Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Description

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.

This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.

The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.

Product Code: K901-26

Strategic Imperatives

Why is it Increasingly Difficult to Grow?
The Strategic Imperative 8™
The Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) Industry
Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis

Scope of Analysis
Classification of Semiconductor Packaging Technology
Key Participants in the OSAT Value Chain
Segmentation by End Users
The Rise of Chiplets
Packaging Trends in Wide-bandgap (WBG) Semiconductors
Hybrid Bonding
Key Competitors
Growth Metrics
Growth Drivers
Growth Driver Analysis
Growth Restraints
Growth Restraint Analysis
Forecast Assumptions
Revenue Forecast
Revenue Forecast by End User
Revenue Forecast by Packaging Type
Revenue Forecast by Interconnect Type
Packaging Interconnect Technologies-Global Market Share of OSATs, IDMs, and Foundries
Revenue Forecast by Region
OSAT Facilities by Region
Revenue Forecast Analysis
Pricing Trends and Forecast Analysis
Competitive Environment
Revenue Share
Revenue Share Analysis
OSAT Landscape-Capex Trend
OSAT Landscape-Analysis of Top 25 Pure-play OSATs
Notable ATMP Investments Globally
ATMP Investment Landscape, 2020-2023
OSATs' Recipe for Success
Analysis of Competition
M&A Analysis

Indian OSAT Landscape and Opportunities

Indian Semiconductor Industry
Indian Semiconductor Policy
Revenue Forecast-Indian ATMP Landscape
Revenue Forecast Analysis-ATMP Market
Indian OSAT Opportunities
Indian ATMP Landscape-Current Scenario
India ATMP Capabilities
Developments in the Indian ATMP Sector

AI in OSATs

Key Pillars for Implementation of Smart Manufacturing in OSATs
AI/ML in Semiconductors Packaging and Testing
Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape
Notable AI/ML Solutions for ATMP-Impact Analysis Dashboard
Case #1: End-to-End Software Solution for Efficient OSAT Operations
Case #2: Exensio OSAT by PDF Solutions

Growth Opportunity Analysis-Mobile & Consumer Electronics

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
AiP for 5G
Evolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network Generations
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Telecom & Infrastructure

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Global 5G Adoption-2021 and 2025
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Automotive & Transportation

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Competitive Environment
Revenue Share

Growth Opportunity Analysis-Others

Growth Metrics
Revenue Forecast
Revenue Forecast by Interconnect Type
Revenue Forecast by Packaging Type
Revenue Forecast by Region
Forecast Analysis
Competitive Environment
Revenue Share

Sustainability in OSATs

Top 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular Economy
Semiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to Decarbonization
Key Sustainability Factors for OSATs
UN SDGs
Amkor Technology
ASE Technology

Growth Opportunity Universe

Growth Opportunity 1: Validation and Verification for HI
Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency
Growth Opportunity 3: Strategic Upstream and Downstream Efforts
Growth Opportunity 4: 3D Printing in Semiconductor Packaging
Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks
Growth Opportunity 6: M&As

Next Steps

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