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PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1532611

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PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1532611

Multi-layer Ceramic Capacitor Market - By Type (General Purpose, Array, Megacap, Serial Design), By Dielectric Type (Medium (100 V-630 V), High (1,000 V-Above)), By End Use & Forecast, 2024 - 2032

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PAGES: 250 Pages
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Multi-layer Ceramic Capacitor Market size will expand at over 13% CAGR from 2024 to 2032, led by the increasing launches and technological advancements. These capacitors are gaining prominence as new technologies are emerging to cater to the demand for more compact and efficient electronic components.

Advancements in multi-layer ceramic capacitor (MLCC) technology are leading to higher capacitance and improved performance in smaller packages for accommodating the needs of modern electronic devices. Researchers and manufacturers are also working on integrating advanced materials and manufacturing techniques to meet the evolving requirements of various applications. For instance, in July 2023, Kyocera introduced a new multilayer ceramic capacitor in the EIA 0201 size to offer enhanced performance and compactness in addressing the growing demand for smaller, high-capacity components in advanced electronic devices.

The overall market is segregated into type, dielectric type, rated voltage, end-use, and region.

Based on type, the MLCC market value from the serial design segment is estimated to rise at substantial rate from 2024 to 2032, due to the increasing need for optimizing performance by aligning multiple capacitors in series. This design approach is enabling higher voltage ratings and improved reliability in various electronic applications. The serial configuration is helping to manage power distribution more effectively and enhance the durability of electronic circuits.

Multi-layer ceramic capacitor industry from the electronics end-use segment is anticipated to expand at substantial CAGR through 2032, owing to the surging requirement to provide reliable and compact solutions for various applications in electronics sector. These capacitors are helping to improve the performance and efficiency of electronic devices through their ability to handle high capacitance and voltage in a small footprint. MLCCs are also integrated into a wide range of consumer electronics, automotive systems, and communication devices to further enhance their capabilities.

Regionally, the North America multi-layer ceramic capacitor market size may depict robust growth between 2024 and 2032, on account of the stringent regulatory standards and evolving consumer preferences for enhanced features. Several developers and manufacturers in the region are working on innovations to meet the regulatory demands and consumer expectations for advanced features for supporting the development of more sophisticated electronic devices and systems.

Product Code: 9671

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Demand for consumer electronics
      • 3.8.1.2 Rapid advancements in the IoT and connectivity
      • 3.8.1.3 5G network deployment
      • 3.8.1.4 Miniaturization and increased functionality
      • 3.8.1.5 Emerging applications in renewable energy
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 Supply chain challenges
      • 3.8.2.2 Lead times and capacity constraints
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 General purpose
  • 5.3 Array
  • 5.4 Megacap
  • 5.5 Serial design

Chapter 6 Market Estimates & Forecast, By Dielectric Type, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Class I
  • 6.3 Class II
  • 6.4 Others class II

Chapter 7 Market Estimates & Forecast, By Rated Voltage, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Low (Up to 50V)
  • 7.3 Medium (100 V-630 V)
  • 7.4 High (1,000 V-Above)

Chapter 8 Market Estimates & Forecast, By End-use, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Automotive
  • 8.3 Electronics
  • 8.4 Telecommunication
  • 8.5 Industrial equipment
  • 8.6 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 South Africa
    • 9.6.3 Saudi Arabia
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 Darfon Electronics Corp Murata Manufacturing Co., Ltd.
  • 10.2 Samsung Electro-Mechanics (SEM)
  • 10.3 TDK Corporation
  • 10.4 Taiyo Yuden Co., Ltd.
  • 10.5 AVX Corporation
  • 10.6 KEMET Corporation
  • 10.7 Vishay Intertechnology, Inc.
  • 10.8 Kyocera Corporation
  • 10.9 Wurth Elektronik GmbH & Co. KG
  • 10.10 Yageo Corporation
  • 10.11 Johanson Technology Inc.
  • 10.12 Holy Stone Enterprise Co., Ltd.
  • 10.13 Fenghua Advanced Technology Holding Co., Ltd.
  • 10.14 NIC Components Corp.
  • 10.15 Tai-I Electric Wire & Cable Co., Ltd.
Have a question?
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Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

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Christine Sirois

Manager - Americas

+1-860-674-8796

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