PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620437
PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1620437
Thin Wafer Processing and Dicing Equipment Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032
The Global Thin Wafer Processing And Dicing Equipment Market was valued at USD 710.3 million in 2023, with projections indicating a compound annual growth rate (CAGR) of 7% from 2024 to 2032. This growth is primarily driven by the rising demand for compact and high-performance electronic devices across diverse sectors, including consumer electronics, automotive, and telecommunications. The advent of technologies such as 5G and the increasing popularity of electric vehicles have heightened the need for precision wafer processing. Advanced materials like silicon carbide (SiC) and gallium nitride (GaN) further underscore the necessity for meticulous production processes to manufacture microchips and sensors effectively. Additionally, innovations in laser-based dicing technologies, known for their speed, accuracy, and cost-effectiveness, propel market expansion by enabling the production of thinner and more durable semiconductor components.
The thin wafer processing and dicing equipment market can be categorized based on equipment type into thinning equipment and dicing equipment. The dicing equipment segment is projected to surpass USD 800 million by 2032. This equipment is essential during the wafer fabrication post-processing phase, where wafers are separated into individual chips. The demand for sophisticated dicing solutions is rising, driven by the trend toward miniaturizing electronic components. Precise and efficient dicing methods are crucial for enhancing yield and overall performance.
In terms of applications, the market encompasses various sectors, including CMOS image sensors, memory and logic (through-silicon via or TSV), MEMS devices, power devices, and RFID. The MEMS device segment is anticipated to grow the fastest, with a CAGR exceeding 8% during the forecast period. This growth is fueled by the increasing need for MEMS devices in numerous applications. As MEMS technology becomes more integral to modern electronics due to its compact size and versatility, manufacturers are investing in advanced wafer processing technologies to ensure high yields and optimal performance.
| Market Scope | |
|---|---|
| Start Year | 2023 |
| Forecast Year | 2024-2032 |
| Start Value | $710.3 Million |
| Forecast Value | $1.25 Billion |
| CAGR | 7% |
North America accounted for over 25% of the global thin wafer processing and dicing equipment market in 2023. The region, particularly the United States, is witnessing significant growth due to the rising demand for advanced semiconductor technologies. This trend is evident across various industries, with a strong emphasis on miniaturization to enhance performance and efficiency. Furthermore, government initiatives aimed at boosting domestic semiconductor manufacturing in response to global supply chain challenges are accelerating investments in wafer processing technologies. This growth trajectory is also supported by the increasing adoption of cutting-edge applications that necessitate high-performance, compact chips, all of which benefit from advanced thin wafer processing solutions.
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Market scope & definitions
- 1.2 Base estimates & calculations
- 1.3 Forecast calculations
- 1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
- 1.4.2.1 Paid sources
- 1.4.2.2 Public sources
Chapter 2 Executive Summary
- 2.1 Industry synopsis, 2021-2032
Chapter 3 Industry Insights
- 3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
- 3.2 Supplier landscape
- 3.3 Profit margin analysis
- 3.4 Key news & initiatives
- 3.5 Regulatory landscape
- 3.6 Impact forces
- 3.6.1 Growth drivers
- 3.6.1.1 Rising demand for miniaturized electronic devices
- 3.6.1.2. Expansion of 5 G and IoT applications
- 3.6.1.3 Increased use of advanced semiconductor materials
- 3.6.1.4 Growth in automotive electronics and EVs
- 3.6.2 Industry pitfalls & challenges
- 3.6.2.1 High costs of advanced dicing equipment
- 3.6.2.2 Increased fragility of thinned wafers
- 3.6.1 Growth drivers
- 3.7 Growth potential analysis
- 3.8 Porter's analysis
- 3.9 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
- 4.1 Introduction
- 4.2 Company market share analysis
- 4.3 Competitive positioning matrix
- 4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Equipment Type, 2021-2032 (USD Million)
- 5.1 Key trends
- 5.2 Thinning equipment
- 5.3 Dicing equipment
- 5.3.1 Blade dicing
- 5.3.2 Laser dicing
- 5.3.3 Stealth dicing
- 5.3.4 Plasma dicing
Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million)
- 6.1 Key trends
- 6.2 Less than 4 inch
- 6.3 5 inch and 6 inch
- 6.4 8 inch
- 6.5 12 inch
Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)
- 7.1 Key trends
- 7.2 CMOS image sensors
- 7.3 Memory and logic (TSV)
- 7.4 MEMS device
- 7.5 Power device
- 7.6 RFID
- 7.7 Others
Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)
- 8.1 Key trends
- 8.2 Consumer electronics
- 8.3 Automotive
- 8.4 Telecommunications
- 8.5 Healthcare
- 8.6 Aerospace & defense
- 8.7 Industrial
- 8.8 Others
Chapter 9 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)
- 9.1 Key trends
- 9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
- 9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Russia
- 9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 Australia
- 9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.6 MEA
- 9.6.1 South Africa
- 9.6.2 Saudi Arabia
- 9.6.3 UAE
Chapter 10 Company Profiles
- 10.1 Advanced Dicing Technologies
- 10.2 ASMPT
- 10.3 AXUS TECHNOLOGY
- 10.4 Citizen Chiba Precision Co., Ltd.
- 10.5 DISCO Corporation
- 10.6 Dynatex International
- 10.7 EV Group (EVG)
- 10.8 HANMI Semiconductor
- 10.9 Han's Laser Technology Co., Ltd.
- 10.10 KLA Corporation
- 10.11 Lam Research Corporation
- 10.12 Loadpoint Ltd.
- 10.13 Modutek Corporation
- 10.14 NeonTech Co.,Ltd.
- 10.15 Panasonic Connect Co., Ltd.
- 10.16 Plasma-Therm
- 10.17 SPTS Technologies Ltd.
- 10.18 Suzhou Delphi Laser Co., Ltd.
- 10.19 Synova SA
- 10.20 Tokyo Electron Limited
- 10.21 TOKYO SEIMITSU CO., LTD (Accretech)
