Chiplet Market Size & Share Analysis - Trends, Drivers, Competitive Landscape, and Forecasts (2024

Description

Market Overview

In 2024, the worldwide chiplet industry is estimated to have valued at USD 12.5 billion, and the industry size is estimated to attain USD 537.4 billion by the end of the decade, growing at a CAGR of 87.1% over the projection period.

The major reasons propelling the development of the industry are the increasing usage of AI and IoT, growing degree of miniaturization in electronic devices, and rising need for data processing and storage. Furthermore, the growing acceptance of high-performance computing (HPC) servers in numerous sectors, along with the acceptance of enhanced packaging techs, is driving the development of the industry.

Thus, the higher disposable income leads to customers spending more on technically superior consumer electronics device to further boost the advance of the market. A survey that was conducted in Europe for the year 2021 revealed that above 50% of the population spent considerably more time on devices than last year.

Similarly in Spain, 70% of it being owned by them. Smart wearable devices are commonly used devices like smart bands and smartwatches, which are used for health and fitness tracking. It monitors various physiological activity and human momentum thru different sensors like GPS, skin capacitance sensors, accelerometers.

The use of chiplets has many advantages for the smart implants and their architectures. Medical implants could therefore be challenging in terms of performance requirements including low leakage currents and potentially high voltage up to 20V depending on the application, which could imply use of a unique process node different from the digital node sizes.

Key Insights

Central processing unit category holds 40% market share in 2024.

Chiplet technology enhances performance, efficiency, and adaptability.

Modular design allows for specialized chiplets (CPU cores, cache, I/O controllers, accelerators).

Intel launched chiplet-based processors, Sapphire Rapids and Ponte Vecchio GPU, in January 2023.

GPU category witnessing significant growth.

Driven by rising investment in gaming and high-volume media content production.

Increasing demand for AR, VR, and AI technologies requiring high-speed analysis.

AI ASIC coprocessor category projected to grow at the highest CAGR, around 87.5%, during 2024-2030.

Rising demand for specialized hardware accelerators in AI applications.

AI-related tasks offloaded to chiplet-based AI ASICs for better performance and energy efficiency.

2.5D/3D packaging holds the largest share in 2024.

Integrates CPU, GPU, memory, and decoupling capacitor.

Used in CPU, mobile AP, Si photonics, display driver ICs, and automobiles.

Flip chip chip scale package (FCCSP) holds significant market share

Widely used in smartphones, laptops, and portable gaming devices.

Suitable for high-performance mobile devices, automotive ADAS, and AI.

Enterprise electronics category dominates the market with 25% revenue in 2024.

Chiplets used in data center servers, AI accelerators, HPC systems, network equipment, and storage systems.

Growth driven by e-commerce, social media, and OTT platforms requiring high-performance computing.

APAC holds the largest share, 45%, in 2024.

Projected to grow at the highest CAGR, 87.1%, during 2024-2030.

Booming electronics sector and increasing disposable income of consumers.

Rising use of chiplets in consumer electronics, IoT, 5G networks, and high-speed telecommunications.

China investing heavily in the semiconductor industry.

North America holds a significant market share.

Presence of major players like Intel Corporation and Nvidia Corporation.

Focus on product launches and strategic initiatives.

Hub for technological advancements driving demand for chiplets.

In November 2023, Mercury Systems Inc. announced an agreement with the U.S. Navy for photonics chiplets in defense applications.

Product Code: 12989

Chapter 1. Research Scope

1.1. Research Objectives
1.2. Market Definition
1.3. Analysis Period
1.4. Market Size Breakdown by Segments
- 1.4.1. Market size breakdown, by processor
- 1.4.2. Market size breakdown, by packaging technology
- 1.4.3. Market size breakdown, by end use
- 1.4.4. Market size breakdown, by region
- 1.4.5. Market size breakdown, by country
1.5. Market Data Reporting Unit
- 1.5.1. Volume
- 1.5.2. Value
1.6. Key Stakeholders

Chapter 2. Research Methodology

2.1. Secondary Research
- 2.1.1. Paid
- 2.1.2. Unpaid
- 2.1.3. P&S Intelligence database
2.2. Primary Research
2.3. Market Size Estimation
2.4. Data Triangulation
2.5. Currency Conversion Rates
2.6. Assumptions for the Study
2.7. Notes and Caveats

Chapter 3. Executive Summary

Chapter 4. Market Indicators

Chapter 5. Industry Outlook

5.1. Market Dynamics
- 5.1.1. Trends
- 5.1.2. Drivers
- 5.1.3. Restraints/challenges
- 5.1.4. Impact analysis of drivers/restraints
5.2. Impact of COVID-19
5.3. Porter's Five Forces Analysis
- 5.3.1. Bargaining power of buyers
- 5.3.2. Bargaining power of suppliers
- 5.3.3. Threat of new entrants
- 5.3.4. Intensity of rivalry
- 5.3.5. Threat of substitutes

Chapter 6. Global Market

6.1. Overview
6.2. Market Volume, by Processor (2019-2030)
6.3. Market Revenue, by Processor (2019-2030)
6.4. Market Volume, by Packaging Technology (2019-2030)
6.5. Market Revenue, by Packaging Technology (2019-2030)
6.6. Market Volume, by End Use (2019-2030)
6.7. Market Revenue, by End Use (2019-2030)
6.8. Market Volume, by Region (2019-2030)
6.9. Market Revenue, by Region (2019-2030)

Chapter 7. North America Market

7.1. Overview
7.2. Market Volume, by Processor (2019-2030)
7.3. Market Revenue, by Processor (2019-2030)
7.4. Market Volume, by Packaging Technology (2019-2030)
7.5. Market Revenue, by Packaging Technology (2019-2030)
7.6. Market Volume, by End Use (2019-2030)
7.7. Market Revenue, by End Use (2019-2030)
7.8. Market Volume, by Country (2019-2030)
7.9. Market Revenue, by Country (2019-2030)

Chapter 8. Europe Market

8.1. Overview
8.2. Market Volume, by Processor (2019-2030)
8.3. Market Revenue, by Processor (2019-2030)
8.4. Market Volume, by Packaging Technology (2019-2030)
8.5. Market Revenue, by Packaging Technology (2019-2030)
8.6. Market Volume, by End Use (2019-2030)
8.7. Market Revenue, by End Use (2019-2030)
8.8. Market Volume, by Country (2019-2030)
8.9. Market Revenue, by Country (2019-2030)

Chapter 9. APAC Market

9.1. Overview
9.2. Market Volume, by Processor (2019-2030)
9.3. Market Revenue, by Processor (2019-2030)
9.4. Market Volume, by Packaging Technology (2019-2030)
9.5. Market Revenue, by Packaging Technology (2019-2030)
9.6. Market Volume, by End Use (2019-2030)
9.7. Market Revenue, by End Use (2019-2030)
9.8. Market Volume, by Country (2019-2030)
9.9. Market Revenue, by Country (2019-2030)

Chapter 10. LATAM Market

10.1. Overview
10.2. Market Volume, by Processor (2019-2030)
10.3. Market Revenue, by Processor (2019-2030)
10.4. Market Volume, by Packaging Technology (2019-2030)
10.5. Market Revenue, by Packaging Technology (2019-2030)
10.6. Market Volume, by End Use (2019-2030)
10.7. Market Revenue, by End Use (2019-2030)
10.8. Market Volume, by Country (2019-2030)
10.9. Market Revenue, by Country (2019-2030)

Chapter 11. MEA Market

11.1. Overview
11.2. Market Volume, by Processor (2019-2030)
11.3. Market Revenue, by Processor (2019-2030)
11.4. Market Volume, by Packaging Technology (2019-2030)
11.5. Market Revenue, by Packaging Technology (2019-2030)
11.6. Market Volume, by End Use (2019-2030)
11.7. Market Revenue, by End Use (2019-2030)
11.8. Market Volume, by Country (2019-2030)
11.9. Market Revenue, by Country (2019-2030)

Chapter 12. U.S. Market

12.1. Overview
12.2. Market Volume, by Processor (2019-2030)
12.3. Market Revenue, by Processor (2019-2030)
12.4. Market Volume, by Packaging Technology (2019-2030)
12.5. Market Revenue, by Packaging Technology (2019-2030)
12.6. Market Volume, by End Use (2019-2030)
12.7. Market Revenue, by End Use (2019-2030)

