PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1398976
PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1398976
This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.
Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.
Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.
Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.
Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.
Alchip
Amazon
AMD
Amkor
Apple
Ardentec
ASE Group
ASEN Semiconductors
Baidu
Biren
Bitmain
Cadence
Geely
Bosch
Broadcom
China Wafer Level
Chipmore Technology
ChipMOS
Chrysler
DB HiTek
Dell
Denso
Episil
Faraday
FlipChip International
FocalTech
Ford
Forehope Electronic
Formosa Advanced
General Motors
GigaDevice
Global Unichip
GlobalFoundries
Google
Hana Microelectronics
Himax
HiSilicon
Hongxin Semiconductor
HP
HSMC
Huawei
Jinan Quanxin
Macronix
Hua Hong Semiconductor
Huahong Group
Huatian Technology
Infineon
Intel
Inventec
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Macronix
Marvell
MediaTek
MediaTek
Micron
OmniVision
Qualcomm
RDA Microelectronics
Siemens
Silead
Micron
Mosel
Nanya Technology
Nepes
Nexchip
Novatek
Nuvoton
Nvidia
NXP
Onsemi
Open AI
Orient Semiconductor
Payton Technology
Powertech Technology
PSMC
Qorvo
Qualcomm
Quanta
Realtek
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
Spreadtrum
Synopsys
STATS ChipPAC
STMicroelectronics
Sunplus
Supermicro
Texas Instruments
Tongfu Electronics
Tower
Tsinghua Unigroup
TSMC
UMC
Unimos Microelectronics
Unisem
Unisoc
Unitech Holdings
UTAC
Vanguard
VIS
Walton Advanced Engineering
Will Semiconductor
Winbond
Wise Road Capital
Wistron
Xilinx
YTEC