Asia-pacific Automotive Semiconductor Market Forecast 2024-2032

List of Tables

KEY FINDINGS

The Asia-Pacific automotive semiconductor market is estimated to register a CAGR of 9.71% during the forecast period, 2024 to 2032.

MARKET INSIGHTS

The growth of the automotive semiconductor market in the Asia-Pacific is driven by increasing R&D investments and supportive government initiatives. Countries such as Taiwan, South Korea, Japan, and China are major semiconductor players in the region, contributing significantly to market expansion. Additionally, the presence of numerous global tech giants further strengthens the market landscape.

REGIONAL ANALYSIS

The Asia-Pacific automotive semiconductor market growth analysis includes the assessment of China, Japan, India, South Korea, Indonesia, Thailand, Vietnam, Australia & New Zealand, and Rest of Asia-Pacific. China possesses significant strength in the semiconductor industry, with a dominant presence in outsourced semiconductor assembly and test (OSAT) and a notable share within the global market. Additionally, the country's potential in integrated circuit (IC) design has seen substantial growth over the past five years.

While there has been rapid progress in semiconductor sectors that enable short-term returns, products requiring longer investment periods have a relatively smaller footprint in China. Market players are also adopting various strategies to promote growth. For example, SiEngine Technology Co, a start-up specializing in advanced automotive system-on-a-chip designs, secured the largest funding in China's domestic car chip design industry in early 2022. These factors are expected to collectively drive the growth of the automotive semiconductor market in China.

Conversely, in Thailand, the second-largest automobile market in Southeast Asia, the government has introduced mandatory GPS tracking for heavy and commercial vehicles transporting dangerous goods. The country also boasts a robust electronics value chain, a result of long-term investments by Japanese corporations. The electronics and electrical appliances (E&E) industry, which traditionally focused on white goods and computers, now includes the production of printed circuit boards, hard disk drives, and integrated circuits. This shift has led to a surge in integrated circuit production capacity. Moreover, recent government initiatives to support the semiconductor industry are facilitating the growth of electric vehicles, thereby creating new opportunities for the automotive semiconductor market.

SEGMENTATION ANALYSIS

The Asia-Pacific automotive semiconductor market segmentation includes component, application, fuel type, and vehicle type. The vehicle type segment includes heavy commercial vehicles (HCVs), light commercial vehicles (LCVs), and passenger cars.

Passenger cars are a widely used means of transportation worldwide, attracting substantial investments to improve various aspects such as design, performance, engines, mechanics, autonomous control, and ergonomics. On average, passenger cars utilize approximately 1,000 semiconductors, reflecting the increasing integration of advanced technologies. Heavy commercial vehicles, on the other hand, have a gross vehicle weight (GVW) exceeding 6 tons. GVW includes both the vehicle's weight and its rated payload-the maximum permissible weight that can be loaded onto the vehicle.

Vehicle ergonomics is considered one of the most critical and complex factors in automotive design due to the wide range of user interaction tasks involved. This complexity spans the three primary domains of ergonomics: physical, cognitive, and organizational. Each of these fields plays a vital role in ensuring that vehicles are comfortable, safe, and efficient for users, addressing everything from seat design to user interfaces and system functionality. Furthermore, modern passenger vehicles typically incorporate around 1,000 semiconductors, making the automotive industry highly reliant on the smooth functioning of semiconductor supply chains.

COMPETITIVE INSIGHTS

Some of the key firms in the Asia-Pacific automotive semiconductor market are STMicroelectronics NV, Robert Bosch GmbH, ROHM Co Ltd, Samsung Electronics Co Ltd, etc.

Samsung Electronics Co Ltd is a prominent consumer electronics brand with a diverse product portfolio, including accessories, memory and storage devices, wearables, smartphones, and virtual reality (VR) equipment. The company is known for its strong research and development capabilities, driving innovation across its offerings. With operations spanning the Americas, Europe, and Asia, Samsung is headquartered in Yeongtong-gu, Suwon, South Korea.

Among its key products is the Samsung Exynos Auto, which features an octa-core CPU and a tri-cluster GPU, designed to deliver high performance and efficiency for automotive applications.

Product Code: 94113

1. RESEARCH SCOPE & METHODOLOGY

1.1. STUDY OBJECTIVES
1.2. METHODOLOGY
1.3. ASSUMPTIONS & LIMITATIONS

2. EXECUTIVE SUMMARY

2.1. MARKET SIZE & ESTIMATES
2.2. MARKET OVERVIEW
2.3. SCOPE OF STUDY
2.4. CRISIS SCENARIO ANALYSIS
- 2.4.1. IMPACT OF COVID-19 ON THE AUTOMOTIVE SEMICONDUCTOR MARKET
2.5. MAJOR MARKET FINDINGS
- 2.5.1. ROBUST GROWTH DRIVEN BY INCREASING VEHICLE ELECTRIFICATION
- 2.5.2. SEMICONDUCTOR COMPANIES ARE INVESTING HEAVILY IN R&D TO DEVELOP INNOVATIVE SOLUTIONS
- 2.5.3. INCREASING COLLABORATIONS BETWEEN SEMICONDUCTOR COMPANIES AND AUTOMOTIVE OEMS

