PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1528972
PUBLISHER: Global Market Insights Inc. | PRODUCT CODE: 1528972
SiC-on-Insulator (SiCOI) Film Market - By Substrate, By Wafer Size, By Technology, By Application & Forecast, 2024 - 2032
SiC-on-Insulator (SiCOI) film market size is estimated to register over 90% CAGR from 2024 to 2032, driven by increasing adoption in the semiconductor and electronics industries. For instance, in October 2023, Soitec opened a new production facility for silicon carbide chips for electric vehicles. It also claimed that its patented manufacturing technology allowed the more frequent use of SiC substrates for significantly reducing CO2 emissions from wafer manufacturing. SiCOI films offer superior electrical and thermal properties compared to traditional silicon-based substrates, making them ideal for high-performance applications in power electronics, RF devices, and sensors. This capability is particularly advantageous in sectors demanding compact, energy-efficient solutions, such as electric vehicles, renewable energy systems, and telecommunications.
The scalability and cost-effectiveness of SiCOI film production are also improving the advancements in manufacturing techniques like epitaxial growth and wafer bonding. These developments lower production costs and expand the feasibility of integrating SiC materials into mainstream semiconductor fabrication processes. The increasing adoption of wide bandgap materials to address challenges in power management and energy efficiency will also drive market growth.
The overall industry is classified into substrate, wafer size, technology, application, and region.
In terms of application, the SiC-on-insulator film market from the automotive segment is anticipated to witness substantial growth through 2032 due to the increasing demand for high-efficiency power electronics in electric and hybrid vehicles. These films by leveraging superior electrical properties offer significant advantages in power conversion and management systems within automotive applications.
Based on technology, the SiCOI film market from the smart cut segment will generate notable revenue during 2024-2032 owing to its robust role in enabling precise and scalable manufacturing processes. Smart cut technology involves the transfer of ultra-thin SiC layers onto an insulating substrate, such as silicon dioxide, using ion implantation and wafer bonding techniques. This method also enables the production of SiCOI films with tailored thickness and properties while optimizing performance in high-frequency and high-power electronic devices.
Asia Pacific SiC-on-insulator film industry is slated to depict a decent growth rate through 2032. This is attributed to rapid industrialization and urbanization, leading to increased demand for advanced electronic devices and infrastructure. Government initiatives promoting renewable energy adoption and electric vehicle manufacturing in countries like China, Japan, and South Korea are accelerating the demand for SiCOI films, which help improve energy efficiency and performance in several applications.
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Market scope & definition
- 1.2 Base estimates & calculations
- 1.3 Forecast calculation
- 1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
- 1.4.2.1 Paid sources
- 1.4.2.2 Public sources
Chapter 2 Executive Summary
- 2.1 SiC-on-Insulator (SiCOI) Film industry 360º synopsis, 2021 - 2032
- 2.2 Business trends
- 2.2.1 Total Addressable Market (TAM), 2024-2032
Chapter 3 Industry Insights
- 3.1 Industry ecosystem analysis
- 3.2 Vendor matrix
- 3.3 Profit margin analysis
- 3.4 Technology & innovation landscape
- 3.5 Patent analysis
- 3.6 Key news and initiatives
- 3.7 Regulatory landscape
- 3.8 Impact forces
- 3.8.1 Growth drivers
- 3.8.1.1 Increasing demand for high-power electronics
- 3.8.1.2 Growing adoption in automotive and aerospace industries
- 3.8.1.3 Advancements in semiconductor manufacturing technologies
- 3.8.1.4 Rising interest in energy-efficient devices
- 3.8.1.5. Expansion of the 5 G telecommunications infrastructure
- 3.8.2 Industry pitfalls & challenges
- 3.8.2.1 Limited availability of reliable data sources
- 3.8.2.2 Technical complexities affecting manufacturing scalability
- 3.8.1 Growth drivers
- 3.9 Growth potential analysis
- 3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
- 3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
- 4.1 Introduction
- 4.2 Company market share analysis
- 4.3 Competitive positioning matrix
- 4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Substrate, 2021 - 2032 (USD Million)
- 5.1 Key trends
- 5.2 Silicon (Si) Substrate
- 5.3 Silicon Carbide (SiC) Substrate
- 5.4 Sapphire substrate
- 5.5 Other
Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021 - 2032 (USD Million)
- 6.1 Key trends
- 6.2. 100 mm (4-Inch) Wafers
- 6.3. 150 mm (6-Inch) Wafers
- 6.4. 200 mm (8-Inch) Wafers
- 6.5. 300 mm (12-Inch) Wafers
Chapter 7 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million)
- 7.1 Key trends
- 7.2 Power electronics
- 7.3 Aerospace and Defense
- 7.4 Automotive
- 7.5 Consumer electronics
- 7.6 Others
Chapter 8 Market Estimates & Forecast, By Technology, 2021 - 2032 (USD Million)
- 8.1 Key trends
- 8.2 Smart cut technology
- 8.3 Grinding/Polishing/Bonding technology
Chapter 9 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)
- 9.1 Key trends
- 9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
- 9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Rest of Europe
- 9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 ANZ
- 9.4.6 Rest of Asia Pacific
- 9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Rest of Latin America
- 9.6 MEA
- 9.6.1 UAE
- 9.6.2 South Africa
- 9.6.3 Saudi Arabia
- 9.6.4 Rest of MEA
Chapter 10 Company Profiles
- 10.1 Coherent Corp.
- 10.2 Isabers Materials (China)
- 10.3 MTI Corporation (U.S.)
- 10.4 NGK Insulators, Ltd. (Japan)
- 10.5 Precision Micro-Optics Inc.
- 10.6 Resonac Holdings Corporation
- 10.7 Sicc Co., Ltd.
- 10.8 Sicoxs Corporation (Japan)
- 10.9 Sicrystal GmbH
- 10.10 SK Siltron Co., Ltd.
- 10.11 Soitec (France)
- 10.12 Sumitomo Electric Industries, Ltd.
- 10.13 Wolfspeed, Inc.
- 10.14 Xiamen Powerway Advanced Material Co., Ltd.
