Electronic Board Level Underfill And Encapsulation Material Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2024-2033

Description

Persistence Market Research has recently published an extensive report on the global Electronic Board Level Underfill and Encapsulation Material Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

Electronic Board Level Underfill and Encapsulation Material Market Size (2024E): USD 343.1 Mn
Projected Market Value (2033F): USD 526.3 Mn
Global Market Growth Rate (CAGR 2024 to 2033): 4.9%

Electronic Board Level Underfill and Encapsulation Material Market - Report Scope:

The Electronic Board Level Underfill and Encapsulation Material Market encompasses a variety of materials used to protect electronic assemblies and components, especially at the board level, from environmental stressors such as moisture, dust, and thermal cycles. These materials play a critical role in enhancing the reliability and longevity of electronic devices by providing mechanical support, reducing stress, and protecting against contaminants. The market serves diverse segments, including automotive electronics, consumer electronics, industrial electronics, and telecommunications. Growth is driven by increasing demand for miniaturization in electronics, advancements in semiconductor packaging, and the expanding application of electronics in various industries.

Market Growth Drivers:

Several key factors are driving the global Electronic Board Level Underfill and Encapsulation Material Market. The rising demand for miniaturized electronic devices, particularly in the consumer electronics and automotive sectors, boosts the need for advanced underfill and encapsulation materials. Technological advancements in semiconductor packaging, such as flip-chip and ball grid array (BGA) technologies, further fuel the market's expansion by requiring more sophisticated materials that can withstand the increased thermal and mechanical stresses associated with these technologies. Additionally, the growing trend towards 5G technology and the Internet of Things (IoT) drives the demand for high-performance electronic materials that can ensure device reliability in diverse and demanding environments. Enhanced research and development activities, along with the introduction of new materials with improved thermal and mechanical properties, contribute to market growth by offering more robust solutions for electronic assembly protection.

Market Restraints:

Despite promising growth prospects, the Electronic Board Level Underfill and Encapsulation Material Market faces challenges related to the high costs of advanced materials and the complexity of the application processes. Market growth can be hindered by the availability of alternative materials, such as conformal coatings, which may be preferred by some manufacturers due to their lower cost and ease of application. Additionally, the continuous push for further miniaturization in electronics poses challenges for material developers to create solutions that can meet the stringent requirements of smaller and more complex devices. Addressing these issues requires ongoing investment in research and development to improve material properties, reduce application costs, and enhance the reliability of underfill and encapsulation solutions.

Market Opportunities:

The market presents significant opportunities driven by the increasing adoption of advanced electronic devices and the rising demand for reliable protection materials in harsh environments. The development of new materials with enhanced thermal conductivity, lower coefficients of thermal expansion, and improved mechanical properties caters to the growing need for more durable and effective underfill and encapsulation solutions. The expansion of the automotive and industrial electronics sectors provides new channels for market growth, allowing companies to tap into emerging markets where the demand for rugged and reliable electronics is on the rise. Strategic partnerships, investments in new technologies, and the introduction of environmentally friendly materials are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

What are the primary factors driving the growth of the Electronic Board Level Underfill and Encapsulation Material Market globally?
Which types and applications of underfill and encapsulation materials are leading the adoption in various electronic segments?
How are technological advancements influencing the competitive landscape of the Electronic Board Level Underfill and Encapsulation Material Market?
Who are the key players in the Electronic Board Level Underfill and Encapsulation Material Market, and what strategies are they employing to stay competitive?
What are the emerging trends and future prospects in the global Electronic Board Level Underfill and Encapsulation Material Market?

Competitive Intelligence and Business Strategy:

Leading players in the global Electronic Board Level Underfill and Encapsulation Material Market, including Henkel AG & Co. KGaA, NAMICS Corporation, and H.B. Fuller, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced underfill and encapsulation materials and explore new applications across various electronic sectors. Collaborations with semiconductor manufacturers, research organizations, and industry stakeholders facilitate market access and promote new material adoption. Emphasis on high-performance products, environmentally sustainable solutions, and comprehensive marketing strategies fosters market growth and enhances brand loyalty in the evolving Electronic Board Level Underfill and Encapsulation Material Market landscape.

Key Companies Profiled:

Henkel AG and Co. KGaA
Namics Corporation
AI Technology, Inc.
Protavic International
H.B. Fuller Company
ASE Group
Hitachi Chemical Co., Ltd.
Indium Corporation
Zymet
YINCAE Advanced Materials, LLC
LORD Corporation
Sanyu Rec Co., Ltd.
The Dow Chemical Company
Epoxy Technology, Inc.
Panasonic Corporation
Dymax Corporation
ELANTAS GmbH

Electronic Board Level Underfill and Encapsulation Material Market Industry Segmentation

By Product Type

Underfills
Gob Top Encapsulations

By Material Type

Quartz/Silicone
Alumina Based
Epoxy Based
Urethane Based
Acrylic Based
Others

By Board Type

CSP (Chip Scale Package)
BGA (Ball Grid array)
Flip Chips

By Region

North America
Latin America
Europe
East Asia
South Asia Pacific
Middle East and Africa (MEA)

Product Code: PMRREP19783

1. Executive Summary

1.1. Global Market Outlook
1.2. Demand Side Trends
1.3. Supply Side Trends
1.4. Analysis and Recommendations

2. Market Overview

2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations

3. Key Market Trends

3.1. Key Trends Impacting the Market
3.2. Product Innovation / Development Trends

4. Key Success Factors

4.1. Product Adoption / Usage Analysis
4.2. Product USPs / Features
4.3. Strategic Promotional Strategies

5. Global Market Demand Analysis 2019-2023 and Forecast, 2024-2033

5.1. Historical Market Volume (Tons) Analysis, 2019-2023
5.2. Current and Future Market Volume (Tons) Projections, 2024-2033
5.3. Y-o-Y Growth Trend Analysis

6. Global Market - Pricing Analysis

6.1. Regional Pricing Analysis By Product Type
6.2. Pricing Break-up
- 6.2.1. Manufacturer Level Pricing
- 6.2.2. Distributor Level Pricing
6.3. Global Average Pricing Analysis Benchmark

7. Global Market Demand (in Value or Size in US$ Mn) Analysis 2019-2023 and Forecast, 2024-2033

7.1. Historical Market Value (US$ Mn) Analysis, 2019-2023
7.2. Current and Future Market Value (US$ Mn) Projections, 2024-2033
- 7.2.1. Y-o-Y Growth Trend Analysis
- 7.2.2. Absolute $ Opportunity Analysis

8. Market Background

8.1. Macro-Economic Factors
- 8.1.1. Global GDP Growth Overview
- 8.1.2. Global Semiconductor and Electronics Sector Overview
- 8.1.3. Other Key Macro-economic Factors
8.2. Forecast Factors - Relevance and Impact
- 8.2.1. Global Urbanization Growth Outlook
- 8.2.2. Raw Material Prices
- 8.2.3. Regulatory Impact Outlook
- 8.2.4. Application Growth Outlook
- 8.2.5. Other Key Forecast Factors
8.3. Value Chain
8.4. List of Market Participants
8.5. Global Supply vs Demand Scenario
8.6. Production Process Overview
8.7. Key Applicable Regulations
8.8. Impact of COVID - 19 Crisis
- 8.8.1. Current Statistics
- 8.8.2. World Economy / Cluster Projections
- 8.8.3. Potential of Impact by Taxonomy
- 8.8.4. Impact on Market Size
- 8.8.5. Recovery Scenarios
8.9. Market Dynamics
- 8.9.1. Drivers
- 8.9.2. Restraints
- 8.9.3. Opportunity Analysis

9. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Product Type

9.1. Introduction / Key Findings
9.2. Historical Market Size (US$ Mn) and Volume Analysis By Product Type, 2019-2023
9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Product Type, 2024-2033
- 9.3.1. Underfills
  - 9.3.1.1. Capillary
  - 9.3.1.2. Edge Bonds
- 9.3.2. Gob Top Encapsulations
9.4. Market Attractiveness Analysis By Product Type

10. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Material Type

10.1. Introduction / Key Findings
10.2. Historical Market Size (US$ Mn) and Volume Analysis By Material Type, 2019-2023
10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Material Type, 2024-2033
- 10.3.1. Quartz/Silicone
- 10.3.2. Alumina Based
- 10.3.3. Epoxy Based
- 10.3.4. Urethane Based
- 10.3.5. Acrylic Based
- 10.3.6. Others
10.4. Market Attractiveness Analysis By Material Type

11. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Board Type

11.1. Introduction / Key Findings
11.2. Historical Market Size (US$ Mn) and Volume Analysis By Board Type, 2019-2023
11.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Board Type, 2024-2033
- 11.3.1. CSP (Chip Scale Package
- 11.3.2. BGA (Ball Grid array)
- 11.3.3. Flip Chips
11.4. Market Attractiveness Analysis By Board Type

12. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Region

12.1. Introduction
12.2. Historical Market Size (US$ Mn) and Volume Analysis By Region, 2019-2023
12.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast By Region, 2024-2033
- 12.3.1. North America
- 12.3.2. Latin America
- 12.3.3. Europe
- 12.3.4. South Asia and Pacific
- 12.3.5. East Asia
- 12.3.6. Middle East and Africa
12.4. Market Attractiveness Analysis By Region

13. North America Market Analysis 2019-2023 and Forecast 2024-2033

13.1. Introduction
13.2. Pricing Analysis
13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
13.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 13.4.1. By Country
  - 13.4.1.1. U.S.
  - 13.4.1.2. Canada
- 13.4.2. By Product Type
- 13.4.3. By Material Type
- 13.4.4. By Board Type
13.5. Market Attractiveness Analysis
- 13.5.1. By Country
- 13.5.2. By Product Type
- 13.5.3. By Material Type
- 13.5.4. By Board Type
13.6. Market Trends
13.7. Key Market Participants - Intensity Mapping
13.8. Drivers and Restraints - Impact Analysis

14. Latin America Market Analysis 2019-2023 and Forecast 2024-2033

14.1. Introduction
14.2. Pricing Analysis
14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
14.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 14.4.1. By Country
  - 14.4.1.1. Brazil
  - 14.4.1.2. Mexico
  - 14.4.1.3. Rest of Latin America
- 14.4.2. By Product Type
- 14.4.3. By Material Type
- 14.4.4. By Board Type
14.5. Market Attractiveness Analysis
- 14.5.1. By Country
- 14.5.2. By Product Type
- 14.5.3. By Material Type
- 14.5.4. By Board Type
14.6. Market Trends
14.7. Key Market Participants - Intensity Mapping
14.8. Drivers and Restraints - Impact Analysis

15. Europe Market Analysis 2019-2023 and Forecast 2024-2033

15.1. Introduction
15.2. Pricing Analysis
15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
15.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 15.4.1. By Country
  - 15.4.1.1. Germany
  - 15.4.1.2. Italy
  - 15.4.1.3. France
  - 15.4.1.4. U.K.
  - 15.4.1.5. Spain
  - 15.4.1.6. BENELUX
  - 15.4.1.7. Russia
  - 15.4.1.8. Rest of Europe
- 15.4.2. By Product Type
- 15.4.3. By Material Type
- 15.4.4. By Board Type
15.5. Market Attractiveness Analysis
- 15.5.1. By Country
- 15.5.2. By Product Type
- 15.5.3. By Material Type
- 15.5.4. By Board Type
15.6. Market Trends
15.7. Key Market Participants - Intensity Mapping
15.8. Drivers and Restraints - Impact Analysis

16. South Asia and Pacific Market Analysis 2019-2023 and Forecast 2024-2033

16.1. Introduction
16.2. Pricing Analysis
16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
16.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 16.4.1. By Country
  - 16.4.1.1. India
  - 16.4.1.2. Association of Southeast Asian Nations
  - 16.4.1.3. Australia and New Zealand
  - 16.4.1.4. Rest of South Asia and Pacific
- 16.4.2. By Product Type
- 16.4.3. By Material Type
- 16.4.4. By Board Type
16.5. Market Attractiveness Analysis
- 16.5.1. By Country
- 16.5.2. By Product Type
- 16.5.3. By Material Type
- 16.5.4. By Board Type
16.6. Market Trends
16.7. Key Market Participants - Intensity Mapping
16.8. Drivers and Restraints - Impact Analysis

17. East Asia Market Analysis 2019-2023 and Forecast 2024-2033

17.1. Introduction
17.2. Pricing Analysis
17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
17.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 17.4.1. By Country
  - 17.4.1.1. China
  - 17.4.1.2. Japan
  - 17.4.1.3. South Korea
- 17.4.2. By Product Type
- 17.4.3. By Material Type
- 17.4.4. By Board Type
17.5. Market Attractiveness Analysis
- 17.5.1. By Country
- 17.5.2. By Product Type
- 17.5.3. By Material Type
- 17.5.4. By Board Type
17.6. Market Trends
17.7. Key Market Participants - Intensity Mapping
17.8. Drivers and Restraints - Impact Analysis

18. Middle East and Africa Market Analysis 2019-2023 and Forecast 2024-2033

18.1. Introduction
18.2. Pricing Analysis
18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
18.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
- 18.4.1. By Country
  - 18.4.1.1. Gulf Corporation Council Countries
  - 18.4.1.2. Turkey
  - 18.4.1.3. Northern Africa
  - 18.4.1.4. South Africa
  - 18.4.1.5. Rest of Middle East and Africa
- 18.4.2. By Product Type
- 18.4.3. By Material Type
- 18.4.4. By Board Type
18.5. Market Attractiveness Analysis
- 18.5.1. By Country
- 18.5.2. By Product Type
- 18.5.3. By Material Type
- 18.5.4. By Board Type
18.6. Market Trends
18.7. Key Market Participants - Intensity Mapping
18.8. Drivers and Restraints - Impact Analysis

19. Key Countries Market Analysis

19.1. Introduction
- 19.1.1. Market Value Proportion Analysis, By Key Countries
- 19.1.2. Global Vs. Country Growth Comparison
19.2. U.S. Market Analysis
- 19.2.1. By Product Type
- 19.2.2. By Material Type
- 19.2.3. By Board Type
19.3. Canada Market Analysis
- 19.3.1. By Product Type
- 19.3.2. By Material Type
- 19.3.3. By Board Type
19.4. Mexico Market Analysis
- 19.4.1. By Product Type
- 19.4.2. By Material Type
- 19.4.3. By Board Type
19.5. Brazil Market Analysis
- 19.5.1. By Product Type
- 19.5.2. By Material Type
- 19.5.3. By Board Type
19.6. Germany Market Analysis
- 19.6.1. By Product Type
- 19.6.2. By Material Type
- 19.6.3. By Board Type
19.7. Italy Market Analysis
- 19.7.1. By Product Type
- 19.7.2. By Material Type
- 19.7.3. By Board Type
19.8. France Market Analysis
- 19.8.1. By Product Type
- 19.8.2. By Material Type
- 19.8.3. By Board Type
19.9. U.K. Market Analysis
- 19.9.1. By Product Type
- 19.9.2. By Material Type
- 19.9.3. By Board Type
19.10. Spain Market Analysis
- 19.10.1. By Product Type
- 19.10.2. By Material Type
- 19.10.3. By Board Type
19.11. BENELUX Market Analysis
- 19.11.1. By Product Type
- 19.11.2. By Material Type
- 19.11.3. By Board Type
19.12. Russia Market Analysis
- 19.12.1. By Product Type
- 19.12.2. By Material Type
- 19.12.3. By Board Type
19.13. China Market Analysis
- 19.13.1. By Product Type
- 19.13.2. By Material Type
- 19.13.3. By Board Type
19.14. Japan Market Analysis
- 19.14.1. By Product Type
- 19.14.2. By Material Type
- 19.14.3. By Board Type
19.15. South Korea Market Analysis
- 19.15.1. By Product Type
- 19.15.2. By Material Type
- 19.15.3. By Board Type
19.16. India Market Analysis
- 19.16.1. By Product Type
- 19.16.2. By Material Type
- 19.16.3. By Board Type
19.17. Association of Southeast Asian Nations Market Analysis
- 19.17.1. By Product Type
- 19.17.2. By Material Type
- 19.17.3. By Board Type
19.18. Australia and New Zealand Analysis
- 19.18.1. By Product Type
- 19.18.2. By Material Type
- 19.18.3. By Board Type
19.19. Gulf Corporation Council Countries Market Analysis
- 19.19.1. By Product Type
- 19.19.2. By Material Type
- 19.19.3. By Board Type
19.20. Turkey Market Analysis
- 19.20.1. By Product Type
- 19.20.2. By Material Type
- 19.20.3. By Board Type

20. Market Structure Analysis

20.1. Market Analysis by Tier of Companies
20.2. Market Concentration
20.3. Market Share Analysis of Top Players
20.4. Market Presence Analysis
- 20.4.1. By Regional footprint of Players
- 20.4.2. Product foot print by Players

21. Competition Analysis

21.1. Competition Dashboard
21.2. Competition Benchmarking
21.3. Competition Deep Dive
- 21.3.1. Henkel AG and Co. KGaA
  - 21.3.1.1. Overview
  - 21.3.1.2. Product Portfolio
  - 21.3.1.3. Key Financials
  - 21.3.1.4. Recent Developments
  - 21.3.1.5. Strategy Overview
    - 21.3.1.5.1. Marketing Strategy
    - 21.3.1.5.2. Product Strategy
- 21.3.2. Namics Corporation
  - 21.3.2.1. Overview
  - 21.3.2.2. Product Portfolio
  - 21.3.2.3. Key Financials
  - 21.3.2.4. Recent Developments
  - 21.3.2.5. Strategy Overview
    - 21.3.2.5.1. Marketing Strategy
    - 21.3.2.5.2. Product Strategy
- 21.3.3. AI Technology, Inc.
  - 21.3.3.1. Overview
  - 21.3.3.2. Product Portfolio
  - 21.3.3.3. Key Financials
  - 21.3.3.4. Recent Developments
  - 21.3.3.5. Strategy Overview
    - 21.3.3.5.1. Marketing Strategy
    - 21.3.3.5.2. Product Strategy
- 21.3.4. Protavic International
  - 21.3.4.1. Overview
  - 21.3.4.2. Product Portfolio
  - 21.3.4.3. Key Financials
  - 21.3.4.4. Recent Developments
  - 21.3.4.5. Strategy Overview
    - 21.3.4.5.1. Marketing Strategy
    - 21.3.4.5.2. Product Strategy
- 21.3.5. H.B. Fuller Company
  - 21.3.5.1. Overview
  - 21.3.5.2. Product Portfolio
  - 21.3.5.3. Key Financials
  - 21.3.5.4. Recent Developments
  - 21.3.5.5. Strategy Overview
    - 21.3.5.5.1. Marketing Strategy
    - 21.3.5.5.2. Product Strategy
- 21.3.6. ASE Group
  - 21.3.6.1. Overview
  - 21.3.6.2. Product Portfolio
  - 21.3.6.3. Key Financials
  - 21.3.6.4. Recent Developments
  - 21.3.6.5. Strategy Overview
    - 21.3.6.5.1. Marketing Strategy
    - 21.3.6.5.2. Product Strategy
- 21.3.7. Hitachi Chemical Co., Ltd.
  - 21.3.7.1. Overview
  - 21.3.7.2. Product Portfolio
  - 21.3.7.3. Key Financials
  - 21.3.7.4. Recent Developments
  - 21.3.7.5. Strategy Overview
    - 21.3.7.5.1. Marketing Strategy
    - 21.3.7.5.2. Product Strategy
- 21.3.8. Indium Corporation
  - 21.3.8.1. Overview
  - 21.3.8.2. Product Portfolio
  - 21.3.8.3. Key Financials
  - 21.3.8.4. Recent Developments
  - 21.3.8.5. Strategy Overview
    - 21.3.8.5.1. Marketing Strategy
