Picture
SEARCH
What are you looking for?
Need help finding what you are looking for? Contact Us
Compare

PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620598

Cover Image

PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620598

Silicon-on-Insulator (SOI) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

PUBLISHED:
PAGES: 190 Pages
DELIVERY TIME: 2-3 business days
SELECT AN OPTION
PDF & Excel (Single User License)
USD 4850
PDF & Excel (Multi User License)
USD 5350
PDF & Excel (Enterprise User License)
USD 8350

Add to Cart

The Global Silicon-On-Insulator (SOI) Market was valued at USD 1.3 billion in 2023 and is projected to grow at a CAGR of 15.3% from 2024 to 2032. This growth is fueled by increasing demand for low-power, high-performance electronics and the rising adoption of SOI technology across various industries, particularly automotive. The need for faster, more power-efficient devices such as smartphones, wearables, and tablets has led to a greater focus on SOI technology. Fully Depleted SOI (FD-SOI) has gained popularity for its ability to reduce power consumption while maintaining optimal performance, making it a key technology in consumer electronics. Meanwhile, the automotive sector is rapidly adopting SOI technology, driven by the shift towards electric vehicles (EVs) and autonomous driving systems.

SOI's reliability, heat resistance, and energy efficiency make it ideal for use in advanced driver assistance systems (ADAS) and EV power management. A key advantage of SOI-based chips is their ability to reduce power consumption by up to 30% compared to conventional silicon chips. This power efficiency is critical for applications requiring high performance with minimal energy use, such as ADAS and vehicle infotainment systems. The SOI market is segmented by technology into smart cut, bonding SOI, and layer transfer SOI.

The smart cut segment is expected to grow at a CAGR of over 16%, reaching a value of over USD 3 billion by 2032. Smart cut technology enables the production of ultra-thin SOI wafers, offering scalability and consistent quality, which makes it well-suited for FD-SOI applications in low-power devices. By wafer size, the SOI market is divided into 200mm and 300mm categories. The 300mm wafer segment dominated the market in 2023, with a market share exceeding 64%. Larger wafers like 300mm offer the advantage of supporting high-volume production, making them highly efficient for advanced semiconductor applications.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$1.3 Billion
Forecast Value$4.85 Billion
CAGR15.3%

This shift to 300mm wafers is driven by their ability to deliver better yield rates and lower production costs, making them a cost-effective solution for industries such as consumer electronics, telecommunications, and automotive. North America accounted for over 28% of the global SOI market share in 2023, with the U.S. experiencing rapid growth. This growth is driven by the demand for advanced semiconductors in the electronics, telecommunications, and automotive sectors. The U.S. has also emerged as a leader in SOI adoption due to substantial investments in R&D and the fast-paced adoption of technologies like 5G and IoT.

The increasing focus on electric and autonomous vehicles further supports the growth of SOI in power management systems.

Product Code: 11817

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Increasing demand for low-power, high-performance devices
      • 3.6.1.2 Growing adoption in automotive industry
      • 3.6.1.3 Expansion of 5G and telecommunications infrastructure
      • 3.6.1.4 Advances in data centers and cloud computing
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 High production costs
      • 3.6.2.2 Limited material availability
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Wafer Type, 2021-2032 (USD Billion)

  • 5.1 Key trends
  • 5.2 RF SOI
  • 5.3 FD SOI (fully depleted SOI)
  • 5.4 PD SOI (partially depleted SOI)
  • 5.5 Power SOI
  • 5.6 Others

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Billion)

  • 6.1 Key trends
  • 6.2 200mm
  • 6.3 300mm

Chapter 7 Market Estimates & Forecast, By Technology, 2021-2032 (USD Billion)

  • 7.1 Key trends
  • 7.2 Smart cut
  • 7.3 Bonding SOI
  • 7.4 Layer transfer SOI

Chapter 8 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion)

  • 8.1 Key trends
  • 8.2 RF FEM products
  • 8.3 MEMS devices
  • 8.4 Power products
  • 8.5 Optical communication
  • 8.6 Image sensing
  • 8.7 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Billion)

  • 9.1 Key trends
  • 9.2 Consumer electronics
  • 9.3 Automotive
  • 9.4 Datacom & telecom
  • 9.5 Industrial
  • 9.6 Aerospace & defence
  • 9.7 Others

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion)

  • 10.1 Key trends
  • 10.2 North America
    • 10.2.1 U.S.
    • 10.2.2 Canada
  • 10.3 Europe
    • 10.3.1 UK
    • 10.3.2 Germany
    • 10.3.3 France
    • 10.3.4 Italy
    • 10.3.5 Spain
    • 10.3.6 Russia
  • 10.4 Asia Pacific
    • 10.4.1 China
    • 10.4.2 India
    • 10.4.3 Japan
    • 10.4.4 South Korea
    • 10.4.5 Australia
  • 10.5 Latin America
    • 10.5.1 Brazil
    • 10.5.2 Mexico
  • 10.6 MEA
    • 10.6.1 South Africa
    • 10.6.2 Saudi Arabia
    • 10.6.3 UAE

Chapter 11 Company Profiles

  • 11.1 GlobalWafers
  • 11.2 Honeywell International Inc.
  • 11.3 NXP Semiconductors
  • 11.4 Okmetic
  • 11.5 Qorvo
  • 11.6 Seiren KST
  • 11.7 Shanghai Simgui Technology
  • 11.8 Shin-Etsu Chemical
  • 11.9 Silicon Valley Microelectronics
  • 11.10 Skyworks Solutions
  • 11.11 Soitec
  • 11.12 STMicroelectronics
  • 11.13 Sumco
  • 11.14 Taiwan Semiconductor Manufacturing
  • 11.15 Tower Semiconductor
  • 11.16 Ultrasil
  • 11.17 Vanguard International Semiconductor
  • 11.18 WaferPro
Have a question?
Picture

Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

Picture

Christine Sirois

Manager - Americas

+1-860-674-8796

Questions? Please give us a call or visit the contact form.
Hi, how can we help?
Contact us!