Chapter 13. Canada Market

13.1. Overview
13.2. Market Volume, by Processor (2019-2030)
13.3. Market Revenue, by Processor (2019-2030)
13.4. Market Volume, by Packaging Technology (2019-2030)
13.5. Market Revenue, by Packaging Technology (2019-2030)
13.6. Market Volume, by End Use (2019-2030)
13.7. Market Revenue, by End Use (2019-2030)

Chapter 14. Germany Market

14.1. Overview
14.2. Market Volume, by Processor (2019-2030)
14.3. Market Revenue, by Processor (2019-2030)
14.4. Market Volume, by Packaging Technology (2019-2030)
14.5. Market Revenue, by Packaging Technology (2019-2030)
14.6. Market Volume, by End Use (2019-2030)
14.7. Market Revenue, by End Use (2019-2030)

Chapter 15. France Market

15.1. Overview
15.2. Market Volume, by Processor (2019-2030)
15.3. Market Revenue, by Processor (2019-2030)
15.4. Market Volume, by Packaging Technology (2019-2030)
15.5. Market Revenue, by Packaging Technology (2019-2030)
15.6. Market Volume, by End Use (2019-2030)
15.7. Market Revenue, by End Use (2019-2030)

Chapter 16. U.K. Market

16.1. Overview
16.2. Market Volume, by Processor (2019-2030)
16.3. Market Revenue, by Processor (2019-2030)
16.4. Market Volume, by Packaging Technology (2019-2030)
16.5. Market Revenue, by Packaging Technology (2019-2030)
16.6. Market Volume, by End Use (2019-2030)
16.7. Market Revenue, by End Use (2019-2030)

Chapter 17. Italy Market

17.1. Overview
17.2. Market Volume, by Processor (2019-2030)
17.3. Market Revenue, by Processor (2019-2030)
17.4. Market Volume, by Packaging Technology (2019-2030)
17.5. Market Revenue, by Packaging Technology (2019-2030)
17.6. Market Volume, by End Use (2019-2030)
17.7. Market Revenue, by End Use (2019-2030)

Chapter 18. Spain Market

18.1. Overview
18.2. Market Volume, by Processor (2019-2030)
18.3. Market Revenue, by Processor (2019-2030)
18.4. Market Volume, by Packaging Technology (2019-2030)
18.5. Market Revenue, by Packaging Technology (2019-2030)
18.6. Market Volume, by End Use (2019-2030)
18.7. Market Revenue, by End Use (2019-2030)

Chapter 19. Japan Market

19.1. Overview
19.2. Market Volume, by Processor (2019-2030)
19.3. Market Revenue, by Processor (2019-2030)
19.4. Market Volume, by Packaging Technology (2019-2030)
19.5. Market Revenue, by Packaging Technology (2019-2030)
19.6. Market Volume, by End Use (2019-2030)
19.7. Market Revenue, by End Use (2019-2030)

Chapter 20. China Market

20.1. Overview
20.2. Market Volume, by Processor (2019-2030)
20.3. Market Revenue, by Processor (2019-2030)
20.4. Market Volume, by Packaging Technology (2019-2030)
20.5. Market Revenue, by Packaging Technology (2019-2030)
20.6. Market Volume, by End Use (2019-2030)
20.7. Market Revenue, by End Use (2019-2030)

Chapter 21. India Market

21.1. Overview
21.2. Market Volume, by Processor (2019-2030)
21.3. Market Revenue, by Processor (2019-2030)
21.4. Market Volume, by Packaging Technology (2019-2030)
21.5. Market Revenue, by Packaging Technology (2019-2030)
21.6. Market Volume, by End Use (2019-2030)
21.7. Market Revenue, by End Use (2019-2030)

Chapter 22. Australia Market

22.1. Overview
22.2. Market Volume, by Processor (2019-2030)
22.3. Market Revenue, by Processor (2019-2030)
22.4. Market Volume, by Packaging Technology (2019-2030)
22.5. Market Revenue, by Packaging Technology (2019-2030)
22.6. Market Volume, by End Use (2019-2030)
22.7. Market Revenue, by End Use (2019-2030)

Chapter 23. South Korea Market

23.1. Overview
23.2. Market Volume, by Processor (2019-2030)
23.3. Market Revenue, by Processor (2019-2030)
23.4. Market Volume, by Packaging Technology (2019-2030)
23.5. Market Revenue, by Packaging Technology (2019-2030)
23.6. Market Volume, by End Use (2019-2030)
23.7. Market Revenue, by End Use (2019-2030)

