PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 1497720
PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 1497720
SiC Wafer Polishing Market Size and Share Analysis by Process Type, Product Type, Application - Global Industry Revenue Estimation and Demand Forecast to 2030
Market Overview
The global SiC wafer polishing market size was USD 448.1 million in 2023, and this number is expected to increase to USD 4,116.7 million by 2030, advancing at a CAGR of 37.4% during 2024-2030. The increasing consumption of consumer electronics with the rising standard of living is the most common cause of this phenomenon. It follows from the growing need for polishing materials, the demand for higher-grade polishing consumables, as well as the ever-expanding semiconductor industry.
Industrial power electronics, including tablets, smartphones, laptops, and EVs (electric vehicles), are lately utilizing semiconductors made of SiC. These features perform to higher performances that aid in the reduction of power and faster switching, hence recommended for portable devices.
The growth of such electronic products is paralleled by the demand for these items, thus leading to the continuous need for polishing solutions. In addition, consumers are trending towards power-efficient devices, especially in the electronics area which utilizes SiC-type components.
On the other hand, the fast-growing market for small ICs is stimulated more by the technical improvements in consumer electronics, including tablet computers, smartphones, and flat-screen TVs, as well as the surge in the popularity of wearable electronic devices and smart homes.
Key Insights
The Diamond slurry category is projected to advance fastest at a 40% CAGR.
This can be credited to the accurate material removal rate guideline and exceptional planarization advancing device performance.
The polishing pads category is also projected to generate significant revenue, propelled by semiconductor industry development and addition in consumer electronics, particularly LED luminaires, smartphones, and digital appliances.
Wide usage in semiconductor chip making and advanced wafer polishing applications.
The abrasive powders category leads market revenue, offering improved polishing precision and removing surface imperfections, defects, and roughness from wafers.
Widely used due to compatibility with SiC characteristics, allowing effective polishing without material damage.
The power electronics category is dominating with a 60% revenue share and is also projected to advance at a significant pace.
The silicon carbide wafers hold thermal conductivity and broad bandgap appropriate for high-performance power electronic components.
This growth can be credited to the acceptance of energy-efficient medical devices, EVs, consumer electronics, and industrial applications.
The LED category is estimated to experience significant growth, with high usage in the automobile industry and increasing preference for smart lighting and homes.
SiC wafer polishing enhances light emission efficiency and reduces absorption.
The APAC region is dominating the market in terms of regions, driven by economic development in China, India, and South Korea, driving semiconductor and consumer electronics industries, increasing consumer spending, and rising per capita income.
North America maintains a significant revenue share, with the presence of industry players, strong manufacturing sector, growing telecommunication industry, and investments. The U.S. contributes the highest revenue, focusing on semiconductor ICs for automobiles.
Europe is expected to grow significantly, driven by the automotive and aerospace sectors, public and private investments, with Germany leading revenue due to technology acceptance, vehicle assembly units, and local manufacturers.
