3D IC and 2.5D IC Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa)

Description

In a ground breaking report released by Fairfield Market Research, the global 3D IC and 2.5D IC market is poised for unprecedented growth, projected to reach a staggering valuation of US$ 1.8 trillion by the year 2031. With an astonishing compound annual growth rate (CAGR) of 30.0% expected from 2024 to 2031, this forecast underscores the remarkable trajectory of the semiconductor industry towards advanced packaging solutions.

Rising Demand Fueled by Technological Advancements

The surge in demand for 3D IC and 2.5D IC is attributed to the relentless advancement in technologies such as high-performance computing, 5G networks, and artificial intelligence. These cutting-edge semiconductor devices offer unparalleled power efficiency, performance, bandwidth, and latency improvements, meeting the escalating requirements of modern electronic equipment.

Miniaturization Driving Market Growth

A significant trend propelling the demand for 3D IC and 2.5D IC is the miniaturization of electrical equipment. With electronic devices becoming smaller, portable, and highly advanced, especially among millennials, the need for compact and technologically advanced components is more pronounced than ever. As a result, sales of 3D IC and 2.5D IC mirror the rapid growth of the global electronics market.

Asia Pacific Emerges as a Key Market Hub

Asia Pacific stands out as a significant player in the global 3D IC and 2.5D IC market, expected to maintain a substantial market share throughout the forecast period. The region's burgeoning demand for these advanced semiconductor solutions in electronics and automotive sectors is driving market expansion, with notable contributions from industry leaders such as Taiwan Semiconductor Manufacturing Company.

Regional Insights: Driving Forces and Market Projections

United States:

The USA stands out as a prominent market for 3D IC and 2.5D IC due to several factors. There is a growing demand for cutting-edge semiconductor devices driven by the increasing need for electronics, remote work patterns, digitization efforts, and the steady surge in semiconductor device demand. Modern packaging techniques such as 3D IC and 2.5D IC offer the processing power and form factor required for today's digital world, which further boosts their adoption in the USA.

United Kingdom:

In the United Kingdom, the 3D IC and 2.5D IC industry are expected to witness significant growth, supported by a CAGR of 25.9%. The adoption of 2.5D and 3D packaging technology is increasing in the UK semiconductor industry due to its various advantages. These technologies enable the integration of different components onto separate dies, offering flexibility in implementing designs such as heterogeneous system-on-chip (SoC) designs.

China:

China's 3D IC and 2.5D IC industry are poised for substantial growth, with an anticipated valuation of a significant figure by 2031. Leading manufacturers in China are focusing on expanding their portfolios and production capacities to meet the growing demand. Investments in facilities expansion, like Jiangsu Changjiang Electronics' initiative, are aimed at providing better services to the global customer base.

Japan:

Japan's 3D IC and 2.5D IC industry are expected to see robust growth driven by factors such as the rising penetration of consumer IoT devices, increasing use of smart devices and wearables, and expansion of the smartphone industry. These trends are boosting the demand for semiconductor devices, thereby driving the sales of 3D IC and 2.5D IC in Japan.

South Korea:

South Korea is experiencing high demand for 3D IC and 2.5D IC, supported by a CAGR of 28.3%. The proliferation of 5G-related products like mobile terminals, network infrastructure, and networking equipment contributes to this growth. Additionally, the adoption of electric and driverless vehicles, along with the expansion of data centers, further fuels the demand for advanced semiconductors in South Korea.

Challenges and Opportunities

While the market for 3D IC and 2.5D IC is poised for substantial growth, challenges such as high unit costs, low volumes, and implementation concerns persist. However, the relentless focus on research and development, coupled with innovations in product development, presents significant opportunities for market players to overcome these challenges and further drive market expansion.

Competitive Analysis

Some key companies are:

Taiwan Semiconductor Manufacturing Company
Intel Corporation
United Microelectronics Corporation
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
ST Microelectronics NV
Broadcom Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd
Toshiba Corporation

3D IC and 2.5D IC Market Segmentation

By Packaging Technology

3D Wafer-level Chip-scale Packaging
3D Through-silicon Via
2.5D

By Application

Logic
Imaging and Optoelectronics
Memory
Micro-electromechanical Systems/Sensors
Light-emitting Diode
Power
Analog & Mixed Signal
Radio Frequency
Photonics

By End User

Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices

By Region

North America
Latin America
Europe
Asia Pacific
Middle East and Africa

1. Executive Summary

1.1. Global 3D IC and 2.5D IC Market Snapshot
1.2. Future Projections
1.3. Key Market Trends
1.4. Regional Snapshot, by Value, 2023
1.5. Analyst Recommendations

2. Market Overview

2.1. Market Definitions and Segmentations
2.2. Market Dynamics
- 2.2.1. Drivers
- 2.2.2. Restraints
- 2.2.3. Market Opportunities
2.3. Value Chain Analysis
2.4. Porter's Five Forces Analysis
2.5. COVID-19 Impact Analysis
- 2.5.1. Supply
- 2.5.2. Demand
2.6. Impact of Ukraine-Russia Conflict
2.7. Economic Overview
- 2.7.1. World Economic Projections
2.8. PESTLE Analysis

3. Global 3D IC and 2.5D IC Market Outlook, 2018 - 2031

3.1. Global 3D IC and 2.5D IC Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 3.1.1. Key Highlights
  - 3.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 3.1.1.2. 3D Through-silicon Via
  - 3.1.1.3. 2.5D
3.2. Global 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
- 3.2.1. Key Highlights
  - 3.2.1.1. Logic
  - 3.2.1.2. Imaging and Optoelectronics
  - 3.2.1.3. Memory
  - 3.2.1.4. Micro-electromechanical Systems/Sensors
  - 3.2.1.5. Light-emitting Diode
  - 3.2.1.6. Power
  - 3.2.1.7. Analog & Mixed Signal
  - 3.2.1.8. Radio Frequency
  - 3.2.1.9. Photonics
3.3. Global 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 3.3.1. Key Highlights
  - 3.3.1.1. Consumer Electronics
  - 3.3.1.2. Telecommunication
  - 3.3.1.3. Industry Sector
  - 3.3.1.4. Automotive
  - 3.3.1.5. Military and Aerospace
  - 3.3.1.6. Smart Technologies
  - 3.3.1.7. Medical Devices
3.4. Global 3D IC and 2.5D IC Market Outlook, by Region, Value (US$ trillion), 2018 - 2031
- 3.4.1. Key Highlights
  - 3.4.1.1. North America
  - 3.4.1.2. Europe
  - 3.4.1.3. Asia Pacific
  - 3.4.1.4. Latin America
  - 3.4.1.5. Middle East & Africa

4. North America 3D IC and 2.5D IC Market Outlook, 2018 - 2031

4.1. North America 3D IC and 2.5D IC Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 4.1.1. Key Highlights
  - 4.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 4.1.1.2. 3D Through-silicon Via
  - 4.1.1.3. 2.5D
4.2. North America 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
- 4.2.1. Key Highlights
  - 4.2.1.1. Logic
  - 4.2.1.2. Imaging and Optoelectronics
  - 4.2.1.3. Memory
  - 4.2.1.4. Micro-electromechanical Systems/Sensors
  - 4.2.1.5. Light-emitting Diode
  - 4.2.1.6. Power
  - 4.2.1.7. Analog & Mixed Signal
  - 4.2.1.8. Radio Frequency
  - 4.2.1.9. Photonics
4.3. North America 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 4.3.1. Key Highlights
  - 4.3.1.1. Food & Beverages
  - 4.3.1.2. Floral
  - 4.3.1.3. Textile
  - 4.3.1.4. Healthcare
  - 4.3.1.5. Others
- 4.3.2. BPS Analysis/Market Attractiveness Analysis
4.4. North America 3D IC and 2.5D IC Market Outlook, by Country, Value (US$ trillion), 2018 - 2031
- 4.4.1. Key Highlights
  - 4.4.1.1. U.S. 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 4.4.1.2. U.S. 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 4.4.1.3. U.S. 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 4.4.1.4. Canada 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 4.4.1.5. Canada 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 4.4.1.6. Canada 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
- 4.4.2. BPS Analysis/Market Attractiveness Analysis

5. Europe 3D IC and 2.5D IC Market Outlook, 2018 - 2031

5.1. Europe 3D IC and 2.5D IC Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 5.1.1. Key Highlights
  - 5.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 5.1.1.2. 3D Through-silicon Via
  - 5.1.1.3. 2.5D
5.2. Europe 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
- 5.2.1. Key Highlights
  - 5.2.1.1. Logic
  - 5.2.1.2. Imaging and Optoelectronics
  - 5.2.1.3. Memory
  - 5.2.1.4. Micro-electromechanical Systems/Sensors
  - 5.2.1.5. Light-emitting Diode
  - 5.2.1.6. Power
  - 5.2.1.7. Analog & Mixed Signal
  - 5.2.1.8. Radio Frequency
  - 5.2.1.9. Photonics
5.3. Europe 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 5.3.1. Key Highlights
  - 5.3.1.1. Consumer Electronics
  - 5.3.1.2. Telecommunication
  - 5.3.1.3. Industry Sector
  - 5.3.1.4. Automotive
  - 5.3.1.5. Military and Aerospace
  - 5.3.1.6. Smart Technologies
  - 5.3.1.7. Medical Devices
- 5.3.2. BPS Analysis/Market Attractiveness Analysis
5.4. Europe 3D IC and 2.5D IC Market Outlook, by Country, Value (US$ trillion), 2018 - 2031
- 5.4.1. Key Highlights
  - 5.4.1.1. Germany 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.2. Germany 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.3. Germany 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.4. U.K. 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.5. U.K. 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.6. U.K. 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.7. France 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.8. France 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.9. France 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.10. Italy 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.11. Italy 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.12. Italy 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.13. Turkey 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.14. Turkey 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.15. Turkey 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.16. Russia 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.17. Russia 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.18. Russia 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 5.4.1.19. Rest of Europe 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 5.4.1.20. Rest of Europe 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 5.4.1.21. Rest of Europe 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
- 5.4.2. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific Cassava Starch Market Outlook, 2018 - 2031