Chapter 24. Brazil Market

24.1. Overview
24.2. Market Volume, by Processor (2019-2030)
24.3. Market Revenue, by Processor (2019-2030)
24.4. Market Volume, by Packaging Technology (2019-2030)
24.5. Market Revenue, by Packaging Technology (2019-2030)
24.6. Market Volume, by End Use (2019-2030)
24.7. Market Revenue, by End Use (2019-2030)

Chapter 25. Mexico Market

25.1. Overview
25.2. Market Volume, by Processor (2019-2030)
25.3. Market Revenue, by Processor (2019-2030)
25.4. Market Volume, by Packaging Technology (2019-2030)
25.5. Market Revenue, by Packaging Technology (2019-2030)
25.6. Market Volume, by End Use (2019-2030)
25.7. Market Revenue, by End Use (2019-2030)

Chapter 26. Saudi Arabia Market

26.1. Overview
26.2. Market Volume, by Processor (2019-2030)
26.3. Market Revenue, by Processor (2019-2030)
26.4. Market Volume, by Packaging Technology (2019-2030)
26.5. Market Revenue, by Packaging Technology (2019-2030)
26.6. Market Volume, by End Use (2019-2030)
26.7. Market Revenue, by End Use (2019-2030)

Chapter 27. South Africa Market

27.1. Overview
27.2. Market Volume, by Processor (2019-2030)
27.3. Market Revenue, by Processor (2019-2030)
27.4. Market Volume, by Packaging Technology (2019-2030)
27.5. Market Revenue, by Packaging Technology (2019-2030)
27.6. Market Volume, by End Use (2019-2030)
27.7. Market Revenue, by End Use (2019-2030)

Chapter 28. U.A.E. Market

28.1. Overview
28.2. Market Volume, by Processor (2019-2030)
28.3. Market Revenue, by Processor (2019-2030)
28.4. Market Volume, by Packaging Technology (2019-2030)
28.5. Market Revenue, by Packaging Technology (2019-2030)
28.6. Market Volume, by End Use (2019-2030)
28.7. Market Revenue, by End Use (2019-2030)

Chapter 29. Competitive Landscape

29.1. List of Market Players and their Offerings
29.2. Competitive Benchmarking of Key Players
29.3. Product Benchmarking of Key Players
29.4. Recent Strategic Developments

Chapter 30. Company Profiles

30.1. Advanced Micro Devices Inc.
- 30.1.1. Business overview
- 30.1.2. Product and service offerings
- 30.1.3. Key financial summary
30.2. Apple Inc
- 30.2.1. Business overview
- 30.2.2. Product and service offerings
- 30.2.3. Key financial summary
30.3. Intel Corporation
- 30.3.1. Business overview
- 30.3.2. Product and service offerings
- 30.3.3. Key financial summary
30.4. Taiwan Semiconductor Manufacturing Company Limited
- 30.4.1. Business overview
- 30.4.2. Product and service offerings
- 30.4.3. Key financial summary
30.5. IBM Corporation
- 30.5.1. Business overview
- 30.5.2. Product and service offerings
- 30.5.3. Key financial summary
30.6. Marvell Technology Inc.
- 30.6.1. Business overview
- 30.6.2. Product and service offerings
- 30.6.3. Key financial summary
30.7. NVIDIA Corporation
- 30.7.1. Business overview
- 30.7.2. Product and service offerings
- 30.7.3. Key financial summary
30.8. MediaTek Services
- 30.8.1. Business overview
- 30.8.2. Product and service offerings
- 30.8.3. Key financial summary
30.9. Achronix Semiconductor Corporation
- 30.9.1. Business overview
- 30.9.2. Product and service offerings
- 30.9.3. Key financial summary
30.10. RANVOUS Inc.
- 30.10.1. Business overview
- 30.10.2. Product and service offerings
- 30.10.3. Key financial summary
30.11. Qualcomm Incorporated
- 30.11.1. Business overview
- 30.11.2. Product and service offerings
- 30.11.3. Key financial summary

Chapter 31. Appendix

31.1. Abbreviations
31.2. Sources and References
31.3. Related Reports

Chiplet Market Size & Share Analysis - Trends, Drivers, Competitive Landscape, and Forecasts (2024 - 2030)