PUBLISHER: Polaris Market Research | PRODUCT CODE: 1298032
PUBLISHER: Polaris Market Research | PRODUCT CODE: 1298032
The global solder materials market size is expected to reach USD 5.60 billion by 2032, according to a new study by Polaris Market Research. The report "Solder Materials Market Size, Share & Trends Analysis Report by Product (Wire, Paste, Bar, Flux), By Process (Screen-printing, Robotic, Laser, Wave/Reflow), By Region, And Segment Forecasts, 2023 - 2032" gives a detailed insight into current market dynamics and provides analysis on future market growth.
Rising demand for smart gadgets and the advancement of energy-efficient electronics are expected to be the main market drivers. Traditional micrometre solder pastes suffer from several disadvantages, such as high melting temperatures that might result in unwelcome tension during the reflow processing, a restricted range of applications, and joint defects. Therefore, many solder compounds with nanoparticle- and sub-microscopic-sized particles have been created.
In the United States, the market for solder materials is expected to be primarily driven by the growth of the electronics maintenance industry. The production of electronic devices is expected to rise in the region, and there is a significant electronics aftermarket sector, which should lead to an increase in demand for these materials over the course of the forecast period. Leading companies have invested heavily in R&D to create cutting-edge solder materials like Sn-Bi-Ag alloy, which has reduced thermal excursion during electronic assembly.
Process automation improvements in soldering methods are also expected to support market growth over the course of the forecast period. Productivity has increased as a result of the decreased need for human intervention during the soldering process. Consequently, it is anticipated that the market will grow considerably in the years to come.
The usage of automated soldering solutions is a trend that is starting to emerge in the sector. Due to increased vendor awareness of increasing automation and vendor initiatives to use automation to their advantage, the use of automation in the soldering process has increased significantly. Small-scale automation was once used by vendors for soldering, but as robotics technology has progressed, robots are now employed. Robotic soldering improves soldering processes while increasing output, quality, productivity, and waste reduction.
Expansion of the industry is significantly hampered by raw material price volatility. The manufacturers of solder materials are impacted by changes in the quantity and price of the raw materials used in their production. (primarily steel, brass, copper, silver, and aluminium alloys).
Wire previously became the most popular product group; by 2032, it's anticipated to reach USD 554.6 million. Major market factors include the widespread use of wires in PCB soldering and improved output.
Wave/reflow, which had a has high market share emerged as the largest process category. It is one of the soldering techniques that is most commonly used in the electronics industry because it guards against overheating damage. Because the technique can also be used in mass manufacturing, the market will expand.
North America is the second-largest regional market after Asia Pacific as a result of the rapidly expanding electronics and semiconductor sectors. The biggest market in North America in 2022 was the United States. This was ascribed to the nation's developing renovation industry.
The global players include: Fusion, Inc., Indium Corporation, Kester, Koki Company ltd, Lucas Milhaupt, Inc., Nihon Genma, Qualitek International, Inc., Senju Metal Industry Co., Ltd., Stannol GmbH Co. KG
Polaris Market Research has segmented the Solder Materials Market report based on product type, process and region: