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PUBLISHER: Mordor Intelligence | PRODUCT CODE: 1548880

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PUBLISHER: Mordor Intelligence | PRODUCT CODE: 1548880

Flexible Hybrid Electronics (FHE) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

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The Flexible Hybrid Electronics Market size is estimated at USD 180.91 million in 2024, and is expected to reach USD 426.49 million by 2029, growing at a CAGR of 18.71% during the forecast period (2024-2029).

Flexible Hybrid Electronics (FHE) - Market

The increasing applications of these electronic components in wearable electronics, performance monitoring systems, structural health monitoring for constructions, soft robotics, and array antennas are expected to drive the market's growth during the forecast period.

Key Highlights

  • Hybrid electronics combine the flexibility, lightweight nature, thinness, and large-area electronics with the processing power of semiconductors to open a broad range of new applications across different end-use applications, such as the Internet of Things (IoT), smart buildings, healthcare, product packaging, retail, and consumer electronics.
  • Flexible hybrid electronics are also helping product designers use sensors in a new way to collect data and deliver actionable insights that enhance functioning. The growing development and innovations in the market are expected to revolutionize the electronics industry. With the advent of the IoT, flexible hybrid electronics are expected to provide massive opportunities to develop and integrate smart systems and devices for low-cost, everyday use. Industries like automotive, military, aerospace, healthcare, and displays are utilizing flexible and hybrid sensors and wearables in their products.
  • Printed electronics is the process of creating electronic circuits and components on various substrates using printing processes such as screen printing, inkjet printing, and gravure printing. To create electrical devices, conductive inks consisting of silver, carbon nanotubes, or conductive polymers are applied to substrates. RFID tags, flexible displays, printed sensors, smart packaging, and e-textiles are a few examples of printed electronics applications. Lightweight, flexible components and scalable and affordable production procedures make them ideal for large-scale applications. Limited electrical performance compared to standard silicon-based devices, inferior durability, dependability, and material qualities hinder performance in demanding situations.
  • There is an emerging need for lightweight, mechanically flexible, and cost-effective devices in medical, automotive, and consumer electronics applications. Flexible hybrid electronic devices have gained considerable momentum in catering to the industry's needs. Flexible electronics have the potential to transform computing by enabling bendable systems with arbitrary shapes.
  • Government funding boosts R&D activities, leading to innovations and technological advancements in FHE. This support helps overcome technical challenges, reduces costs, and enhances the performance and reliability of FHE products. The government provided funding for various initiatives, including NextFlex Project Call 4.0, the Semi-Flex Tech Project, and the HiFES (hybrid integrated flexible electronic systems) program.
  • The high requirement for research and development (R&D) and infrastructure poses several challenges restraining the demand growth for flexible hybrid electronics (FHE). The significant upfront costs of R&D and infrastructure development deter potential adopters, including businesses and consumers, from investing in FHE technologies. This reluctance stems from concerns over return on investment (ROI) and the affordability of initial deployment.
  • There is a greater need for business goods and services during economic expansion. Businesses frequently invest in technology like flexible hybrid electronics that can increase various industries because of this increase in demand for lightweight, flexible, and conformal designs. For instance, according to MOSPI, in the financial year 2023, the contribution of domestic electronics production value to the Indian GDP was about 2.9%. This contribution share was estimated to increase to 4.7% by the financial year 2026. Such possible expansion in electronics production is projected to increase demand in the market studied.

Flexible Hybrid Electronics (FHE) Market Trends

Electronics Application Segment Holds Significant Market Share

  • The electronics segment, including sensors, displays, and lighting, in the flexible hybrid electronics (FHE) market scope includes thin fingerprint sensors, printed antennas to test water salinity, and printed LED lighting.
  • Flexible hybrid electronics (FHE), a blend of flexible and printed electronics, is gaining momentum for its advantages, including digital additive manufacturing for prototyping, flexibility and stretchability, and compatibility with Roll-to-Roll (R2R) production. FHE merges printed electronics with silicon-based integrated circuits on a flexible substrate. Notable active components from Si CMOS processes include microcontrollers, digital signal processors, high-density memories, and radiofrequency (RF) chips.
  • Flexible hybrid electronics is revolutionizing consumer electronics with flexible displays, rollable screens, flexible batteries, and electronic textiles. These advancements lead to more durable and versatile devices. There's a shift in consumer electronics toward ultra-high resolution, paving the way for high-resolution displays, flexible screens, and intricately designed LED lighting. The heightened resolution enhances visual appeal and functionality, enriching the user experience.
  • By geography, North America is set for a surge in its electronics sector. In June 2024, the NextFlex consortium, a collaboration between the US Department of Defense (DoD) and FlexTech Alliance, unveiled a new funding opportunity of USD 5.3 million. This initiative aims to accelerate the commercialization of flexible hybrid electronics (FHE) in the United States.
  • In May 2024, NextFlex released Project Call 9.0 (PC 9.0), a funding initiative with a total value exceeding USD 11 million. This brings NextFlex's total investment in hybrid electronics advancements to a substantial USD 143 million since its inception. PC 9.0 specifically focuses on enhancing the performance and reliability of hybrid electronic devices.
  • The market for flexible and foldable displays is growing significantly, with technologies like micro-LEDs gaining prominence alongside OLEDs. While micro-LED displays offer exceptional quality, their manufacturing is challenging. According to DSCC, the global market for foldable and rollable smartphones witnessed a revenue surge, increasing from USD 4.5 billion in 2020 to USD 5.5 billion. Projections indicate a substantial uptick, with the market poised to exceed USD 105 billion by 2025, reflecting an impressive compound annual growth rate (CAGR) of over 80% from 2020 to 2025.

