PUBLISHER: Grand View Research | PRODUCT CODE: 1530001
PUBLISHER: Grand View Research | PRODUCT CODE: 1530001
The global passive and interconnecting electronic components market size is projected to reach USD 258.01 billion by 2030, growing at a CAGR of 5.1% from 2024 to 2030, according to a new report by Grand View Research, Inc. Electronic components play an essential role in several verticals, including IT and telecommunication, consumer electronics, automotive, aerospace and defense, and healthcare. They form an indispensable part of an electronic system and help it function automatically. Moreover, the rapidly surging demand for consumer electronic goods and household appliances such as smartphones, laptops, digital cameras, and air conditioners is expected to fuel market growth over the forthcoming years.
The rising need for enhanced data speed among consumers, businesses, and industries has enabled key telecom operators such as AT&T, Verizon, China Mobile Limited, and KT Corp. to install 5G network infrastructure in order to deliver seamless connectivity to their customers. With a significant surge in demand for telecom equipment and network devices to build 5G network infrastructure, it is anticipated to augment the adoption of passive and interconnecting electronic components during the forecast period.
The rapidly evolving technologies such as robotics and sensors-based systems for industrial applications to improve overall productivity and operational efficiencies are further estimated to augment the demand for passive and interconnecting components. Furthermore, wearables such as smartwatches, virtual reality (VR) headsets, and fitness bands are gaining popularity among consumers. Also, consumers are spending a massive amount on their health and entertainment. As a result, it has accelerated the demand for the aforementioned wearable devices among consumers.
Companies manufacturing passive and interconnecting electronic components are investing in Research and Development (R&D) to provide innovative products to their customers. For instance, in March 2023, Linx Technologies, now part of TE Connectivity, announced the launch of new surface-mount Radio Frequency (RF) switch connectors that offer high isolation between ports to enhance data accuracy. These connectors, available in SWD and SWF versions, are designed for diagnostic measurement on printed circuit boards and meet stringent industry standards, making them suitable for high-volume applications.