3. MARKET DYNAMICS

3.1. KEY DRIVERS
- 3.1.1. INCREASING DEMAND FOR ELECTRIC VEHICLES (EVS) AND HYBRID ELECTRIC VEHICLES (HEVS)
- 3.1.2. GROWING FOCUS ON CONNECTED CARS
- 3.1.3. INCREASING AUTONOMOUS FEATURES IN CARS
- 3.1.4. DEMAND FOR MORE FUNCTIONS IN ELECTRONIC CONTROL UNIT (ECU)
3.2. KEY RESTRAINTS
- 3.2.1. HIGH DEVELOPMENT COSTS AND LONGER DESIGN CYCLES
- 3.2.2. STRINGENT AUTOMOTIVE SAFETY AND QUALITY STANDARDS
- 3.2.3. SUPPLY CHAIN DISRUPTIONS AND SEMICONDUCTOR SHORTAGES

4. KEY ANALYTICS

4.1. KEY MARKET TRENDS
- 4.1.1. RISING DEMAND FOR AUTOMOTIVE-GRADE MICROCONTROLLERS (MCUS) AND SYSTEM-ON-CHIP (SOC) SOLUTIONS
- 4.1.2. GROWING EMPHASIS ON AUTOMOTIVE CYBERSECURITY SOLUTIONS
- 4.1.3. SHIFT TOWARDS AUTOMOTIVE-GRADE ARTIFICIAL INTELLIGENCE (AI) PROCESSORS AND NEURAL NETWORK ACCELERATORS
4.2. PORTER'S FIVE FORCES ANALYSIS
- 4.2.1. BUYERS POWER
- 4.2.2. SUPPLIERS POWER
- 4.2.3. SUBSTITUTION
- 4.2.4. NEW ENTRANTS
- 4.2.5. INDUSTRY RIVALRY
4.3. GROWTH PROSPECT MAPPING
- 4.3.1. GROWTH PROSPECT MAPPING FOR ASIA-PACIFIC
4.4. MARKET CONCENTRATION ANALYSIS
4.5. VALUE CHAIN ANALYSIS
- 4.5.1. RAW MATERIAL SUPPLIERS
- 4.5.2. SEMICONDUCTOR MANUFACTURERS
- 4.5.3. SEMICONDUCTOR PACKAGING AND TESTING
- 4.5.4. AUTOMOTIVE SYSTEM INTEGRATORS
- 4.5.5. DEALERSHIPS AND AFTERMARKET
4.6. KEY BUYING CRITERIA
- 4.6.1. PERFORMANCE AND RELIABILITY
- 4.6.2. COMPATIBILITY AND INTEGRATION
- 4.6.3. COST-EFFECTIVENESS
- 4.6.4. BRAND REPUTATION
4.7. REGULATORY FRAMEWORK

5. MARKET BY VEHICLE TYPE

5.1. PASSENGER CARS
5.2. LIGHT COMMERCIAL VEHICLES (LCVS)
5.3. HEAVY COMMERCIAL VEHICLES (HCVS)

6. MARKET BY FUEL TYPE

6.1. GASOLINE
6.2. DIESEL
6.3. ELECTRIC/HYBRID

7. MARKET BY APPLICATION

7.1. ADVANCED DRIVER ASSISTANCE SYSTEMS
7.2. BODY ELECTRONICS
7.3. INFOTAINMENT
7.4. POWERTRAIN
7.5. SAFETY SYSTEMS

8. MARKET BY COMPONENT

8.1. PROCESSORS
8.2. ANALOG ICS
8.3. DISCRETE POWER DEVICES
8.4. SENSORS
- 8.4.1. LED
- 8.4.2. IMAGE SENSOR
- 8.4.3. POSITION SENSOR
- 8.4.4. TEMPERATURE SENSOR
- 8.4.5. PRESSURE SENSOR
- 8.4.6. OTHER SENSOR TYPES
8.5. MEMORY TYPE
- 8.5.1. DRAM
- 8.5.2. FLASH
8.6. LIGHTING DEVICES

