Growth Opportunities in Semiconductors for 6G Wireless Technology

Description

AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology

Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.

The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components' performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.

Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.

To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.

This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
It does not aim to provide a quantitative overview of the market potential.

Product Code: K979-30

Strategic Imperatives

Why is it Increasingly Difficult to Grow?
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis in Semiconductors for 6G-6G Overview

Primary Findings
Scope of Analysis
6G-Overview of Cellular Evolution and Desired 6G Network Characteristics
Why 6G? Why Now?
6G Roadmap to Commercialization
6G-Integrated Technology Roadmap
Growth Drivers
Growth Restraints
6G Ecosystem

Growth Opportunity Analysis in Semiconductors for 6G-AI-Processor Semiconductors

Why are AI Processors Critical for 6G?
Infusing AI into RAN for the Future of Telecom-Open Radio Access Network (ORAN) Infrastructure
AI in 6G Network Infrastructure-Emergence of AI-RAN
Edge Computing
Edge AI in 6G-Potential Application Universe
Primary Focus Areas for Edge AI Chipsets in the 6G Network
Understanding Current Processors to Evaluate 6G Requirements- Primary Companies and Products
AI in 6G-How to Determine Compute Performance Requirements
The Coming of Silicon Photonics (SiPh)
Regional Competency of AI Semiconductors for 6G Networking
Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology
Notable Investments in AI by Semiconductor Companies
The AI-Semiconductor Ecosystem for 6G
Expected Research Efforts in the Next 5 Years
AI in 6G-The Significance of Cybersecurity and Sustainability

6G Semiconductor Growth Opportunity-RF Semiconductors

RF Semiconductors in 6G-Enabling 100 GHz and Higher Operational Frequencies
RF Semiconductors in 6G-Process Node Trajectory
RF Semiconductors in 6G-Exploring Materials Beyond Si
RF Semiconductors in 6G-Exploring Materials Beyond Si: GaN
RF Semiconductors in 6G-Exploring Materials Beyond Si: InP
RF Semiconductors in 6G-Advanced Packaging Technologies
RF Semiconductors in 6G-GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology
RF in 6G-Primary Products Enabling the Research and Development of 6G
RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced
RF in 6G-Primary Regional Initiatives and Investments
RF in 6G-Ultra-wide Bandgap (UWBG) Semiconductors
The AI Semiconductor Ecosystem in 6G

Growth Opportunity Universe-6G Research Initiatives by Region

6G Research and Collaboration Initiatives by Primary Regions
6G Patent Applications by Region (2019-2021)

Growth Opportunity Universe-Key Applications and Context of the imperative for 6G Semiconductors

Semiconductors for 6G-Context of Opportunities by Primary Applications: AVs and Smart Manufacturing
Semiconductors for 6G-Context of Opportunity by Primary Applications: Healthcare and Smart Cities
Application Profile-Industry Metaverse
Application Profile-Mobility

Growth Opportunity Universe

Growth Opportunity 1-Cognitive Intelligence at the Core and Edge
Growth Opportunity 2-Application-specific Chipsets
Growth Opportunity 3-Leverage Government Funding and Policies
List of Exhibits
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