6.1. Asia Pacific Cassava Starch Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 6.1.1. Key Highlights
  - 6.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 6.1.1.2. 3D Through-silicon Via
  - 6.1.1.3. 2.5D
6.2. Asia Pacific 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
- 6.2.1. Key Highlights
  - 6.2.1.1. Logic
  - 6.2.1.2. Imaging and Optoelectronics
  - 6.2.1.3. Memory
  - 6.2.1.4. Micro-electromechanical Systems/Sensors
  - 6.2.1.5. Light-emitting Diode
  - 6.2.1.6. Power
  - 6.2.1.7. Analog & Mixed Signal
  - 6.2.1.8. Radio Frequency
  - 6.2.1.9. Photonics
6.3. Asia Pacific 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 6.3.1. Key Highlights
  - 6.3.1.1. Consumer Electronics
  - 6.3.1.2. Telecommunication
  - 6.3.1.3. Industry Sector
  - 6.3.1.4. Automotive
  - 6.3.1.5. Military and Aerospace
  - 6.3.1.6. Smart Technologies
  - 6.3.1.7. Medical Devices
- 6.3.2. BPS Analysis/Market Attractiveness Analysis
6.4. Asia Pacific 3D IC and 2.5D IC Market Outlook, by Country, Value (US$ trillion), 2018 - 2031
- 6.4.1. Key Highlights
  - 6.4.1.1. China 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.2. China 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.3. China 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 6.4.1.4. Japan 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.5. Japan 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.6. Japan 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 6.4.1.7. South Korea 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.8. South Korea 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.9. South Korea 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 6.4.1.10. India 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.11. India 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.12. India 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 6.4.1.13. Southeast Asia 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.14. Southeast Asia 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.15. Southeast Asia 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 6.4.1.16. Rest of Asia Pacific 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 6.4.1.17. Rest of Asia Pacific 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 6.4.1.18. Rest of Asia Pacific 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
- 6.4.2. BPS Analysis/Market Attractiveness Analysis

7. Latin America 3D IC and 2.5D IC Market Outlook, 2018 - 2031

7.1. Latin America 3D IC and 2.5D IC Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 7.1.1. Key Highlights
  - 7.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 7.1.1.2. 3D Through-silicon Via
  - 7.1.1.3. 2.5D
7.2. Latin America 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
7.3. Latin America 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 7.3.1. Key Highlights
  - 7.3.1.1. Consumer Electronics
  - 7.3.1.2. Telecommunication
  - 7.3.1.3. Industry Sector
  - 7.3.1.4. Automotive
  - 7.3.1.5. Military and Aerospace
  - 7.3.1.6. Smart Technologies
  - 7.3.1.7. Medical Devices
- 7.3.2. BPS Analysis/Market Attractiveness Analysis
7.4. Latin America 3D IC and 2.5D IC Market Outlook, by Country, Value (US$ trillion), 2018 - 2031
- 7.4.1. Key Highlights
  - 7.4.1.1. Brazil 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 7.4.1.2. Brazil 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 7.4.1.3. Brazil 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 7.4.1.4. Mexico 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 7.4.1.5. Mexico 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 7.4.1.6. Mexico 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 7.4.1.7. Argentina 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 7.4.1.8. Argentina 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 7.4.1.9. Argentina 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 7.4.1.10. Rest of Latin America 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 7.4.1.11. Rest of Latin America 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 7.4.1.12. Rest of Latin America 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
- 7.4.2. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa 3D IC and 2.5D IC Market Outlook, 2018 - 2031

8.1. Middle East & Africa 3D IC and 2.5D IC Market Outlook, by Packaging Technology, Value (US$ trillion), 2018 - 2031
- 8.1.1. Key Highlights
  - 8.1.1.1. 3D Wafer-level Chip-scale Packaging
  - 8.1.1.2. 3D Through-silicon Via
  - 8.1.1.3. 2.5D
8.2. Middle East & Africa 3D IC and 2.5D IC Market Outlook, by Application, Value (US$ trillion), 2018 - 2031
- 8.2.1. Key Highlights
  - 8.2.1.1. Logic
  - 8.2.1.2. Imaging and Optoelectronics
  - 8.2.1.3. Memory
  - 8.2.1.4. Micro-electromechanical Systems/Sensors
  - 8.2.1.5. Light-emitting Diode
  - 8.2.1.6. Power
  - 8.2.1.7. Analog & Mixed Signal
  - 8.2.1.8. Radio Frequency
  - 8.2.1.9. Photonics
8.3. Middle East & Africa 3D IC and 2.5D IC Market Outlook, by End User, Value (US$ trillion), 2018 - 2031
- 8.3.2. BPS Analysis/Market Attractiveness Analysis
8.4. Middle East & Africa 3D IC and 2.5D IC Market Outlook, by Country, Value (US$ trillion), 2018 - 2031
- 8.4.1. Key Highlights
  - 8.4.1.1. GCC 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 8.4.1.2. GCC 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 8.4.1.3. GCC 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 8.4.1.4. South Africa 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 8.4.1.5. South Africa 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 8.4.1.6. South Africa 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 8.4.1.7. Egypt 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 8.4.1.8. Egypt 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 8.4.1.9. Egypt 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 8.4.1.10. Nigeria 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 8.4.1.11. Nigeria 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 8.4.1.12. Nigeria 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
  - 8.4.1.13. Rest of Middle East & Africa 3D IC and 2.5D IC Market by Packaging Technology, Value (US$ trillion), 2018 - 2031
  - 8.4.1.14. Rest of Middle East & Africa 3D IC and 2.5D IC Market by Application, Value (US$ trillion), 2018 - 2031
  - 8.4.1.15. Rest of Middle East & Africa 3D IC and 2.5D IC Market by End User, Value (US$ trillion), 2018 - 2031
- 8.4.2. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape

9.1. By End User vs by Application Heat map
9.2. Manufacturer vs by Application Heatmap
9.3. Company Market Share Analysis, 2023
9.4. Competitive Dashboard
9.5. Company Profiles
- 9.5.1. Taiwan Semiconductor Manufacturing Company Limited
  - 9.5.1.1. Company Overview
  - 9.5.1.2. Product Portfolio
  - 9.5.1.3. Financial Overview
  - 9.5.1.4. Business Strategies and Development
- 9.5.2. Samsung Electronics Co., Ltd.
  - 9.5.2.1. Company Overview
  - 9.5.2.2. Product Portfolio
  - 9.5.2.3. Financial Overview
  - 9.5.2.4. Business Strategies and Development
- 9.5.3. Toshiba Corp.
  - 9.5.3.1. Company Overview
  - 9.5.3.2. Product Portfolio
  - 9.5.3.3. Financial Overview
  - 9.5.3.4. Business Strategies and Development
- 9.5.4. ASE Group
  - 9.5.4.1. Company Overview
  - 9.5.4.2. Product Portfolio
  - 9.5.4.3. Financial Overview
  - 9.5.4.4. Business Strategies and Development
- 9.5.5. Amkor Technology
  - 9.5.5.1. Company Overview
  - 9.5.5.2. Product Portfolio
  - 9.5.5.3. Financial Overview
  - 9.5.5.4. Business Strategies and Development
- 9.5.6. United Microelectronics Corp.
  - 9.5.6.1. Company Overview
  - 9.5.6.2. Product Portfolio
  - 9.5.6.3. Financial Overview
  - 9.5.6.4. Business Strategies and Development
- 9.5.7. STMicroelectronics Nv
  - 9.5.7.1. Company Overview
  - 9.5.7.2. Product Portfolio
  - 9.5.7.3. Financial Overview
  - 9.5.7.4. Business Strategies and Development
- 9.5.8. Broadcom Ltd.
  - 9.5.8.1. Company Overview
  - 9.5.8.2. Product Portfolio
  - 9.5.8.3. Financial Overview
  - 9.5.8.4. Business Strategies and Development
- 9.5.9. Intel Corporation
  - 9.5.9.1. Company Overview
  - 9.5.9.2. Product Portfolio
  - 9.5.9.3. Financial Overview
  - 9.5.9.4. Business Strategies and Development
- 9.5.10. Jiangsu Changjiang Electronics Technology Co, Ltd.
  - 9.5.10.1. Company Overview
  - 9.5.10.2. Product Portfolio
  - 9.5.10.3. Financial Overview
  - 9.5.10.4. Business Strategies and Development
- 9.5.11. Texas Instruments
  - 9.5.11.1. Company Overview
  - 9.5.11.2. Product Portfolio
  - 9.5.11.3. Financial Overview
  - 9.5.11.4. Business Strategies and Development

10. Appendix

10.1. Research Methodology
10.2. Report Assumptions
10.3. Acronyms and Abbreviations