Dynamics:

Driver:

Rising automobile sector

Display screens, circuit boards, and other components are adhered to these sheets. For holding and fixing electronics assemblies for electronic control and advanced driver assistance system components, bonding sheet is also being used more and more. The demand for bonding sheets is expected to increase throughout the projected period as a result of the expanding automotive sector globally, the growing emphasis on modernizing passenger vehicles, and the integration of cutting-edge technologies including driver assistance and monitoring systems.

Restraint:

Geopolitical unpredictability

The development of AI, IoT, and telecom infrastructure has led to a boom in the electronics and semiconductor industries. The supply of semiconductor components is crucial to the industry. China and Southeast Asia are the main manufacturing regions for these components. The semiconductor sector is being impacted by international trade issues as well as rivalries between the US and China over technological superiority. The COVID-19 epidemic has had an unknown impact on the business as well. Because of the presence of international cooperation and intense rivalry, the semiconductor supply chain is unclear.

Opportunity:

Growing demand for lightweight transportation equipment

The automobile industry is increasingly moving away from traditional steels in favour of composites, low-density alloys like aluminum and magnesium, and ultra-high strength steels. Lightweight cars have a considerable potential to increase vehicle economy since they accelerate more quickly with less energy than heavier ones. New bonding processes are needed for these new materials. Bonding sheet provides flexibility in design, defense against vibration and stress from moving vehicles, and extended shelf life. The amount of vehicle parts, such as fasteners, that are needed can be greatly reduced by the usage of bonding sheet. This factor is accelerating market expansion.

Threat:

Risk of moisture affect

The effective bonded area between the fibers decreases as a result of moisture between the fiber-fiber linkages, which reduces the paper's stiffness and strength. The characteristics of the adhesive layer itself might be weakened by moisture. Numerous bonding sheet qualities might be negatively impacted by poor moisture management. The paper keeps the acidic breakdown products in an enclosed, airtight environment, which hastens aging. The market demand is being hampered by these factors.

COVID-19 Impact:

The COVID-19 epidemic had an effect on the world market. Supply chain breakdowns and worker impairment have an impact on the worldwide market. A number of nations throughout the world imposed lockdown restrictions, which resulted in the shutdown of production plants. The epidemic further impacted the market with travel restrictions, restricted raw material supply, operating constraints, and decreased import and export activity. Nevertheless, the pandemic saw a spike in demand for these sheets from the consumer electronics and healthcare industries.

The polyimides segment is expected to be the largest during the forecast period

The polyimides segment is estimated to have a lucrative growth, due to its high efficiency, performance, and thermal properties. In particular, polyamide is resistant to wear and scrapes. Its exceptional strength is a result of this feature. Wires and cables in caustic environments are better protected by polyamides since they have a strong resilience to chemicals. It gives better mechanical characteristics, more tensile strength, and heat and chemical resistance. The market's expansion is being sped up by all these qualities.

The electronics segment is expected to have the highest CAGR during the forecast period

The electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. Chips, hard drives, LED modules, and other electronic components are held and adhered to one another using bonding sheets in the electronics industry. The demand for bonding sheets for electronics and optoelectronics applications is rising as a result of the development of consumer electronics products that integrate artificial intelligence (AI), the internet of things (IoT), and new trends of smart gadgets.

Region with largest share:

Asia Pacific is projected to hold the largest market share during the forecast period. The region's high population, accelerating industrial expansion, and strict environmental regulations can all be directly linked to the rise in demand for bonding sheet. Additionally, the increasing number of applications in the region is encouraging innovations and advances in the bonding sheet industry, which is supporting the expansion of the APAC bonding sheet market.

Region with highest CAGR:

Asia Pacific is projected to have the highest CAGR over the forecast period. Consumer's rising disposable incomes, bettering lifestyles, and the growing use of mobile devices all contribute to the market's expansion. The expansion of the market in the region is supported by the economic development and industrialization of China, Japan, Australia, and India, the rising sales of passenger cars, and the thriving construction industry. To take advantage of the cheap labor and raw resources in emerging nations, multinational corporations are establishing manufacturing facilities there. The huge applications of bonding sheets in electronics and automotive sectors is driving the market growth in the region.

Key players in the market:

Some of the key players profiled in the Bonding Sheet Market include: DuPont, Namics Corporation, Fujikura Ltd, Nikkan Industries Co.,Ltd, Microcosm Technology Co., Ltd, Dexerials Corporation, Nitto Denko Corporation, Arisawa Manufacturing Corporation, Hanwha Solutions Advanced Materials Division, Shin-Etsu Polymer Co. Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd, Qinglong Adhesives, Nippon Mektron Ltd and Toray Industries, Inc.

Key Developments:

• In May 2023, DuPont announced that it will introduce its latest Tedlar® frontsheet materials at the 2023 SNEC International Photovoltaic Power Generation and Smart Energy Exhibition. DuPont will be located at Booth W4-555 at Shanghai New International Expo Center.

• In February 2023, Nippon Paper Industries Co., Ltd. announced the establishment of a manufacturing and sales subsidiary in Hungary for CMC (carboxymethyl cellulose, product name: SUNROSE MAC®), which is one of the materials used for lithium-ion battery (LiB) anodes in electric vehicles (EV), to join its rapidly growing supply chain system in Europe.

• In February 2022, Shin-Etsu Chemical, the parent organization of Shin-Etsu Polymer Co., Ltd. is investing approximately USD 680 million in manufacturing facilities in Japan. The company has adopted the investments & expansions strategy to increase the production capacity of silicon-based products including silicon resins, fluids, and other related products. The facility is expected to increase production capacities and become operational by 2025.

Adhesive Materials Covered:

• Polyesters
• Acrylics
• Modified Epoxies
• Polyimides
• Other Adhesive Materials

End Users Covered:

• Construction
• Automotive
• Electronics
• Telecommunication
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
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• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances