Advanced Packaging Market - By Packaging Type (Flip-chip, Fan-in Wafer Level Packaging, Embedded-die, Fan-out, 2.5 Dimensional/3 Dimensional), By Application (Consumer Electronics, Automotive, Industrial, Healthcare, A&D) & Forecast, 2024

Description

List of Tables

Global Advanced Packaging Market will witness over 10% CAGR between 2024 and 2032 as a result of rising company launches at leading industry events. These events serve as platforms for companies to showcase their latest innovations in packaging technology, including advanced materials, designs, and manufacturing processes.

For instance, in February 2024, Sarcina Technology, a leading provider of Application Specific Advanced Packaging (ASAP) Services, announced that it is set to introduce its WIPO service at the Chiplet Summit. WIPO, or wafer-in, product-out, streamlined packaging, testing, and production processes, reducing costs associated with maintaining dedicated hardware teams. WIPO encompassed various stages, including wafer bumping, package design, chip assembly, and final test, serving as the cornerstone for the emerging Application Specific Advanced Package (ASAP) Service in the semiconductor industry.

With a focus on sustainability, efficiency, and product protection, these innovations cater to the evolving needs of various sectors, such as food and beverage, healthcare, and electronics. As companies vie to stay ahead in a competitive market, the demand for advanced packaging solutions continues to rise, driving market growth and innovation.

The overall Advanced Packaging Market share is classified based on the packaging type, healthcare, and region.

Embedded-die segment will undergo significant development from 2024 to 2032. Embedded-die packaging integrates semiconductor chips directly into substrates or packages, offering compact, high-performance solutions for various applications. With the proliferation of smartphones, IoT devices, and automotive electronics requiring miniaturized and efficient components, embedded-die packaging emerges as a key solution. Its advantages include improved performance, reduced footprint, and enhanced thermal management. As industries seek to optimize space and functionality in electronic devices, the demand for embedded-die packaging solutions continues to grow, driving market expansion and innovation.

Advanced packaging market size from the healthcare segment will register a noteworthy CAGR from 2024 to 2032. As medical devices become more complex and compact, advanced packaging technologies play a crucial role in ensuring reliability, miniaturization, and performance. Advanced packaging solutions cater to the needs of various healthcare applications, including implantable devices, diagnostic equipment, and drug delivery systems. With a focus on precision and reliability in medical electronics, the demand for advanced packaging continues to rise, driving innovation and market growth to meet the evolving needs of the healthcare industry.

Europe advanced packaging industry will showcase a commendable CAGR from 2024 to 2032. With a diverse range of industries, including automotive, healthcare, and electronics, seeking advanced packaging solutions, Europe presents a lucrative market opportunity. The region's emphasis on sustainability and efficiency further fuels demand for advanced packaging technologies that optimize space, enhance performance and reduce environmental impact.

As European industries continue to prioritize innovation, the demand for advanced packaging solutions remains strong, driving market growth and development. For instance, in December 2023, Amkor Technology planned to build a cutting-edge packaging and testing facility in Peoria, Arizona, investing approximately US$2 billion and hiring about 2,000 employees upon completion. Expected to be the largest outsourced advanced packaging facility in the US, Amkor aimed to enhance America's semiconductor supply chain.

Product Code: 4831

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Advanced packaging market 360 degree synopsis, 2018 - 2032
2.2 Business trends
2.3 Regional trends
2.4 Packaging type trends
2.5 Application trends

Chapter 3 Advanced Packaging Industry Insights

3.1 Impact of the Russia-Ukraine war
3.2 Industry ecosystem analysis
3.3 Vendor matrix
3.4 Profit margin analysis
3.5 Technology & innovation landscape
3.6 Patent analysis
3.7 Key news and initiatives
- 3.7.1 Partnership/Collaboration
- 3.7.2 Merger/Acquisition
- 3.7.3 Investment
- 3.7.4 Packaging type launch & innovation
3.8 Regulatory landscape
3.9 Impact forces
- 3.9.1 Growth drivers
  - 3.9.1.1 Rising demand for advanced and miniaturized semiconductor components in consumer electronics
  - 3.9.1.2. Penetration of 5G technology
  - 3.9.1.3 Increasing complexities of automotive electronics
  - 3.9.1.4 Increasing trend toward IoT and AI technology around the globe
  - 3.9.1.5. Development of 2.5 D/3 D technology
- 3.9.2 Industry pitfalls & challenges
  - 3.9.2.1 High cost and complexity
  - 3.9.2.2 Challenges in thermal management
3.10 Growth potential analysis
3.11 Porter's analysis
3.12 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share, 2023
4.3 Competitive analysis of major market players, 2023
- 4.3.1 Amkor Technology
- 4.3.2 ASE Group
- 4.3.3 JCET Group Co., Ltd.
- 4.3.4 Powertech Technology Inc.
- 4.3.5 Taiwan Semiconductor Manufacturing Company Limited
- 4.3.6 TongFu Microelectronics Co., Ltd.
- 4.3.7 UTAC
4.4 Competitive positioning matrix, 2023
4.5 Strategic outlook matrix, 2023

Chapter 5 Advanced Packaging Market Estimates & Forecast, By Packaging Type, 2018 - 2032 (USD Million)

5.1 Key trends, by packaging type
5.2 Flip-chip
5.3 Fan-in WLP
5.4 Embedded-die
5.5 Fan-out
5.6 2.5D/3D

Chapter 6 Advanced Packaging Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

6.1 Key trends, by application
6.2 Consumer electronics
6.3 Automotive
6.4 Industrial
6.5 Healthcare
6.6 Aerospace & defense
6.7 Others

Chapter 7 Advanced Packaging Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

7.1 Key trends, by region
7.2 North America
- 7.2.1 U.S.
- 7.2.2 Canada
7.3 Europe
- 7.3.1 UK
- 7.3.2 Germany
- 7.3.3 France
- 7.3.4 Italy
- 7.3.5 Spain
- 7.3.6 Rest of Europe
7.4 Asia Pacific
- 7.4.1 China
- 7.4.2 India
- 7.4.3 Japan
- 7.4.4 South Korea
- 7.4.5 ANZ
- 7.4.6 Rest of Asia Pacific
7.5 Latin America
- 7.5.1 Brazil
- 7.5.2 Mexico
- 7.5.3 Rest of Latin America
7.6 MEA
- 7.6.1 Saudi Arabia
- 7.6.2 UAE
- 7.6.3 South Africa
- 7.6.4 Rest of MEA

Chapter 8 Company Profiles (Business Overview, Financial Overview, Packaging type Landscape, Strategic Outlook, SWOT Analysis)

8.1 Amkor Technology
8.2 ASE Group
8.3 Brewer Science, Inc.
8.4 China Wafer Level CSP Co., Ltd.
8.5 Chipbond Technology Corporation
8.6 ChipMOS Technologies Inc.
8.7 Deca Technologies
8.8 Greatek Electronics Inc.
8.9 JCET Group Co., Ltd.
8.10 Powertech Technology Inc.
8.11 Sanmina Corporation
8.12 SFA Semicon
8.13 Siliconware Precision Industries Co., Ltd.
8.14 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
8.15 Tongfu Mikcroelectronics Co. Ltd.
8.16 UTAC