PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 1531112
PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 1531112
Market Overview
In 2024, the spin-on-carbon industry produced revenue of USD 270.7 million, which is projected to experience a CAGR of 30.3% over the projection period, touching USD 1,325.2 million by the end of the decade. The major reasons propelling the development of the industry are the increasing need for enhanced wafer packaging solutions, the growing popularity of small electronic devices, and the rising complexity of integrated circuits. Furthermore, regarding semiconductor-making technologies, the growing demand for enhanced lithography processes is driving the industry development.
EUV lithography also known as extreme ultraviolet lithography is a technology that uses soft X-ray which has a wavelength of 13. 5 nm, which is considerably less than that of currently employed optical lithography. The major supplier of the EUV lithography machines that are used to create these small chips is ASML.
In terms of EUV lithography, it is possible to use a spin-on carbon hard mask as a segment of the multi-layer lithography when patterning the semiconductor wafer. Hardmask is used to cover some of the layers under it but expose only the required regions by EUV. After lithography, the hard mask layer is often removed and the underlying layers are further patterned to obtain the final structure of the semiconductor device.
Technological advancement has continued to increase the rate at which people need portable devices such as tablet PCs, laptops, Smartphones, and other small portable electronic devices. On the convenience side, there are compact devices, which means that users can take their computing with them wherever they go.
Key Insights
Hot-temperature spin-on-carbon (HTC) materials accounted for 70% of the market share in 2024.
HTC materials are designed to endure high temperatures in semiconductor manufacturing.
Processes involving elevated temperatures include chemical vapor deposition (CVD), physical vapor deposition (PVD), and annealing.
HTC materials offer chemical resistance and low outgassing.
Normal-temperature spin-on-carbon (NTC) materials are used as an underlayer in photolithography processes.
NTC materials are suitable for environments requiring carbon hard masks but not high temperature resistance, functioning well up to 200°C.
Power devices held the second-largest market share at 20% in 2024 due to the demand for high-energy and power-efficient devices.
MOSFETs and IGBTs are key components in power electronics, crucial for converting and regulating electrical power.
Logic devices, including microprocessors and integrated circuits (ICs), also hold a significant market share.
SoC materials enhance the performance and reliability of logic devices, aiding in planarization for multilayer structures.
Advanced wafer packaging techniques like fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and 3D packaging have gained popularity.
Foundries dominated the market with a 55% share in 2024, driven by the adoption of consumer electronics.
Consumer electronics growth boosts demand for SoC materials, with a 2.8% revenue increase from 2021, driven by smartphones and other devices.
North America held the largest share at 45% in 2024, growing at the highest CAGR due to leading market players and government initiatives like the CHIPS Act.
APAC also held a significant market share, driven by rising demand for consumer electronics, economic growth, and initiatives like China's 14th Five-Year Plan for semiconductor self-sufficiency.