9. GEOGRAPHICAL ANALYSIS

9.1. ASIA-PACIFIC
- 9.1.1. MARKET SIZE & ESTIMATES
- 9.1.2. ASIA-PACIFIC AUTOMOTIVE SEMICONDUCTOR MARKET DRIVERS
- 9.1.3. ASIA-PACIFIC AUTOMOTIVE SEMICONDUCTOR MARKET CHALLENGES
- 9.1.4. KEY PLAYERS IN ASIA-PACIFIC AUTOMOTIVE SEMICONDUCTOR MARKET
- 9.1.5. COUNTRY ANALYSIS
  - 9.1.5.1. CHINA
  - 9.1.5.1.1. CHINA AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.2. JAPAN
  - 9.1.5.2.1. JAPAN AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.3. INDIA
  - 9.1.5.3.1. INDIA AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.4. SOUTH KOREA
  - 9.1.5.4.1. SOUTH KOREA AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.5. INDONESIA
  - 9.1.5.5.1. INDONESIA AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.6. THAILAND
  - 9.1.5.6.1. THAILAND AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.7. VIETNAM
  - 9.1.5.7.1. VIETNAM AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.8. AUSTRALIA & NEW ZEALAND
  - 9.1.5.8.1. AUSTRALIA & NEW ZEALAND AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES
  - 9.1.5.9. REST OF ASIA-PACIFIC
  - 9.1.5.9.1. REST OF ASIA-PACIFIC AUTOMOTIVE SEMICONDUCTOR MARKET SIZE & OPPORTUNITIES

10. COMPETITIVE LANDSCAPE

10.1. KEY STRATEGIC DEVELOPMENTS
- 10.1.1. MERGERS & ACQUISITIONS
- 10.1.2. PRODUCT LAUNCHES & DEVELOPMENTS
- 10.1.3. PARTNERSHIPS & AGREEMENTS
- 10.1.4. BUSINESS EXPANSIONS & DIVESTITURES
10.2. COMPANY PROFILES
- 10.2.1. ANALOG DEVICES INC
  - 10.2.1.1. COMPANY OVERVIEW
  - 10.2.1.2. PRODUCTS
  - 10.2.1.3. STRENGTHS & CHALLENGES
- 10.2.2. INFINEON TECHNOLOGIES AG
  - 10.2.2.1. COMPANY OVERVIEW
  - 10.2.2.2. PRODUCTS
  - 10.2.2.3. STRENGTHS & CHALLENGES
- 10.2.3. INTEL CORPORATION
  - 10.2.3.1. COMPANY OVERVIEW
  - 10.2.3.2. PRODUCTS
  - 10.2.3.3. STRENGTHS & CHALLENGES
- 10.2.4. MICROCHIP TECHNOLOGY INCORPORATED
  - 10.2.4.1. COMPANY OVERVIEW
  - 10.2.4.2. PRODUCTS
  - 10.2.4.3. STRENGTHS & CHALLENGES
- 10.2.5. MICRON TECHNOLOGY INC
  - 10.2.5.1. COMPANY OVERVIEW
  - 10.2.5.2. PRODUCTS
  - 10.2.5.3. STRENGTHS & CHALLENGES
- 10.2.6. NXP SEMICONDUCTORS NV
  - 10.2.6.1. COMPANY OVERVIEW
  - 10.2.6.2. PRODUCTS
  - 10.2.6.3. STRENGTHS & CHALLENGES
- 10.2.7. ON SEMICONDUCTOR CORPORATION
  - 10.2.7.1. COMPANY OVERVIEW
  - 10.2.7.2. PRODUCTS
  - 10.2.7.3. STRENGTHS & CHALLENGES
- 10.2.8. QUALCOMM TECHNOLOGIES INC
  - 10.2.8.1. COMPANY OVERVIEW
  - 10.2.8.2. PRODUCTS
  - 10.2.8.3. STRENGTHS & CHALLENGES
- 10.2.9. RENESAS ELECTRONICS CORPORATION
  - 10.2.9.1. COMPANY OVERVIEW
  - 10.2.9.2. PRODUCTS
  - 10.2.9.3. STRENGTHS & CHALLENGES
- 10.2.10. ROBERT BOSCH GMBH
  - 10.2.10.1. COMPANY OVERVIEW
  - 10.2.10.2. PRODUCTS
  - 10.2.10.3. STRENGTHS & CHALLENGES
- 10.2.11. ROHM CO LTD
  - 10.2.11.1. COMPANY OVERVIEW
  - 10.2.11.2. PRODUCTS
  - 10.2.11.3. STRENGTHS & CHALLENGES
- 10.2.12. SAMSUNG ELECTRONICS CO LTD
  - 10.2.12.1. COMPANY OVERVIEW
  - 10.2.12.2. PRODUCTS
  - 10.2.12.3. STRENGTHS & CHALLENGES
- 10.2.13. STMICROELECTRONICS NV
  - 10.2.13.1. COMPANY OVERVIEW
  - 10.2.13.2. PRODUCTS
  - 10.2.13.3. STRENGTHS & CHALLENGES
- 10.2.14. TEXAS INSTRUMENTS INCORPORATED
  - 10.2.14.1. COMPANY OVERVIEW
  - 10.2.14.2. PRODUCTS
  - 10.2.14.3. STRENGTHS & CHALLENGES
- 10.2.15. TOSHIBA CORPORATION
  - 10.2.15.1. COMPANY OVERVIEW
  - 10.2.15.2. PRODUCTS
  - 10.2.15.3. STRENGTHS & CHALLENGES