PUBLISHER: TechNavio | PRODUCT CODE: 1400446
PUBLISHER: TechNavio | PRODUCT CODE: 1400446
The electronics parts forward logistics market in APAC is forecasted to grow by USD 1.84 bn during 2023-2028, accelerating at a CAGR of 8.76% during the forecast period. The report on the electronics parts forward logistics market in APAC provides a holistic analysis, market size and forecast, trends, growth drivers, challenges, and vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing electronic parts trade between China and India, increasing hardware spending in APAC, and growing government support for the logistics industry in China.
Market Scope | |
---|---|
Base Year | 2023 |
End Year | 2028 |
Series Year | 2024-2028 |
Growth Momentum | Accelerate |
YOY 2024 | 8.1% |
CAGR | 8.76% |
Incremental Value | $1.84bn |
Technavio's electronics parts forward logistics market in APAC is segmented as below:
By Service
By End-user
By Geography
This study identifies the penetration of blockchain technology in logistics supply chains as one of the prime reasons driving the electronics parts forward logistics market in APAC growth during the next few years. Also, the growing requirements for green logistics and an increase in mergers and acquisitions activities among electronics parts forward logistics players will lead to sizable demand in the market.
The report on the electronics parts forward logistics market in APAC covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading electronics parts forward logistics market in APAC vendors that include CEVA Logistics S A, CMA CGM SA Group, DB Schenker, Deutsche Post AG, DSV AS, Expeditors International of Washington Inc., FedEx Corp., Hitachi Transport System Ltd., Kuehne Nagel Management AG, Seashell Logistics Pvt Ltd, United Parcel Service Inc., XPO Inc., and AP Moller Maersk AS. Also, the electronics parts forward logistics market in the APAC analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape and an analysis of the key vendors.
The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
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