PUBLISHER: Frost & Sullivan | PRODUCT CODE: 1630572
PUBLISHER: Frost & Sullivan | PRODUCT CODE: 1630572
Innovations in Substrate, Process, Testing, and Inspection Equipment are Critical to Overcome Cost, Yield, and Reliability Challenges
Wide-bandgap (WBG) semiconductors-primarily consisting of silicon carbide (SiC) and gallium nitride (GaN)-based devices-are a sub-set of compound semiconductors. WBG semiconductors are at an early stage of commercialization and exhibit significant growth projections over the next 10 years.
For this reason, various integrated device manufacturers (IDMs) and fabless manufacturers are adopting SiC and GaN devices for product development. They are engaging with customers across verticals such as automotive, industrial, communications, and consumer to capitalize on this high-growth opportunity. That said, the projected growth in the WBG semiconductor market during the next 10 years can only happen if companies overcome the challenges associated with cost, yield, and reliability through research and innovation efforts.
This study identifies the spectrum of challenges the WBG semiconductor market faces and rates the top 3 challenges that impact market growth the most. It identifies the main innovations in the WBG ecosystem (which are in different stages of commercialization) that will overcome these challenges and accelerate market growth for WBG semiconductor devices. The innovations are focused more on the ecosystem than the devices themselves.
The study focuses less on market performance and quantitative aspects and more on identifying the levers that will accelerate market growth. For more information on market estimates and forecasts, Frost & Sullivan has published reports on compound semiconductors (KAA8), power semiconductors (K9EC), and WBG semiconductors (K877).