Table of Contents
Chapter 1. Research Scope
- 1.1. Research Objectives
- 1.2. Market Definition
- 1.3. Analysis Period
- 1.4. Market Size Breakdown by Segments
- 1.4.1. Market size breakdown, by process type
- 1.4.2. Market size breakdown, by product type
- 1.4.3. Market size breakdown, by application
- 1.4.4. Market size breakdown, by region
- 1.4.5. Market size breakdown, by country
- 1.5. Market Data Reporting Unit
- 1.5.1. Value
- 1.6. Key Stakeholders
Chapter 2. Research Methodology
- 2.1. Secondary Research
- 2.1.1. Paid
- 2.1.2. Unpaid
- 2.1.3. P&S Intelligence database
- 2.2. Primary Research
- 2.3. Market Size Estimation
- 2.4. Data Triangulation
- 2.5. Currency Conversion Rates
- 2.6. Assumptions for the Study
- 2.7. Notes and Caveats
Chapter 3. Executive Summary
Chapter 4. Voice of Industry Experts/KOLs
Chapter 5. Market Indicators
Chapter 6. Industry Outlook
- 6.1. Market Dynamics
- 6.1.1. Trends
- 6.1.2. Drivers
- 6.1.3. Restraints/challenges
- 6.1.4. Impact analysis of drivers/restraints
- 6.2. Impact of COVID-19
- 6.3. Porter's Five Forces Analysis
- 6.3.1. Bargaining power of buyers
- 6.3.2. Bargaining power of suppliers
- 6.3.3. Threat of new entrants
- 6.3.4. Intensity of rivalry
- 6.3.5. Threat of substitutes
Chapter 7. Competitive Landscape
- 7.1. List of Market Players and their Offerings
- 7.2. Competitive Benchmarking of Key Players
- 7.3. Product Benchmarking of Key Players
- 7.4. Recent Strategic Developments
Chapter 8. Global Market
- 8.1. Overview
- 8.2. Market Revenue, by Process Type (2017-2030)
- 8.3. Market Revenue, by Product Type (2017-2030)
- 8.4. Market Revenue, by Application (2017-2030)
- 8.5. Market Revenue, by Region (2017-2030)
Chapter 9. North America Market
- 9.1. Overview
- 9.2. Market Revenue, by Process Type (2017-2030)
- 9.3. Market Revenue, by Product Type (2017-2030)
- 9.4. Market Revenue, by Application (2017-2030)
- 9.5. Market Revenue, by Country (2017-2030)
Chapter 10. Europe Market
- 10.1. Overview
- 10.2. Market Revenue, by Process Type (2017-2030)
- 10.3. Market Revenue, by Product Type (2017-2030)
- 10.4. Market Revenue, by Application (2017-2030)
- 10.5. Market Revenue, by Country (2017-2030)
Chapter 11. APAC Market
- 11.1. Overview
- 11.2. Market Revenue, by Process Type (2017-2030)
- 11.3. Market Revenue, by Product Type (2017-2030)
- 11.4. Market Revenue, by Application (2017-2030)
- 11.5. Market Revenue, by Country (2017-2030)
Chapter 12. LATAM Market
- 12.1. Overview
- 12.2. Market Revenue, by Process Type (2017-2030)
- 12.3. Market Revenue, by Product Type (2017-2030)
- 12.4. Market Revenue, by Application (2017-2030)
- 12.5. Market Revenue, by Country (2017-2030)
Chapter 13. MEA Market
- 13.1. Overview
- 13.2. Market Revenue, by Process Type (2017-2030)
- 13.3. Market Revenue, by Product Type (2017-2030)
- 13.4. Market Revenue, by Application (2017-2030)
- 13.5. Market Revenue, by Country (2017-2030)
Chapter 14. U.S. Market
- 14.1. Overview
- 14.2. Market Revenue, by Process Type (2017-2030)
- 14.3. Market Revenue, by Product Type (2017-2030)
- 14.4. Market Revenue, by Application (2017-2030)
Chapter 15. Canada Market
- 15.1. Overview
- 15.2. Market Revenue, by Process Type (2017-2030)
- 15.3. Market Revenue, by Product Type (2017-2030)
- 15.4. Market Revenue, by Application (2017-2030)
Chapter 16. Germany Market
- 16.1. Overview
- 16.2. Market Revenue, by Process Type (2017-2030)
- 16.3. Market Revenue, by Product Type (2017-2030)
- 16.4. Market Revenue, by Application (2017-2030)
Chapter 17. France Market
- 17.1. Overview
- 17.2. Market Revenue, by Process Type (2017-2030)
- 17.3. Market Revenue, by Product Type (2017-2030)
- 17.4. Market Revenue, by Application (2017-2030)
Chapter 18. U.K. Market
- 18.1. Overview
- 18.2. Market Revenue, by Process Type (2017-2030)
- 18.3. Market Revenue, by Product Type (2017-2030)
- 18.4. Market Revenue, by Application (2017-2030)
Chapter 19. Italy Market
- 19.1. Overview
- 19.2. Market Revenue, by Process Type (2017-2030)
- 19.3. Market Revenue, by Product Type (2017-2030)
- 19.4. Market Revenue, by Application (2017-2030)
Chapter 20. Spain Market
- 20.1. Overview
- 20.2. Market Revenue, by Process Type (2017-2030)
- 20.3. Market Revenue, by Product Type (2017-2030)
- 20.4. Market Revenue, by Application (2017-2030)
Chapter 21. China Market
- 21.1. Overview
- 21.2. Market Revenue, by Process Type (2017-2030)
- 21.3. Market Revenue, by Product Type (2017-2030)
- 21.4. Market Revenue, by Application (2017-2030)
Chapter 22. Japan Market
- 22.1. Overview
- 22.2. Market Revenue, by Process Type (2017-2030)
- 22.3. Market Revenue, by Product Type (2017-2030)
- 22.4. Market Revenue, by Application (2017-2030)
Chapter 23. India Market
- 23.1. Overview
- 23.2. Market Revenue, by Process Type (2017-2030)
- 23.3. Market Revenue, by Product Type (2017-2030)
- 23.4. Market Revenue, by Application (2017-2030)
Chapter 24. South Korea Market
- 24.1. Overview
- 24.2. Market Revenue, by Process Type (2017-2030)
- 24.3. Market Revenue, by Product Type (2017-2030)
- 24.4. Market Revenue, by Application (2017-2030)
Chapter 25. Australia Market
- 25.1. Overview
- 25.2. Market Revenue, by Process Type (2017-2030)
- 25.3. Market Revenue, by Product Type (2017-2030)
- 25.4. Market Revenue, by Application (2017-2030)
Chapter 26. Brazil Market
- 26.1. Overview
- 26.2. Market Revenue, by Process Type (2017-2030)
- 26.3. Market Revenue, by Product Type (2017-2030)
- 26.4. Market Revenue, by Application (2017-2030)
Chapter 27. Mexico Market
- 27.1. Overview
- 27.2. Market Revenue, by Process Type (2017-2030)
- 27.3. Market Revenue, by Product Type (2017-2030)
- 27.4. Market Revenue, by Application (2017-2030)
Chapter 28. Saudi Arabia Market
- 28.1. Overview
- 28.2. Market Revenue, by Process Type (2017-2030)
- 28.3. Market Revenue, by Product Type (2017-2030)
- 28.4. Market Revenue, by Application (2017-2030)
Chapter 29. South Africa Market
- 29.1. Overview
- 29.2. Market Revenue, by Process Type (2017-2030)
- 29.3. Market Revenue, by Product Type (2017-2030)
- 29.4. Market Revenue, by Application (2017-2030)
Chapter 30. U.A.E. Market
- 30.1. Overview
- 30.2. Market Revenue, by Process Type (2017-2030)
- 30.3. Market Revenue, by Product Type (2017-2030)
- 30.4. Market Revenue, by Application (2017-2030)
Chapter 31. Company Profiles
- 31.1. Kemet International Ltd.
- 31.1.1. Business overview
- 31.1.2. Product and service offerings
- 31.1.3. Key financial summary
- 31.2. Entegris Inc.
- 31.2.1. Business overview
- 31.2.2. Product and service offerings
- 31.2.3. Key financial summary
- 31.3. Iljin Diamond Co. Ltd.
- 31.3.1. Business overview
- 31.3.2. Product and service offerings
- 31.3.3. Key financial summary
- 31.4. 3M Company
- 31.4.1. Business overview
- 31.4.2. Product and service offerings
- 31.4.3. Key financial summary
- 31.5. Engis Corporation
- 31.5.1. Business overview
- 31.5.2. Product and service offerings
- 31.5.3. Key financial summary
- 31.6. Ferro Corporation
- 31.6.1. Business overview
- 31.6.2. Product and service offerings
- 31.6.3. Key financial summary
- 31.7. DuPont de Nemours Inc.
- 31.7.1. Business overview
- 31.7.2. Product and service offerings
- 31.7.3. Key financial summary
- 31.8. SKC Inc.
- 31.8.1. Business overview
- 31.8.2. Product and service offerings
- 31.8.3. Key financial summary
- 31.9. FUJIFILM Holdings America Corporation
- 31.9.1. Business overview
- 31.9.2. Product and service offerings
- 31.9.3. Key financial summary
Chapter 32. Appendix
- 32.1. Abbreviations
- 32.2. Sources and References
- 32.3. Related Reports
