PUBLISHER: Grand View Research | PRODUCT CODE: 1588396
PUBLISHER: Grand View Research | PRODUCT CODE: 1588396
The global laser debonding equipment market size was estimated at USD 2,108.2 million in 2023 and is projected to grow at a CAGR of 6.4% from 2024 to 2030. Laser debonding technology is becoming increasingly popular due to its precision, efficiency, and application in industries like semiconductors, solar energy, and medical devices. The ability of laser systems to debond materials without causing damage to sensitive components is a key factor driving demand.
The laser debonding process is essential in applications where traditional mechanical debonding methods are not effective, offering high precision and low material wastage. It is widely adopted in industries that require intricate material handling, such as semiconductor wafer debonding and medical device debonding. The market is poised to witness strong growth due to increasing advancements in laser technologies and expanding applications in industrial processes.
Technological advancements are driving innovation in laser Debonding equipment, with newer technologies such as Laser-Induced Breakdown Spectroscopy (LIBS), laser ablation, and Laser-Induced Forward Transfer (LIFT) becoming more prevalent. These technologies offer greater precision, faster processing times, and improved material handling capabilities. The development of multi-functional laser systems that can handle complex tasks like wafer debonding and solar cell interconnect debonding in a single process step is pushing the boundaries of efficiency and scalability in the market.
Global Laser Debonding Equipment Market Report Segmentation
This report forecasts revenue growth at global, regional & country levels and provides an analysis on the industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global laser debonding equipment market report based on technology, laser type, application, and region: