The GaAs IC Market

The semiconductor industry is on the cusp of significant transformations, with Gallium Arsenide Integrated Circuits (GaAs ICs) playing a pivotal role in driving these changes. Our report, "The GaAs IC Market," offers an in-depth analysis of this crucial segment, exploring the multifaceted applications, technological advancements, and market dynamics that define the current and future landscape of GaAs ICs. Designed for professionals looking to stay ahead in the competitive semiconductor market, this report provides comprehensive insights into the factors propelling the growth and adoption of GaAs IC technology.

Trends in GaAs IC Technology

The technological advancements in GaAs ICs are reshaping various sectors, from telecommunications to defense. One of the most prominent trends is the increasing integration of GaAs ICs in high-frequency applications. Thanks to their high electron mobility, GaAs ICs offer superior performance in RF and microwave circuits, making them indispensable for next-generation communication systems such as 5G networks and advanced satellite communications. The ability of GaAs to operate efficiently at higher frequencies and power levels positions it as a key material for the future of wireless communication.

In the realm of optoelectronics, GaAs ICs are gaining traction due to their direct bandgap property, which enhances their efficiency in light-emitting applications. This trend is particularly notable in the expansion of fiber optic communications and the proliferation of advanced sensors, where GaAs ICs provide unparalleled speed and reliability. As industries continue to push the boundaries of data transmission and sensing technologies, GaAs ICs are set to play a critical role in achieving higher performance standards.

The defense and aerospace sectors are also major adopters of GaAs IC technology. The robustness and high-performance capabilities of GaAs circuits under extreme conditions make them ideal for applications in radar systems, electronic warfare, and other critical defense technologies. Additionally, the growing focus on energy efficiency and renewable energy solutions has spurred interest in GaAs-based power amplifiers and converters, which offer superior efficiency and thermal management compared to traditional silicon-based devices.

The Need to Purchase This Report

For businesses and professionals navigating the semiconductor landscape, understanding the intricacies of the GaAs IC market is essential. This report provides a detailed analysis of current market trends, technological innovations, and key drivers shaping the GaAs IC industry. By purchasing this report, stakeholders will gain a strategic advantage through comprehensive market forecasts, competitive landscape evaluations, and insights into the latest advancements in GaAs technology.

Our report offers strategic recommendations for leveraging GaAs IC technology to enhance product performance and capture market opportunities. It delves into the applications of GaAs ICs across various sectors, including telecommunications, optoelectronics, and defense, providing readers with actionable intelligence to inform investment and development decisions. Companies looking to invest in GaAs technology or expand their market presence will find this report invaluable for identifying growth areas and understanding competitive dynamics.

In essence, "The GaAs IC Market" report is an indispensable resource for industry professionals, engineers, researchers, and business leaders. It equips readers with the knowledge needed to navigate the complexities of the GaAs IC market and capitalize on emerging opportunities. By understanding the trends and technological advancements detailed in this report, stakeholders can make informed decisions that drive innovation and growth in the semiconductor industry.

Chapter 1. Introduction

Chapter 2. Executive Summary

2.1. Summary of Major Issues
2.2. Summary of Market Forecast

Chapter 3. Technology Issues

3.1. GaAs Devices
- 3.1.1. FETs
- 3.1.2. HEMTs
- 3.1.3. HBT
3.2. Comparison of Logic Structures
- 3.2.1. Buffered FET Logic
- 3.2.2. FET Logic
- 3.2.3. Capacitively Enhanced Logic
- 3.2.4. Direct-Coupled FET Logic
- 3.2.5. Source-Coupled FET Logic
3.3. Material Issues
- 3.3.1. Wafer Production
- 3.3.2. Etch Pit Densities
3.4. Equipment
- 3.4.1. Implanters
- 3.4.2. Lithography
- 3.4.3. Etching
- 3.4.4. Deposition
- 3.4.5. Rapid Thermal Processing
3.5. Packaging
- 3.5.1. Package Types
- 3.5.2. Bonding
3.6. Testing
3.7. Design

Chapter 4. Applications for GaAs ICs

4.1. Introduction
- 4.1.1. The Trend Toward Higher Frequencies
- 4.1.2. Transition from Analog to Digital Modulation
- 4.1.3. Discrete Components and Silicon-Based ICs
4.2. Markets
- 4.2.1. Telecommunications Systems
- 4.2.2. Television Systems
- 4.2.3. Computing
- 4.2.4. Data Communications
- 4.2.5. Automotive
- 4.2.6. Automated Test Equipment
- 4.2.7. Military

Chapter 5. IC Supplier and End-User Issues

5.1. Introduction
5.2. Competing Against Silicon
5.3. Competing Against The Japanese
5.4. Taiwan's Market Momentum
5.5. Korea's Market Momentum
5.6. Wafer Sizes
5.7. Competing Against SiGe
- 5.7.1. Introduction
- 5.7.2. Technology
  - 5.7.2.1. Strained Silicon
  - 5.7.2.2. Device Manufacturing
- 5.7.3. Applications
  - 5.7.3.1. Wireless LAN
  - 5.7.3.2. WiMAX
  - 5.7.3.3. Bluetooth
  - 5.7.3.4. Cellular
  - 5.7.3.5. GPS

Chapter 6. Market Forecast

6.1. Driving Forces
6.2. Market Forecast Assumptions
6.3. GaAs IC Market Forecast
6.4. SiGe IC Market Forecast
6.5. End Application Market

Chapter 7. Profile of GaAs IC Manufacturers

LIST OF TABLES

5.1. Cost Comparison for GaAs Structures
5.2. A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs
6.1. Worldwide Merchant GaAs IC Market Forecast By Device Type
6.2. Worldwide Merchant Market Forecast By Geographical Region
6.3. Worldwide Merchant Market Forecast By Application
6.4. Market Shares of Merchant Participants-2013

LIST OF FIGURES

3.1. Schematic of GaAs MESFET
3.2. Schematic of GaAs HEMT Device
3.3. Schematic of GaAs HBT Device
3.4. Schematic of GaAs HBT Device
3.5. Symbolic Representations of Various GaAs Transistor Type
3.6. Schematic of BFL Logic Gate
3.7. Schematic of FETL Logic Gate
3.8. Schematic of CEL Logic Gate
3.9. Schematic of DCFL Logic Gate
3.10. Schematic of SCFL Logic Gate
3.11. Full wafer EPD mapping of LEC and VGF wafers
3.12. Mesoscopic EL2 mapping of LEC and VGF wafers
3.13. pHEMT MMIC Process Flow Chart
3.14. 0.15 Micron 3MI Process Cross Section
3.15. InGaP HBT Process
5.1. Comparison of Die Costs of Si and GaAs
5.2. Strained Silicon Germanium Technology
5.3. Fourth Generation Of Strain Technology
5.4. Performance Versus Germanium Content
5.5. Bulk Versus SOI Strain Method
6.1. Worldwide Merchant GaAs IC Market Forecast
6.2. Worldwide GaAs Merchant Market Forecast By Geographical Region
6.3. Worldwide GaAs Merchant Market Forecast By Application
6.4. Global Handset Market
6.5. Migration Of PA's In Handset Market
6.6. CMOS Replacement Of Bipolar And GaAs
6.7. Worldwide SiGe Market Forecast