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PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1577036

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PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1577036

Wi-Fi Chipset Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032

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PAGES: 270 Pages
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The Global Wi-Fi Chipset Market, valued at USD 22.99 billion in 2023, is projected to grow at a CAGR of over 4.3% from 2024 to 2032. The IoT revolution drives this market, with smart devices like home automation systems, health monitoring devices, industrial sensors, and smart appliances increasing the demand for robust Wi-Fi connectivity. These devices depend on Wi-Fi chipsets for reliable, high-speed communication and seamless network integration. The expansion of IoT ecosystems necessitates advanced chipsets to handle increased data traffic and numerous connected devices, fueling innovation and market growth. Additionally, the demand for low-power, high-efficiency chipsets for diverse IoT applications further accelerates market development.

The overall Wi-Fi chipset industry is classified based on standards, band, MIMO configuration, application, and region.

Market segmentation based on band includes single, dual, and tri-band categories. In 2023, the dual-band segment dominated, capturing over 85% of the market share. The dual-band Wi-Fi chipset market has surged due to its dual-frequency operation on both 2.4 GHz and 5 GHz bands, enhancing connectivity and minimizing interference. Innovations in dual-band technology are on the rise, with chipsets now boasting superior data rates and energy efficiency. Such advancements are crucial for applications, from high-definition streaming to smart home devices, solidifying the dual-band chipsets' role in modern, high-performance networks and boosting demand across both consumer and enterprise sectors.

Market segmentation by application includes smartphones, tablets, desktop PCs, laptops, connected home devices, and others. From 2024 to 2032, connected home devices are projected to be the fastest-growing segment, boasting a CAGR of over 10%. In the realm of connected home devices, Wi-Fi chipsets play a vital role in linking smart gadgets, from thermostats and security cameras to lighting systems. These chipsets guarantee stable, high-speed connections, facilitating seamless control via centralized hubs or mobile applications. Their performance is crucial for the overall efficiency and reliability of smart home ecosystems. As smart home technology advances, the demand for sophisticated Wi-Fi chipsets intensifies.

In 2023, the Asia Pacific region commanded a dominant share of over 40%, a position it is expected to maintain throughout the forecast period. The Wi-Fi chipset market in Asia-Pacific is surging, fueled by rising smartphone adoption, expanding smart home ecosystems, and escalating demands for internet connectivity. Leading the charge are nations like China, Japan, and India, bolstered by substantial investments in IoT technologies and 5G infrastructure, driving the demand for advanced Wi-Fi chipsets. The region's diverse consumer base, coupled with a thriving landscape of tech startups, is spurring both innovation and competition in the market.

Product Code: 4849

Table of Contents

Chapter 1 Scope and Methodology

  • 1.1 Market scope and definition
  • 1.2 Base estimates and calculations
  • 1.3 Forecast parameters
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Technology and innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news and initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
  • 3.8 Growth drivers
    • 3.8.1 Increasing IoT adoption
    • 3.8.2 Advancements in Wi-Fi technology
    • 3.8.3 Expansion of smart devices
    • 3.8.4 Rise in remote work and e-learning
    • 3.8.5 5G integration
  • 3.9 Industry pitfalls and challenges
    • 3.9.1 Security concerns
    • 3.9.2 Market saturation and competition
  • 3.10 Growth potential analysis
  • 3.11 Porter's analysis
  • 3.12 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Estimates and Forecast, By Band, 2021 - 2032 (USD Million and Units)

  • 5.1 Key trends
  • 5.2 Single
  • 5.3 Dual
  • 5.4 Tri band

Chapter 6 Market Estimates and Forecast, By MIMO Configuration, 2021 - 2032 (USD Million and Units)

  • 6.1 Key trends
  • 6.2 SU-MIMO
  • 6.3 MU-MIMO
    • 6.3.1 1x1 MU-MIMO
    • 6.3.2 2x2 MU-MIMO
    • 6.3.3 3x3 MU-MIMO
    • 6.3.4 4x4 MU-MIMO
    • 6.3.5 8x8 MU-MIMO

Chapter 7 Market Estimates and Forecast, By Standards, 2021 - 2032 (USD Million and Units)

  • 7.1 Key trends
  • 7.2 IEEE 802.11ay
  • 7.3 IEEE 802.11ad
  • 7.4 IEEE 802.11ax (Wi-Fi 6 and Wi-Fi 6E)
  • 7.5 IEEE 802.11ac
  • 7.6 IEEE 802.11n (SB and DB)
  • 7.7 IEEE 802.11b/G

Chapter 8 Market Estimates and Forecast, By Application, 2021 - 2032 (USD Million and Units)

  • 8.1 Key trends
  • 8.2 Smartphones
  • 8.3 Tablet
  • 8.4 Desktop PC
  • 8.5 Laptop
  • 8.6 Connected home devices
  • 8.7 Others

Chapter 9 Market Estimates and Forecast, By Region, 2021 - 2032 (USD Million and Units)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 Saudi Arabia
    • 9.6.3 South Africa
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 Broadcom
  • 10.2 ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD
  • 10.3 HiSilicon
  • 10.4 I and C Technology
  • 10.5 Infineon Technologies
  • 10.6 Intel Corporation
  • 10.7 MediaTek, Inc.
  • 10.8 Microchip Technology Inc.
  • 10.9 MORSE MICRO
  • 10.10 Newracom
  • 10.11 NXP Semiconductors
  • 10.12 ON Semiconductors
  • 10.13 PERASO TECHNOLOGIES INC.
  • 10.14 Qualcomm Technologies, Inc.
  • 10.15 Realtek Semiconductor Corp.
  • 10.16 Renesas Electronics Corporation
  • 10.17 Samsung Electronics Co., Ltd.
  • 10.18 Silicon Laboratories
  • 10.19 STMicroelectronics N.V.
  • 10.20 Telit
  • 10.21 Texas Instruments Incorporated.
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