    - 21.3.8.5.2. Product Strategy
- 21.3.9. Zymet
  - 21.3.9.1. Overview
  - 21.3.9.2. Product Portfolio
  - 21.3.9.3. Key Financials
  - 21.3.9.4. Recent Developments
  - 21.3.9.5. Strategy Overview
    - 21.3.9.5.1. Marketing Strategy
    - 21.3.9.5.2. Product Strategy
- 21.3.10. YINCAE Advanced Materials, LLC
  - 21.3.10.1. Overview
  - 21.3.10.2. Product Portfolio
  - 21.3.10.3. Key Financials
  - 21.3.10.4. Recent Developments
  - 21.3.10.5. Strategy Overview
    - 21.3.10.5.1. Marketing Strategy
    - 21.3.10.5.2. Product Strategy
- 21.3.11. LORD Corporation
  - 21.3.11.1. Overview
  - 21.3.11.2. Product Portfolio
  - 21.3.11.3. Key Financials
  - 21.3.11.4. Recent Developments
  - 21.3.11.5. Strategy Overview
    - 21.3.11.5.1. Marketing Strategy
    - 21.3.11.5.2. Product Strategy
- 21.3.12. Sanyu Rec Co., Ltd.
  - 21.3.12.1. Overview
  - 21.3.12.2. Product Portfolio
  - 21.3.12.3. Key Financials
  - 21.3.12.4. Recent Developments
  - 21.3.12.5. Strategy Overview
    - 21.3.12.5.1. Marketing Strategy
    - 21.3.12.5.2. Product Strategy
- 21.3.13. The Dow Chemical Company
  - 21.3.13.1. Overview
  - 21.3.13.2. Product Portfolio
  - 21.3.13.3. Key Financials
  - 21.3.13.4. Recent Developments
  - 21.3.13.5. Strategy Overview
    - 21.3.13.5.1. Marketing Strategy
    - 21.3.13.5.2. Product Strategy
- 21.3.14. Epoxy Technology, Inc.
  - 21.3.14.1. Overview
  - 21.3.14.2. Product Portfolio
  - 21.3.14.3. Key Financials
  - 21.3.14.4. Recent Developments
  - 21.3.14.5. Strategy Overview
    - 21.3.14.5.1. Marketing Strategy
    - 21.3.14.5.2. Product Strategy
- 21.3.15. Panasonic Corporation
  - 21.3.15.1. Overview
  - 21.3.15.2. Product Portfolio
  - 21.3.15.3. Key Financials
  - 21.3.15.4. Recent Developments
  - 21.3.15.5. Strategy Overview
    - 21.3.15.5.1. Marketing Strategy
    - 21.3.15.5.2. Product Strategy
- 21.3.16. Dymax Corporation
  - 21.3.16.1. Overview
  - 21.3.16.2. Product Portfolio
  - 21.3.16.3. Key Financials
  - 21.3.16.4. Recent Developments
  - 21.3.16.5. Strategy Overview
    - 21.3.16.5.1. Marketing Strategy
    - 21.3.16.5.2. Product Strategy
- 21.3.17. ELANTAS GmbH
  - 21.3.17.1. Overview
  - 21.3.17.2. Product Portfolio
  - 21.3.17.3. Key Financials
  - 21.3.17.4. Recent Developments
  - 21.3.17.5. Strategy Overview
    - 21.3.17.5.1. Marketing Strategy
    - 21.3.17.5.2. Product Strategy