Outsourced Semiconductor Assembly & Test Services Market by Service Type, Packaging Type, End-User - Cumulative Impact of COVID-19, Russia Ukraine Conflict, and High Inflation

Description

List of Tables

The Global Outsourced Semiconductor Assembly & Test Services Market is forecasted to grow significantly, with a projected USD 33.34 billion in 2023 at a CAGR of 7.51% and expected to reach a staggering USD 55.75 billion by 2030.

The Cumulative Impact of COVID-19, the Russia-Ukraine Conflict, and High Inflation is expected to have significant long-term effects on the Global Outsourced Semiconductor Assembly & Test Services Market. The ongoing research considers the changes in consumer behavior, supply chain disruptions, and government interventions caused by the pandemic. Similarly, the report considers the ongoing political and economic uncertainty in Eastern Europe caused by the Russia-Ukraine Conflict and its potential implications for demand-supply balances, pressure on pricing variants, and import/export and trading. Additionally, the report addresses the impact of High Inflation on the global economy and details fiscal policies measuring and reducing its effects on demand, supply, cash flow, and currency exchange.

Market Segmentation & Coverage:

This research report categorizes the Global Outsourced Semiconductor Assembly & Test Services Market in order to forecast the revenues and analyze trends in each of following sub-markets:

Based on Service Type, market is studied across Assembly & Packaging and Testing. The Assembly & Packaging commanded largest market share of 51.63% in 2022, followed by Testing.

Based on Packaging Type, market is studied across Flip Chip, Wafer Level, and Wire Bond. The Wire Bond commanded largest market share of 37.13% in 2022, followed by Flip Chip.

Based on End-User, market is studied across Computer & Networking, Consumer Electronics, Industrial Electronics, and Telecommunication. The Consumer Electronics commanded largest market share of 28.91% in 2022, followed by Telecommunication.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom. The Asia-Pacific commanded largest market share of 40.23% in 2022, followed by Europe, Middle East & Africa.

Market Statistics:

The report provides market sizing and forecasts across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF; multiple currency support helps organization leaders to make well-informed decisions. In this report, 2018 to 2021 are considered as historical years, 2022 is base year, 2023 is estimated year, and years from 2024 to 2030 are considered as forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix is essential for assessing the Global Outsourced Semiconductor Assembly & Test Services Market. It provides a comprehensive evaluation of vendors by examining key metrics within Business Strategy and Product Satisfaction, allowing users to make informed decisions based on their specific needs. This advanced analysis then organizes these vendors into four distinct quadrants, which represent varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital(V).

Market Share Analysis:

The Market Share Analysis offers an insightful look at the current state of vendors in a particular market space. By comparing vendor contributions to overall revenue, customer base, and other key metrics, we can give companies a greater understanding of their performance and what they are up against when competing for market share. The analysis also sheds light on just how competitive any given sector is about accumulation, fragmentation dominance, and amalgamation traits over the base year period studied.

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on the market offered by the key players

2. Market Development: Provides in-depth information about lucrative emerging markets and analyzes penetration across mature segments of the markets

3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments

4. Market Trends: Provides comprehensive understanding of the Cumulative Impact of COVID-19, the Russia-Ukraine Conflict, and the High Inflation

5. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players

6. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:

1. What is the market size and forecast of the Global Outsourced Semiconductor Assembly & Test Services Market?

2. What are the inhibiting factors and impact of COVID-19 shaping the Global Outsourced Semiconductor Assembly & Test Services Market during the forecast period?

3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Outsourced Semiconductor Assembly & Test Services Market?

4. What is the competitive strategic window for opportunities in the Global Outsourced Semiconductor Assembly & Test Services Market?

5. What are the technology trends and regulatory frameworks in the Global Outsourced Semiconductor Assembly & Test Services Market?

6. What is the market share of the leading vendors in the Global Outsourced Semiconductor Assembly & Test Services Market?

7. What modes and strategic moves are considered suitable for entering the Global Outsourced Semiconductor Assembly & Test Services Market?

Product Code: MRR-742BD5182FE1

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. Outsourced Semiconductor Assembly & Test Services Market, by Service Type, 2022 vs 2030
4.3. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type, 2022 vs 2030
4.4. Outsourced Semiconductor Assembly & Test Services Market, by End-User, 2022 vs 2030
4.5. Outsourced Semiconductor Assembly & Test Services Market, by Region, 2022 vs 2030

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
  - 5.1.1.2. Growth in production of industrial electronics and medical devices
  - 5.1.1.3. Significant inclination toward cost effective outsourced services
- 5.1.2. Restraints
  - 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
- 5.1.3. Opportunities
  - 5.1.3.1. Deployment of intelligent system in OSAT services
  - 5.1.3.2. Rising investments and technologies for advanced packaging and testing
- 5.1.4. Challenges
  - 5.1.4.1. Limited control over operations and data security concerns
5.2. Market Trends
- 5.2.1. Strategic government investments support the expansion of the semiconductor industry and related services in the Americas
- 5.2.2. Powerful competitors and ongoing technological advancements broadens the OSAT market's potential in the APAC region.
- 5.2.3. Expanding end-user demand for semiconductor chips and potential localization of IC production in EMEA
5.3. Cumulative Impact of COVID-19
5.4. Cumulative Impact of Russia-Ukraine Conflict
5.5. Cumulative Impact of High Inflation
5.6. Porter's Five Forces Analysis
- 5.6.1. Threat of New Entrants
- 5.6.2. Threat of Substitutes
- 5.6.3. Bargaining Power of Customers
- 5.6.4. Bargaining Power of Suppliers
- 5.6.5. Industry Rivalry
5.7. Value Chain & Critical Path Analysis
5.8. Regulatory Framework
5.9. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

6.1. Introduction
6.2. Assembly & Packaging
6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

7.1. Introduction
7.2. Flip Chip
7.3. Wafer Level
7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

8.1. Introduction
8.2. Computer & Networking
8.3. Consumer Electronics
8.4. Industrial Electronics
8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape

12.1. FPNV Positioning Matrix
12.2. Market Share Analysis, By Key Player
12.3. Competitive Scenario Analysis, By Key Player
- 12.3.1. Merger & Acquisition
  - 12.3.1.1. Tuv Nord Group Acquires Majority Stake in HTV
- 12.3.2. Agreement, Collaboration, & Partnership
  - 12.3.2.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
  - 12.3.2.2. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
- 12.3.3. New Product Launch & Enhancement
  - 12.3.3.1. Alchip Technologies Announces 3DFabric Alliance Support Plans
  - 12.3.3.2. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
- 12.3.4. Investment & Funding
  - 12.3.4.1. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
- 12.3.5. Award, Recognition, & Expansion
  - 12.3.5.1. Tata Group's Expansion in Electronics and Semiconductor Business
  - 12.3.5.2. Amkor Expands Power Solutions for Automotive Electrification
  - 12.3.5.3. Amkor Expands Power Solutions for Automotive Electrification
  - 12.3.5.4. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
  - 12.3.5.5. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
  - 12.3.5.6. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

13. List of Company Mentioned

14. Appendix

14.1. Discussion Guide
14.2. License & Pricing