3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User, Application

Description

List of Tables

[196 Pages Report] The 3D IC & 2.5D IC Packaging Market size was estimated at USD 92.36 billion in 2023 and expected to reach USD 118.19 billion in 2024, at a CAGR 28.05% to reach USD 521.49 billion by 2030.

Global 3D IC & 2.5D IC Packaging Market

KEY MARKET STATISTICS
Base Year [2023]	USD 92.36 billion
Estimated Year [2024]	USD 118.19 billion
Forecast Year [2030]	USD 521.49 billion
CAGR (%)	28.05%

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the 3D IC & 2.5D IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the 3D IC & 2.5D IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

Market Segmentation & Coverage

This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

Technology
- 2.5D
- 3D TSV
- 3D Wafer-Level Chip-Scale Packaging
End User
- Automotive
- Consumer Electronics
- Industrial Sector
- Medical Devices
- Military & Aerospace
- Smart Technologies
- Telecommunication
Application
- Imaging & Optoelectronics
- LED
- Logic
- Memory
- MEMS/Sensors
- Photonics
- RF
Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam
- Europe, Middle East & Africa
  - Denmark
  - Egypt
  - Finland
  - France
  - Germany
  - Israel
  - Italy
  - Netherlands
  - Nigeria
  - Norway
  - Poland
  - Qatar
  - Russia
  - Saudi Arabia
  - South Africa
  - Spain
  - Sweden
  - Switzerland
  - Turkey
  - United Arab Emirates
  - United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the 3D IC & 2.5D IC Packaging Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the 3D IC & 2.5D IC Packaging Market?

3. What are the technology trends and regulatory frameworks in the 3D IC & 2.5D IC Packaging Market?

4. What is the market share of the leading vendors in the 3D IC & 2.5D IC Packaging Market?

5. Which modes and strategic moves are suitable for entering the 3D IC & 2.5D IC Packaging Market?

Product Code: MRR-4369010656DB

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. 3D IC & 2.5D IC Packaging Market, by Region

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Demand for advanced design in electronic products
  - 5.1.1.2. Increasing inclination to miniaturization of electronic devices
  - 5.1.1.3. Augment of gaming devices and tablet smartphones
- 5.1.2. Restraints
  - 5.1.2.1. Greater levels of integration causes thermal issues
- 5.1.3. Opportunities
  - 5.1.3.1. Rising demand for high-end computing, data centers, and servers
  - 5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
- 5.1.4. Challenges
  - 5.1.4.1. High cost per unit of 3D IC and 2.5D IC
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter's Five Forces Analysis
- 5.5.1. Threat of New Entrants
- 5.5.2. Threat of Substitutes
- 5.5.3. Bargaining Power of Customers
- 5.5.4. Bargaining Power of Suppliers
- 5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. 3D IC & 2.5D IC Packaging Market, by Technology

6.1. Introduction
6.2. 2.5D
6.3. 3D TSV
6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User

7.1. Introduction
7.2. Automotive
7.3. Consumer Electronics
7.4. Industrial Sector
7.5. Medical Devices
7.6. Military & Aerospace
7.7. Smart Technologies
7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application

8.1. Introduction
8.2. Imaging & Optoelectronics
8.3. LED
8.4. Logic
8.5. Memory
8.6. MEMS/Sensors
8.7. Photonics
8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market

9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market

10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market

11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape

12.1. FPNV Positioning Matrix
12.2. Market Share Analysis, By Key Player
12.3. Competitive Scenario Analysis, By Key Player

13. Competitive Portfolio

13.1. Key Company Profiles
- 13.1.1. 3M Company
- 13.1.2. Amkor Technology, Inc.
- 13.1.3. ASE Technology Holding Co, Ltd.
- 13.1.4. Broadcom Inc.
- 13.1.5. Fujitsu Limited
- 13.1.6. Intel Corporation
- 13.1.7. International Business Machines Corporation
- 13.1.8. Jiangsu Changjiang Electronics Technology Co., Ltd.
- 13.1.9. MonolithIC 3D Inc.
- 13.1.10. Samsung Electronics Co. Ltd
- 13.1.11. STMicroelectronics NV
- 13.1.12. Texas Instruments Incorporated
- 13.1.13. Tezzaron Semiconductor Corporation
- 13.1.14. Toshiba Electronic Devices & Storage Corporation
- 13.1.15. United Microelectronics Corporation
- 13.1.16. Xilinx Inc.
13.2. Key Product Portfolio

14. Appendix

14.1. Discussion Guide
14.2. License & Pricing