Radiation Hardened Electronics Market - By Component, By Manufacturing Technique, By Type, By Application, Forecast 2024

Description

Radiation Hardened Electronics Market will witness over 5% CAGR from 2024 to 2032 due to increasing satellites and space exploration missions. According to the World Economic Forum, the government will increase spending on space exploration by $9 billion in 2022, accounting for 45 percent of defense spending, up from 41% last year. As space agencies and private companies expand their presence beyond Earth's atmosphere, demand for electronic components that can withstand the rigors of space radiation is increasing.

Radiation hardened electronics play a key role in ensuring the reliability and longevity of critical systems on spacecraft, satellites, and deep space probes. From communications satellites to scientific instruments exploring distant planets, the need for flexible electronics solutions is driving innovation and investment in radiation-hardening technologies.

Increasing the use of satellites for communication and scientific purposes is an important market trend. As the demand for satellite-based communications and research grows, so does the need for electronic components that can withstand the harsh radiation of space. This trend encourages the development and deployment of radiation hardened electronics that ensure the reliability and longevity of satellite systems. With advances in satellite technology enabling more complex missions and applications, the radiation hardened electronics market has seen increased demand for flexible electronics solutions tailored to the needs of satellite deployments in the commercial and scientific sectors.

The Radiation Hardened Electronics industry is classified based on component, manufacturing technology, type, application, and region.

The radiation hardened by design segment will grow rapidly through 2032, as RHBD offers better radiation resistance due to design principles and material selection. By incorporating radiation-tolerant features into the architecture of electronic components at the design stage, RHBD technologies reduce exposure to radiation-induced failures and ensure continuous performance in harsh environments. From integrated circuits to microprocessors, RHBD methodologies enable the production of electronic systems that can withstand the rigors of space exploration, defense operations, and nuclear applications.

The military and defense segment will continue to grow at a steady pace through 2032, as, from communication systems and radar equipment to missile guidance systems and unmanned aerial vehicles (UAVs), military operations rely heavily on electronic components that can withstand radiation in hostile environments. As defense agencies prioritize critical reliability and durability, the demand for radiation hardened electronics in military applications is increasing significantly, driving innovation and technological advancement in the defense industry.

Europe Radiation Hardened Electronics industry will gain significant strength through 2032, driven by the convergence of technological expertise, strategic partnerships, and regulatory initiatives. With Europe's important role in space exploration, defense technology, and nuclear research, the region offers fertile ground for the development and deployment of radiation hardened electronics. Countries such as France, Germany, and the UK are leading innovations in radiation protection technologies, leveraging their research capacity and industrial infrastructure to pioneer electrical flexibility.

Product Code: 8918

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Radiation hardened electronics industry 360 degree synopsis, 2018 - 2032
2.2 Business trends
- 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Increasing space exploration missions and satellite deployments
  - 3.8.1.2 Demand from military and defense applications
  - 3.8.1.3 Rising use in nuclear power plants and reactors
  - 3.8.1.4 Expansion of the aerospace and aviation industries
  - 3.8.1.5 Growing need for reliable communication systems in harsh environments
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 High development and manufacturing costs
  - 3.8.2.2 Limited availability of specialized components
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Component, 2018 - 2032 (USD Million)

5.1 Key trends
5.2 Integrated circuits (ICs)
5.3 Processors & controllers
5.4 Power management
5.5 Memory

Chapter 6 Market Estimates & Forecast, By Manufacturing Technique, 2018 - 2032 (USD Million)

6.1 Key trends
6.2 Radiation hardening by design (RHBD)
6.3 Radiation hardening by process (RHBP)

Chapter 7 Market Estimates & Forecast, By Type, 2018 - 2032 (USD Million)

7.1 Key trends
7.2 Custom made
7.3 Commercial-off-the-shelf (COTS)

Chapter 8 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

8.1 Key trends
8.2 Aerospace
8.3 Medical
8.4 Military & defense
8.5 Nuclear power plant
8.6 Others

Chapter 9 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Rest of Europe
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 ANZ
- 9.4.6 Rest of Asia Pacific
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Rest of Latin America
9.6 MEA
- 9.6.1 UAE
- 9.6.2 South Africa
- 9.6.3 Saudi Arabia
- 9.6.4 Rest of MEA

Chapter 10 Company Profiles

10.1 Advanced Micro Devices, Inc.
10.2 Analog Devices, Inc.
10.3 BAE Systems
10.4 Cobham Limited
10.5 Everspin Technologies Inc.
10.6 GSI Technology, Inc.
10.7 Honeywell International Inc.
10.8 Infineon Technologies AG
10.9 Mercury Systems, Inc.
10.10 Microchip Technology Inc.
10.11 Micropac Industries, Inc.
10.12 PCB Piezotronics, Inc.
10.13 Renesas Electronics Corporation
10.14 Semiconductor Components Industries, LLC
10.15 Space Micro, Inc.
10.16 STMicroelectronics
10.17 Teledyne Technologies Inc.
10.18 Texas Instruments Incorporated
10.19 Triad Semiconductor
10.20 TTM Technologies, Inc.

Radiation Hardened Electronics Market - By Component, By Manufacturing Technique, By Type, By Application, Forecast 2024 - 2032