PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620447
PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620447
Semiconductor and IC Packaging Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032
The Global Semiconductor And IC Packaging Materials Market was valued at USD 4.1 billion in 2023 and is projected to grow at a CAGR of 10% from 2024 to 2032. This growth is primarily driven by the rapid expansion of consumer electronics, such as smartphones and wearable devices, increasing the demand for advanced packaging solutions. The rise of the Internet of Things (IoT) has also contributed to the market's growth, as the number of connected devices across industries such as smart homes, healthcare, and healthcare manufacturing surged. According to the GSMA 2023 report, IoT connections are expected to more than double, from 2.5 billion in 2022 to over 5 billion by 2030.
This explosion in connected devices fuels the need for semiconductors and ICs, creating a higher demand for packaging materials that offer protection, efficient heat dissipation, and enhanced electrical performance. The market is segmented by type, including organic substrates, bonding wires, lead frames, encapsulation resins, die attach materials, thermal interface materials, ceramic packages, and others.Among these, the organic substrate segment is projected to grow at a CAGR of over 10% throughout 2024-2032.
Organic substrates find extensive usage in consumer electronics, particularly in devices like smartphones, tablets, and wearables. Increasing demand for these electronics, spurred by rapid technological advances, drives the need for these substrates. In terms of end-use industries, the semiconductor and IC packaging materials market serves sectors such as aerospace and defense, automotive, consumer electronics, healthcare, IT and telecommunications, and others. The IT and telecommunications sector is projected to dominate, generating over USD 3 billion in revenue by 2032. The ongoing rollout of 5G networks, the expansion of data centers, and the development of cutting-edge communication infrastructure are key factors driving demand in this sector for high-performance packaging materials.
| Market Scope | |
|---|---|
| Start Year | 2023 |
| Forecast Year | 2024-2032 |
| Start Value | $4.1 Billion |
| Forecast Value | $10 Billion |
| CAGR | 10% |
North America is set to experience significant growth in the semiconductor and IC packaging materials market, with a projected CAGR of over 10% by 2032. The region's established technological infrastructure, heavy investment in research and development, and strong manufacturing capabilities contribute to its leadership position. Major semiconductor companies like Intel, AMD, and Qualcomm, concentrated in North America, help advance the industry and set global standards for innovation
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Market scope & definition
- 1.2 Base estimates & calculations
- 1.3 Forecast calculation
- 1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
- 1.4.2.1 Paid sources
- 1.4.2.2 Public sources
Chapter 2 Executive Summary
- 2.1 Industry 360° synopsis, 2021-2032
Chapter 3 Industry Insights
- 3.1 Industry ecosystem analysis
- 3.2 Vendor matrix
- 3.3 Profit margin analysis
- 3.4 Technology & innovation landscape
- 3.5 Patent analysis
- 3.6 Key news and initiatives
- 3.7 Regulatory landscape
- 3.8 Impact forces
- 3.8.1 Growth drivers
- 3.8.1.1 Expanding semiconductor applications in industrial automation
- 3.8.1.2 Advancement in semiconductor technologies
- 3.8.1.3 Expansion of consumer electronics
- 3.8.1.4 Proliferation of IoT devices
- 3.8.1.5 Rising demand for 5G and high-performance computing
- 3.8.2 Industry pitfalls & challenges
- 3.8.2.1 Manufacturing complexity and costs
- 3.8.2.2 Technical and inspection issues
- 3.8.1 Growth drivers
- 3.9 Growth potential analysis
- 3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
- 3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
- 4.1 Introduction
- 4.2 Company market share analysis
- 4.3 Competitive positioning matrix
- 4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)
- 5.1 Key trends
- 5.2 Organic substrate
- 5.3 Bonding wires
- 5.4 Lead frames
- 5.5 Encapsulation resins
- 5.6 Ceramic packages
- 5.7 Die attach materials
- 5.8 Thermal interface materials
- 5.9 Others
Chapter 6 Market Estimates & Forecast, By Packaging Technology, 2021-2032 (USD Million)
- 6.1 Key trends
- 6.2 Wire bonding
- 6.3 Flip-chip packaging
- 6.4 Wafer-level packaging (WLP)
- 6.5 System-in-package (SiP)
- 6.6 Others
Chapter 7 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)
- 7.1 Key trends
- 7.2 Aerospace & defense
- 7.3 Automotive
- 7.4 Consumer electronics
- 7.5 Healthcare
- 7.6 IT & telecommunication
- 7.7 Others
Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)
- 8.1 Key trends
- 8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
- 8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
- 8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
- 8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
- 8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA
Chapter 9 Company Profiles
- 9.1 ASE
- 9.2 Chang Chun Group
- 9.3 DuPont
- 9.4 Henkel
- 9.5 Hitachi High-Tech
- 9.6 Indium
- 9.7 Kyocera
- 9.8 LG Chem
- 9.9 MacDermid Alpha Electronics Solutions
- 9.10 Nan Ya Plastics
- 9.11 Powertech Technology
- 9.12 Samsung Electro-Mechanics
- 9.13 Shin-Etsu Chemical
- 9.14 Sumitomo Bakelite
- 9.15 Sumitomo Chemical
- 9.16 Tanaka Holdings
- 9.17 Texas Instruments
- 9.18 Toppan Printing
- 9.19 Toray Industries
- 9.20 VeriSilicon