Asia-Pacific to Register Major Growth

  • The Asia-Pacific region, including semiconductor hubs like China, Taiwan, and Japan, hosts many pure-play foundries operated by domestic and international vendors. Chengdu, China, for instance, has a comprehensive industrial cluster, advanced technology for new material production, a vast consumer market, and a strong R&D foundation, especially for high-performance materials.
  • The region also holds a significant share of global demand for connected wearables and is one of the fastest-growing markets. Countries like China, Japan, and Singapore are seeing increased demand for flexible smartphones and consumer electronics. The Japanese electronics market is focusing on miniaturizing products with flexible hybrid electronics.
  • Consequently, companies like Samsung, LG, and Apple are launching flexible smartphones exclusively in the region. Chinese vendors are innovating by collaborating with universities and research institutes. For example, Tsinghua University researchers developed ultra-thin flexible chips, less than 25 micrometers thick, that can be embedded in various materials on flexible substrates.
  • In December 2023, Chengdu Hi-tech Industrial Development Zone (CDHT) hosted the China Flexible Electronics Industry Development Conference and the 4th 'Golden Panda' Global Flexible Electronic Industry Innovation and Entrepreneurship Competition. The event aimed to bolster industrial ecosystems and propel Chengdu's FHE sector. CDHT leverages industrial investment funds to integrate capital and industry chains. By 2027, CDHT plans to roll out RMB 300 billion (USD 413.7 billion) in industrial funds, attracting diverse industry collaborators. Flexible hybrid electronics are crucial for China's self-reliance and technological strength. CDHT aims to establish an exchange platform to consolidate technologies and projects in the FHE industry chain.
  • The Chinese FHE industry gained global prominence, as noted by the Flexible Electronic Industry Development Alliance. To capitalize on this, China must plan its industrial layout, establish the "China Carbon Valley" base, focus on core technology research, enhance top-level design, and leverage its flexible hybrid electronics talent.

Flexible Hybrid Electronics (FHE) Industry Overview

The flexible hybrid electronics market is highly fragmented with the presence of major players like DuPont Teijin Films, Domicro BV, General Electric Company, Lockheed Martin Corporation, and American Semiconductor Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

  • April 2024: Brewer Science Inc. launched its innovative smart warehouse monitor system, a game-changer in workplace safety and productivity. This advanced solution engineered for industrial and warehouse applications provides real-time data, ensuring employee safety, enhancing productivity, and optimizing operational efficiency.
  • February 2024: DuPont Teijin Films globally rebranded to Mylar Specialty Films. This rebranding is expected to affect all international operations and offices in the United States, Europe, and Asia. The decision to adopt the new company name pays homage to the legacy of the Mylar brand, which was first introduced as the pioneering biaxially oriented PET film in the 1950s.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support
Product Code: 59142

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Flexible Hybrid Electronics Ecosystem Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Technology Snapshot and FHE Roadmap

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Emerging Need for Lightweight, Mechanically-flexible, and Cost-effective Products
    • 5.1.2 Government Funded Projects
  • 5.2 Market Restraints
    • 5.2.1 High Capital Requirement for Research and Development (R&D) and Infrastructure
  • 5.3 Impact of COVID-19 Aftereffects and Other Macroeconomic Trends on the Market
  • 5.4 Patent Analysis

6 GOVERNMENT SUPPORTED RESEARCH CENTRE

  • 6.1 NextFlex
  • 6.2 Holst Centre
  • 6.3 IMEC
  • 6.4 VTT Technical Research Centre of Finland Ltd (VTT)
  • 6.5 CPI
  • 6.6 CEA Liten
  • 6.7 Korea Institute of Machinery and Materials

7 MARKET SEGMENTATION

  • 7.1 By Application
    • 7.1.1 Electronics
    • 7.1.2 Health Performance Tool
      • 7.1.2.1 Application Summary and Market Potential
      • 7.1.2.2 Use-cases
    • 7.1.3 Security Tag
    • 7.1.4 Industrial and Environmental Monitoring
  • 7.2 By Geography
    • 7.2.1 North America
    • 7.2.2 Europe
    • 7.2.3 Asia
    • 7.2.4 Australia and New Zealand
    • 7.2.5 Latin America
    • 7.2.6 Middle East and Africa

8 COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 DuPont Teijin Films
    • 8.1.2 Domicro BV
    • 8.1.3 General Electric Company
    • 8.1.4 Lockheed Martin Corporation
    • 8.1.5 American Semiconductor Inc
    • 8.1.6 Flex Ltd
    • 8.1.7 Brewer Science Inc.
    • 8.1.8 Integrity Industrial Inkjet Integration
    • 8.1.9 Antenna Research Associates Inc. (SI2 Technologies)
    • 8.1.10 Epicore Biosystems

9 INVESTMENT ANALYSIS

10 MARKET OUTLOOK

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Jeroen Van Heghe

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Christine Sirois

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